德森印刷机说明书之操作手册-4d1321fc284ac850ac024234 - 第22页
深圳德森精密设备有限公司 Shenzhen Desen Pre cision Machine Co., Ltd. - 22 - a nnealing under a r oom tempera ture of 25 ℃ o r so (the s pe cific u se sha ll b e s ubject to the use direction). T he te mperature of s o lder paste s h…
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
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网框中心对准箭头指示处
Screen frame
’
s
center align with the position pointed by arrow
图 3-1
Figure 3-1
注： 本机器推荐用户使用规格为 650 × 550mm 的网框（见《用户手册》附 1 推荐使用的网 框
尺寸） 。
Note:
it
is recommended to use a screen frame of 650 × 550mm for this printing machine (see Annex
1 of User Manual for the recommended dimensions of screen frame).
3.2.2
3.2.2
3.2.2
3.2.2
锡膏准备
3.2.2
3.2.2
3.2.2
3.2.2
Preparation
Preparation
Preparation
Preparation
of
of
of
of
solder
solder
solder
solder
paste
paste
paste
paste
1)
在 SMT 中，焊膏的选择是影响产品质量的关键因素之一。不同的焊膏决定了允许印 刷
的最高速度，焊膏的粘度、润湿性和金属粉粒大小等性能参数都会影响最后的印刷质
量。
1) In SMT, the choosing of solder paste is one of the key factors affecting the product quality.
D ifferent types of solder paste determine the greatest printing speed. T he viscosity, wetting
property , size of metallic particles and other performance parameters shall all affect the ultimate
printing quality;
2)
对焊膏的选择应根据清洗方式、元器件及电路板的可焊性、焊盘的镀层、元器件引脚
间距、用户的需求等综合起来考虑。
2) Solder paste shall be chosen based on an integral consideration of cleaning manner , the
solderability of components and circuit board , clad layer of bonding pad , pin space of components
and demand of customers;
3)
锡膏选定后，应根据所选锡膏的使用说明书要求使用。
3) After being chosen, solder paste shall be used in compliance with the requirements of
corresponding use direction;
4)
在使用之前必须搅拌均匀，直至锡膏成浓浓的糊状并用刮刀挑起能够很自然的分段落
下即可使用。
4) Before use, solder paste must be stirred evenly till
it
becomes pasty , can be stirred up with a
squeegee and drop very naturally;
5)
锡膏从冰柜中取出不能直接使用，必须在室温 25 ℃ 左右回温（具体使用根据说明书而
定） ；锡膏温度应保持与室温相同才可开瓶使用
5) Solder paste shall not be used instantly after being taken out from a deep freezer but receive
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 22 -
annealing under a room temperature of 25 ℃ or so (the specific use shall be subject to the use
direction). T he temperature of solder paste shall become the same as room temperature before
being decapped for use; and
6)
使用时应将锡膏均匀地刮涂在刮刀前面的模板上，且超出模板开口位置，保证刮刀运
动时能将锡膏通过网板开口印到 PCB 板的所有焊盘上。
6)
When in use, solder paste shall be evenly pasted on the formwork in front of the squeegee to
the position further than the formwork so that the squeegee in operation can print the solder
paste onto the screen
’
s
opening to all bonding pad s.
3.2.3
3.2.3
3.2.3
3.2.3
PCB
PCB
PCB
PCB
定位调试
3.2.3
3.2.3
3.2.3
3.2.3
Positioning
Positioning
Positioning
Positioning
and
and
and
and
debugging
debugging
debugging
debugging
of
of
of
of
PCB
PCB
PCB
PCB
board
board
board
board
1.
打开机器主电源开关。
Turns on the main power switch of the machine .
2.
进入印刷机主画面。
Enters the main screen of print ing machine.
3.
单击 [ 归零 ] 菜单，让机器运动部件回到原点部位。
Click [ Reset ] in the menu, lets the machine movement part return to default.
4.
单击主菜单栏 [ 文件 / 新建 ] ，并键入新建文件名。
Click [document/new], and enters the newly built filename
5.
