Utah-94-721002-System-Manual.pdf - 第126页

mä~ëã~ä~Ä póëíÉãNMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual WARNING BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY . The etch cleaning should be performed each time the aggre…

System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ÄpóëíÉãNMM

WARNING

BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.

SKQKP= qÜêÉÉJjçåíÜäó=

1) Heater/chiller unit (on closed loop cooling systems).

If the condenser on the refrigeration circuit is air-cooled, it should be kept clean

enough to allow the free flow of air through it. Dirt can be removed by brushing or

vacuum cleaning.

Radio frequency radiation leakage:

Carry out the Radio Frequency radiation leakage tests as detailed in Appendix A

‘Measurement of RF and microwave emissions’.

SKQKQ= ^ååì~ääó=

1) Replace or clean the filters used in the compressed air supply system.

2) Replace the filters in the cooling water system.

3) Where closed loop (recirculating) water cooling systems are used, drain the system

and replace the coolant with Hexid A40 coolant (Oxford Plasma Technology Part No.

G/WTR/SUN/007 for 15 litres). This product is propylene glycol based and is pre-

diluted ready for use. Refer to Appendix S (Services Specifications for Plasmalab and

Ionfab systems) sub-section 2.1 for the warranty impact of not using this product.

SKQKR= `Ü~åÖáåÖ=íÜÉ=Ö~ë=ÄçííäÉë=

The operator should be aware that certain process parameters may change as the process gas

bottles pressure drops. For example, inert gas bottles which are normally filled to about 3000

psi, should be changed when the pressure drops below 400 psi. The inlet pressure should be

25 - 35 psia. Before disconnecting the empty bottle it is advisable to thoroughly evacuate the

gas line (by closing the gas bottle tap and pumping the line via the MFC). The line should

then be filled with dry N

if available.

Once the new bottle has been connected, monitor the vacuum integrity of the gas line before

opening the bottle by setting a high flow on the MFC, pumping the line thoroughly (via the

MFC), isolating the process chamber and noting the rate of pressure rise. An abnormally high

value (>2mTorr/minute) may indicate a leak in the gas line or the regulator to bottle

connection.

During normal operation the bottle pressure and line pressure on the cylinder regulator

should be regularly checked for loss of pressure during periods when the gas bottle tap is

turned off (during shut-down periods, overnight or over a weekend). This will indicate a leak

from the gas line or the regulator.

SKQKS= bíÅÜ=ÅäÉ~åáåÖ=

Where the system is used for Plasma Enhanced Chemical Vapour Deposition (PECVD), the

manual processing runs should be interspersed with etching processes as an efficient method

of cleaning the electrodes and chamber walls.

The etching processes may be optimised to suit particular processing requirements; however,

the following recommendations may be used as a starting point.

Maintenance

Printed: 22-Mar-06, 7:41 Page 6-7 of 22 UC Davis 94-721001 Issue 1: March 06

mä~ëã~ä~ÄpóëíÉãNMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual

WARNING

BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.

The etch cleaning should be performed each time the aggregate of the deposition layers

reaches ~10 microns.

The recommended clean process is:

8% or 20%, 700mTorr, 200W, ≥30 minutes

This process is optimised for rapid electrode cleaning. If it is found that the cleaning rate of

the chamber walls is too slow with the above process, then a low pressure process can also be

used:

8% or 20%, 350mTorr, 200W, ≥ 30minutes

The two processes can be alternated until the chamber and electrodes are etched clean.

A chamber conditioning step (using the normal deposition conditions in the empty chamber

to deposit 0.2-0.5µm) is recommended before processing wafers.

Maintenance

UC Davis 94-721001 Issue 1: March 06 Page 6-8 of 22 Printed: 22-Mar-06, 7:41

System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ÄpóëíÉãNMM

WARNING

BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.

SKR= VQJNMMJPJQN`=f`m=NUM=ÅÜ~ãÄÉê=âáí=ïáíÜ=Ö~íÉ=î~äîÉ=

WARNING

BEFORE ATTEMPTING ANY MAINTENANCE WORK ON THE PROCESS CHAMBER, IT

MUST BE SUBJECTED TO AT LEAST TWO VENT CYCLES SUBSEQUENT TO A

PROCESSING RUN.

SKRKN= jçåíÜäó=

1) Visually examine the interior of the chamber for contamination. Any necessary

cleaning should be carried out using a lint-free cloth moistened with Isopropyl

Alcohol (IPA). Tougher deposits can be removed using an abrasive pad first.

WARNING

ISOPROPYL ALCOHOL IS HIGHLY INFLAMMABLE (FLAMMABLE). DO NOT USE IT

NEAR A NAKED FLAME OR ENERGISED ELECTRICAL EQUIPMENT.

Examine the exterior of the chamber and its fittings for damage.

Examine the lid and seals for any damage or deterioration.

Examine the heating/cooling water flow system for signs of leakage.

Purge the process chamber for thirty minutes with dry nitrogen if IPA has been used for

cleaning.

Visually examine the top electrode for contamination. Any necessary cleaning should be

carried out using a lint-free cloth moistened with Isopropyl Alcohol (IPA).

Examine the top electrode and its integral gas and water fittings for damage.

Examine the seals for signs of deterioration.

SKRKO= lJêáåÖë=

The O-rings should be checked monthly but replaced as and when necessary.

Replacement O-rings should be constructed of Viton and pre-baked to 150°C to minimise the

risk of water vapour from the O-rings. The chamber lid O-ring should not need to be removed

unless it leaks. Clean the O-ring in situ using a lint-free cloth wetted with Isopropyl Alcohol.

To change the lid O-ring (use gloves):

1) Remove the O-ring, being careful not to damage the retaining groove.

2) Use a lint-free cloth and IPA to clean the O-ring sealing face on the chamber.

3) The new O-ring, cleaned with IPA, should be inserted with no twists. Stretch the O-

ring evenly as it is inserted to avoid local regions of stretching.

Maintenance

Printed: 22-Mar-06, 7:41 Page 6-9 of 22 UC Davis 94-721001 Issue 1: March 06