Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow - 第16页

V oid R eduction in Bo tt om T erminat ed Com ponents Using V acuum Assist ed R ef lo w M. Holtzer[2 ], M. Barnes[1], D.W . Lee[1], D. Heller[1 ], T . Cucu[2], J. F udala[3], J. R enda[3], [1] Hell er Industries [2] Alp …

Figure 26

Figure 27: OSP surface finish.

Void Reduction in Bottom Terminated Components

Using Vacuum Assisted Reflow

M. Holtzer[2], M. Barnes[1], D.W. Lee[1], D. Heller[1], T. Cucu[2], J.

Fudala[3], J. Renda[3],

[1] Heller Industries

[2] Alpha Assembly Solutions

[3] MacDermid Enthone Electronic Solutions

Introduction

■ Several well known reflow profile process based techniques to reduce voiding

– Reflow Profile

– Peak Temperature

– Time Above Liquidus

■ None of them eliminate voiding

■ Study performed with Vacuum during reflow

■ High voiding paste/powder

■ 4 Surface Finishes, 2 vacuum pressures, 2 dwell times

■ Full factorial DOE using X-Ray inspection as response