单击主工具栏 1 “ 生产编辑 ” 图标，在输入密码后进入 [ 生产编辑 ] 中，进行 PCB 设置
，
输入所要生产的 PCB 板名称、型号、 长、宽、 厚和运输速度参数， 再单击 “ 宽度调 节
”
将运输导轨自动调到适宜所要生产的 PCB
宽度。
（详见第四章介绍）
C lick the main toolbar 1 “ production edit ” icon, enters password and start [production
edit], start PCB setup , inputs PCB board name, model number , l e ng th , width,
thick ness and transporting speed , click “ width adjustment ” to adjust the conveyer
automatically. (See Chapter IV for details)
6.
在生产编辑菜单中输入所要生产 PCB 板的各项参数，如刮刀速度、压力、脱模长度 和
速度、清洗方式、时间间隔和速度以及取象方式等。
Inputs PCB board parameter s into the menu of production edit , such as the
squeegee speed, the pressure, the length and speed of demoulding , the cleaning
method , the rate and time interval of cleaning, image taking manner etc.
7.
单击 “ 挡板气缸移动 ” 使 CCD 移动到停板位置，进行 PCB 定位校正。
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
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Click “ board stop cylinder moves ” causes CCD to move to PCB stop position, start
PCB positioning adjustment.
1) 单击 “ 刮刀后退
”
，将刮刀移动到后限位处；
1) Click “ Squeegee back ” , moves the squeegee to back position ;
1)
再单击 “ 移动 ” 将挡板气缸移动到 PCB 停板位置，此时将 PCB 放到运输导轨进板
入口处， 再将 “ 停板气缸开关
”
打开， 停板气缸工作即气缸轴向下运动到停板位
置；
2) Then click “ Move ” to move the baffle cylinder to the position where the PCB board parks.
A
t
this time, put PCB board
at
the board entrance of transport guide rail and switch on “ Board
stop cylinder switch ” . T he board stop cylinder will work, namely, the cylinder shaft will move
downwards to the board stop position;
3) 打开 “ 运输开关
”
，将 PCB 板送到停板气缸位置，眼睛观察 PCB 板是否停在运输 导
轨的中间，如 PCB 板不在运输导轨中间，则需要调整停板气缸位置 —— 修改停板气缸
X ， Y 坐标， X 往 ← 为减 → 为加， Y 往位 ↑ 为减 往 ↓ 为加，直到 PCB 板位置合适；
3) Switch on “ Transport switch ” to send PCB board to the board stop cylinder position.
V
isually observe PCB board to see whether
it
stops
at
the middle of transport guide rail, if not,
its position shall be adjusted by changing the X and Y coordinates of the board stop cylinder:
going leftward along axis X will decrease the value and rightward will increase the value;
going upward along axis Y will decrease the value and downward will increase the value. T he
change shall not stop until the PCB board is
at
a proper position;
4) 再将 “ 运输开关 ” 关闭，同时打开 “ PCB 吸板阀
”
；关闭 “ 停板气缸
”
；打开 “ 平台 顶
板
”
开关， 工作台向上升起； 打开
“ 导轨夹紧
”
开关， 单击
“ CCD 回位
”
， 将 CCD Ca mera
回到原点位置；打开 [Z 轴上升 ] 将 PCB 板升到紧贴钢网板底面位置；
4) Then switch off “ Transport switch ” and switch on “ PCB board absorbing valve ”
at
the
same time; stop “ Board stop cylinder ” , switch on “ Platform crest slab ” switch to make the
workbench rise; switch on “ Guide rail clamping ” switch and click “ CCD return ” to restore
CCD Camera to the initial position; and open “ axis Z rise ” to make PCB board rise and firmly
lean on the bottom of screen;
5) 用眼睛观察网板与 PCB 板对准情况， 并用手移动调节网框、 定位夹紧装置使之与 P CB
板对准。
5) Visually observe the alignment condition of screen and PCB board and adjust the screen
frame and positioning and clamping devices with hand to make them align with PCB board;
6) 打开 “ 网框固定阀 ” 和 “ 网框夹紧阀
”
，将网框固定并夹紧；同时将机器上的网框 锁