德森印刷机说明书之操作手册-4d1321fc284ac850ac024234 - 第24页
深圳德森精密设备有限公司 Shenzhen Desen Pre cision Machine Co., Ltd. - 24 - 紧气缸用挡环固定及移动 Y 向定位挡住网框； 6) Switch o n “ S cr een frame s tanding va lve ” and “ S cre en fra me c lamping valve ” to f i x a nd clamp the s c reen f ram e. A…
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 23 -
Click “ board stop cylinder moves ” causes CCD to move to PCB stop position, start
PCB positioning adjustment.
1) 单击 “ 刮刀后退
”
，将刮刀移动到后限位处；
1) Click “ Squeegee back ” , moves the squeegee to back position ;
1)
再单击 “ 移动 ” 将挡板气缸移动到 PCB 停板位置，此时将 PCB 放到运输导轨进板
入口处， 再将 “ 停板气缸开关
”
打开， 停板气缸工作即气缸轴向下运动到停板位
置；
2) Then click “ Move ” to move the baffle cylinder to the position where the PCB board parks.
A
t
this time, put PCB board
at
the board entrance of transport guide rail and switch on “ Board
stop cylinder switch ” . T he board stop cylinder will work, namely, the cylinder shaft will move
downwards to the board stop position;
3) 打开 “ 运输开关
”
，将 PCB 板送到停板气缸位置，眼睛观察 PCB 板是否停在运输 导
轨的中间，如 PCB 板不在运输导轨中间，则需要调整停板气缸位置 —— 修改停板气缸
X ， Y 坐标， X 往 ← 为减 → 为加， Y 往位 ↑ 为减 往 ↓ 为加，直到 PCB 板位置合适；
3) Switch on “ Transport switch ” to send PCB board to the board stop cylinder position.
V
isually observe PCB board to see whether
it
stops
at
the middle of transport guide rail, if not,
its position shall be adjusted by changing the X and Y coordinates of the board stop cylinder:
going leftward along axis X will decrease the value and rightward will increase the value;
going upward along axis Y will decrease the value and downward will increase the value. T he
change shall not stop until the PCB board is
at
a proper position;
4) 再将 “ 运输开关 ” 关闭，同时打开 “ PCB 吸板阀
”
；关闭 “ 停板气缸
”
；打开 “ 平台 顶
板
”
开关， 工作台向上升起； 打开
“ 导轨夹紧
”
开关， 单击
“ CCD 回位
”
， 将 CCD Ca mera
回到原点位置；打开 [Z 轴上升 ] 将 PCB 板升到紧贴钢网板底面位置；
4) Then switch off “ Transport switch ” and switch on “ PCB board absorbing valve ”
at
the
same time; stop “ Board stop cylinder ” , switch on “ Platform crest slab ” switch to make the
workbench rise; switch on “ Guide rail clamping ” switch and click “ CCD return ” to restore
CCD Camera to the initial position; and open “ axis Z rise ” to make PCB board rise and firmly
lean on the bottom of screen;
5) 用眼睛观察网板与 PCB 板对准情况， 并用手移动调节网框、 定位夹紧装置使之与 P CB
板对准。
5) Visually observe the alignment condition of screen and PCB board and adjust the screen
frame and positioning and clamping devices with hand to make them align with PCB board;
6) 打开 “ 网框固定阀 ” 和 “ 网框夹紧阀
”
，将网框固定并夹紧；同时将机器上的网框 锁
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 24 -
紧气缸用挡环固定及移动 Y 向定位挡住网框；
6) Switch on “ Screen frame standing valve ” and “ Screen frame clamping valve ” to fix and
clamp the screen frame. A
t
the same time, fix the screen frame locking cylinder on the
machine firmly with a limit ring and cover the screen frame by moving the positioning device
of axis
Y;
7) 关闭 “ Z 轴上升
”
，使工作台回到取象位置；
7) Switch off “ Axis Z rise ” to make the workbench return to the image taking position; and
8) 单击 “ 标志点设置
”
，进入 “ 标志点采集 ” 对话框。
8) Click “ S ignalized point setting ” to enter the “ Signalized point collect ” dialog box .
8.
在 “ 标志点采集 ” 对话框中，进入标志点采集和 PCB 校正，完成 PCB 与网板位置视
觉校正并对准。
8. In the “ Signalized point collect ” dialog box , enter signalized point collection and PCB
calibration to finish the visual calibration and alignment of the positions of PCB board and screen;
9.
