德森印刷机说明书之操作手册-4d1321fc284ac850ac024234 - 第26页
深圳德森精密设备有限公司 Shenzhen Desen Pre cision Machine Co., Ltd. - 26 - 刮刀压力： 压力直接影响印刷效果，压力以保证印出的焊膏边缘清晰，表面平整，厚度 适宜为准。压力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连接，会产生桥接。因 此刮刀压力一般是设定为 0.5 ～ 10kg 。 Squee gee pressure: p ressure h as a d irect b ear…
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 25 -
3. Adjustment of squeegee
’
s
travel: open Parameter Setting in bar tool 1 and open its dialog box by
inputting the secondary password “ printer9 ” to carry out setting for the lift travel of squeegee; and
14.
刮刀行程调整以刮刀降到最低位置刀片正好压在钢网板上为宜。
4. Adjust the squeegee
’
s
travel till the squeegee blade just presses the steel screen when the
squeegee declines to the lowest position.
注意：
刮刀片安装前应检查其刀口是否平直，有无缺损。
Note: before installation of squeegee, inspect whether the knife-edge is straight and whether
it
has
damage.
3.2.5
3.2.5
3.2.5
3.2.5
刮刀压力和速度的选择
3.2.5
3.2.5
3.2.5
3.2.5
Choosing
Choosing
Choosing
Choosing
of
of
of
of
pressure
pressure
pressure
pressure
and
and
and
and
speed
speed
speed
speed
of
of
of
of
squeegee
squeegee
squeegee
squeegee
刮刀的压力及刮刀速度是钢网印刷中两个重要的工艺参数。
Squeegee pressure and speed are two key technological parameter
s
in the printing by means of
steel mesh.
刮刀速度： 选取的原则是刮刀的速度和锡膏的粘稠度及 PCB 板上 SMD 的最小引脚间距
有关，选择锡膏的粘稠度大，则刮刀的速度要低，反之亦然。对刮刀速度的选择，一般先从
较小压力开始试印，慢慢加大，直到印出好的焊膏为止。速度范围为 15 ～ 120 mm/s 。在印刷
细间距时应适当降低刮刀速度，一般为 15 ～ 30mm/s ，以增加锡膏在窗口处的停滞时间，从 而
增加 PCB 焊盘上的锡膏；印刷宽间距组件时速度一般为 30 ～ 12 0mm/s
。 （＞
0.5mm pitch 为宽
间距，＜ 0.5mm pitch 为细间距〕
Squeegee speed: the speed choosing principle is that squeegee speed is related to the viscosity
of solder paste and the minimum pin pitch of SMD on PCB board: larger viscosity of solder paste
corresponds to lower squeegee speed, vice versa . W hen choosing squeegee speed, trial printing
always starts from lower pressure, and then pressure increases gradually till good solder paste is
printed. Squeegee speed scope is 15 ～ 120 mm/s . In small pitch printing, the squeegee speed shall be
decreased appropriately to 15 ～ 30mm/s , in order to prolong the stagnation period of solder paste
at
the window and increase the solder paste left on PCB bonding pad. G enerally speaking, the wide
pitch printing needs a speed of 30 ～ 12 0mm/s (the pitch larger than 0.5mm pitch is wide pitch and
that smaller than 0.5mm pitch is small pitch).
本机器刮刀速度允许设置范围为 0 ～ 200 mm/s 。
The setting scope of squeegee speed of this printing machine is 0 ～ 200 mm/s .
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 26 -
刮刀压力： 压力直接影响印刷效果，压力以保证印出的焊膏边缘清晰，表面平整，厚度
适宜为准。压力太小，锡膏量不足，产生虚焊；压力太大，导致锡膏连接，会产生桥接。因
此刮刀压力一般是设定为 0.5 ～ 10kg 。
Squeegee pressure: pressure has a direct bearing on the printing effect.
A
proper pressure shall
guarantee clear edges, smooth surface and appropriate thickness of solder paste.
T
oo small pressure
will result in insufficient solder paste and further cold joints; and too large pressure will lead to
solder paste connection and further bridging . G enerally speaking, squeegee pressure is set during
0.5 ～ 10kg .
注：每增加或减小 1kg 刮刀行程 ± 0.4mm
Note: for the increment or decrease of 1kg, the squeegee travel will change by ± 0.4mm.