在 标志点设置 完后，单击 “ 标志点设置 ” 对话框中的 [ 确认 ] ，回到生产编辑窗口。
9. After the signalized point setting is done, click Enter in the “ S ignalized point setting ” dialog box
to return to the production editing window; and
10.
单击主工具栏中的 “ 文件 / 保存
”
，将此次 PCB 板的参数设置保存到新建的文件名下，
待开始生产时打开此档使用。
10. Click “ File/Save ” in the main tool bar to save the parameter setting of PCB board this time to a
newly created file which shall be opened for use after production is started.
注： 以上操作说明详见第四章介绍。
Note:
Note:
Note:
Note:
see
see
see
see
Chapter
Chapter
Chapter
Chapter
IV
IV
IV
IV
for
for
for
for
detailed
detailed
detailed
detailed
introduction
introduction
introduction
introduction
of
of
of
of
the
the
the
the
operations
operations
operations
operations
above.
above.
above.
above.
3.2.4
3.2.4
3.2.4
3.2.4
刮刀的安装
3.2.4
3.2.4
3.2.4
3.2.4
Installation
Installation
Installation
Installation
of
of
of
of
squeegee
squeegee
squeegee
squeegee
11.
打开机器前盖；
1. Open the front cover of machine;
12.
移动刮刀横梁到适合位置，将装有刮刀片的刮刀压板装到刮刀头上；
2. Move the squeegee beam to an appropriate position and install the squeegee pressure plate with
a squeegee blade to the squeegee head;
13.
刮刀行程的调整：打开工具栏 1 中 [ 参数设置 ] ，输入二级密码 ” printer9 ” 打开 [ 参数设置 ]
对话框，进行刮刀升降行程的设置；
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 25 -
3. Adjustment of squeegee
’
s
travel: open Parameter Setting in bar tool 1 and open its dialog box by
inputting the secondary password “ printer9 ” to carry out setting for the lift travel of squeegee; and
14.
刮刀行程调整以刮刀降到最低位置刀片正好压在钢网板上为宜。
4. Adjust the squeegee
’
s
travel till the squeegee blade just presses the steel screen when the
squeegee declines to the lowest position.
注意：
刮刀片安装前应检查其刀口是否平直，有无缺损。
Note: before installation of squeegee, inspect whether the knife-edge is straight and whether
it
has
damage.
3.2.5
3.2.5
3.2.5
3.2.5
刮刀压力和速度的选择
3.2.5
3.2.5
3.2.5
3.2.5
Choosing
Choosing
Choosing
Choosing
of
of
of
of
pressure
pressure
pressure
pressure
and
and
and
and
speed
speed
speed
speed
of
of
of
of
squeegee
squeegee
squeegee
squeegee
刮刀的压力及刮刀速度是钢网印刷中两个重要的工艺参数。
Squeegee pressure and speed are two key technological parameter
s
in the printing by means of
steel mesh.
刮刀速度： 选取的原则是刮刀的速度和锡膏的粘稠度及 PCB 板上 SMD 的最小引脚间距
有关，选择锡膏的粘稠度大，则刮刀的速度要低，反之亦然。对刮刀速度的选择，一般先从
较小压力开始试印，慢慢加大，直到印出好的焊膏为止。速度范围为 15 ～ 120 mm/s 。在印刷
细间距时应适当降低刮刀速度，一般为 15 ～ 30mm/s ，以增加锡膏在窗口处的停滞时间，从 而
增加 PCB 焊盘上的锡膏；印刷宽间距组件时速度一般为 30 ～ 12 0mm/s
。 （＞
0.5mm pitch 为宽
间距，＜ 0.5mm pitch 为细间距〕
Squeegee speed: the speed choosing principle is that squeegee speed is related to the viscosity
of solder paste and the minimum pin pitch of SMD on PCB board: larger viscosity of solder paste
corresponds to lower squeegee speed, vice versa . W hen choosing squeegee speed, trial printing
always starts from lower pressure, and then pressure increases gradually till good solder paste is
printed. Squeegee speed scope is 15 ～ 120 mm/s . In small pitch printing, the squeegee speed shall be
decreased appropriately to 15 ～ 30mm/s , in order to prolong the stagnation period of solder paste
at
the window and increase the solder paste left on PCB bonding pad. G enerally speaking, the wide
pitch printing needs a speed of 30 ～ 12 0mm/s (the pitch larger than 0.5mm pitch is wide pitch and
that smaller than 0.5mm pitch is small pitch).
本机器刮刀速度允许设置范围为 0 ～ 200 mm/s 。
The setting scope of squeegee speed of this printing machine is 0 ～ 200 mm/s .