3.2.6
3.2.6
3.2.6
3.2.6
脱模速度和脱模长度
3.2.6
3.2.6
3.2.6
3.2.6
Speed
Speed
Speed
Speed
and
and
and
and
length
length
length
length
of
of
of
of
demoulding
demoulding
demoulding
demoulding
脱模速度： 指印刷后的基板脱离模板的速度，在焊膏与范本完全脱离之前，分离速度要
慢，待完全脱离后，基板可以快速下降。慢速分离有利于焊膏形成清晰边缘，对细间距的印
刷尤其重要。一般设定为 3mm/s ，太快易破坏锡膏形状。
Speed
Speed
Speed
Speed
of
of
of
of
demoulding
demoulding
demoulding
demoulding
:
:
:
:
it
refers to the speed for the printed base board to break away from
formwork. T he speed shall be slower before the thorough separation of solder paste and sample; and
the base board can decline quickly after the thorough separation. S lower separation is in favor of the
formation of clear edges, which is quite crucial to the small space printing. G enerally speaking, the
speed is set as 3mm/s . Excessively quick speed is prone to damage the solder paste shape.
本机器允许设置范围为 0 ～ 20mm/s 。
The setting scope of demoulding speed allowed by this printing machine is 0 ～ 20mm/s .
PCB
PCB
PCB
PCB
与范本的分离时间： 即印刷后的基板以脱板速度离开模板所需要的时间。 时间过
长，
易在范本底面残留焊膏，时间过短，不利于焊膏的站立。一般控制在 1 秒左右。
Separation time of PCB board and sample:
it
refers to the time for the printed base board to
break away from the formwork
at
the demoulding speed. E xcessively long time is prone to leave
solder paste on the sample bottom; and excessively short time results in poor standing of solder paste .
G enerally speaking, the time is controlled
at
1s or so.
本机器用脱模长度来控制此变量，一般设定为 0.5 ～ 2mm 。本机器允许设置范围为 0 ～
10mm 。
This printing machine controls this variable with demoulding length which is generally set as
深圳德森精密设备有限公司
Shenzhen Desen Precision Machine Co., Ltd.
- 27 -
0.5 ～ 2mm . The setting scope of demoulding length allowed by this printing machine is 0 ～ 10mm .
3.3
3.3
3.3
3.3
试生产
3.3
3.3
3.3
3.3
Trial
Trial
Trial
Trial
production
production
production
production
在以上准备工作做完以后，即可进行 PCB 板的试印刷。操作方法是：
Trial printing of PCB board can be practiced after the completion of the preparations above.
F ollowing are the operation method:
1.
单击主工具栏中的 [ 开始生产 ] 按钮并按照操作接口上对话框的提示进行操作， 完成一 块
PCB 板的自动印刷（详见第四章主工具栏的操作说明） 。
1. Click Start Production in the main tool bar and operate following the prompts in the dialog box
of operation interface to finish the automatic printing of a PCB board (see the operating
instructions in the main tool bar of Chapter IV for more details);
2.
如检测结果不符合质量要求，应重新进行编辑或输入印刷误差补偿值（详见第四章
4.4.14 “ 生产设置 ” 对话框；如检查结果满足质量要求，即可正式开始生产。
2. In the event that the inspection result dose not conform to the quality requirement,
it
is necessary
to edit or input the printing error compensation value again (see the dialog box of 4.4.14
“ Production Setting ” in Chapter IV); and in the event that the inspection result meets the quality
requirement, production can be started formally;
3.
锡膏印刷质量要求：
本机器设定锡膏厚度在 0.1 — 0.3mm 之间、 焊膏覆盖焊盘的面积在 75% 以上即满足质 量
要求。
3. Quality requirement for solder paste printing:
According to the settings, the printing machine
’
s
quality requirement can be met when the
solder paste thickness is during 0.1 — 0.3mm and the area of bonding pad covered by solder
paste is above 75%; and
4.
网板清洗品质检测：
本机器设定锡膏堵塞网板的覆盖面积超过 20% 会有报警提示，此时可单击主工具栏
中 [ 网板清洗 ] ，重新设置清洗方式或清洗的时间间隔等参数。
4. Quality inspection for the cleaning of screen:
As set, the printing machine will give alarm when the covered area of solder paste on the
screen is larger than 20%, click the Screen Cleaning in the main tool bar to reset parameters