Utah-94-721002-System-Manual.pdf - 第145页

System Manual = lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~= qÉÅÜåçäçÖó= mä~ëã~ä~Ä N= fåíêçÇìÅíáçå= NKN= ^Äçìí=íÜáë=ÖìáÇÉ= This guide gives information about plasma processe s based on Oxford Instruments Plasm a Technology’s (OIPT) long e…

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Contents
1 Introduction......................................................................................................................................3
1.1 About this guide........................................................................................................................................3
1.2 Health and safety ......................................................................................................................................3
1.3 Terminology...............................................................................................................................................3
1.4 Document structure...................................................................................................................................3
2 The clean room.................................................................................................................................4
3 Processes...........................................................................................................................................5
3.1 General.......................................................................................................................................................5
3.2 RIE processes ..............................................................................................................................................6
3.2.1 RIE operating parameter ranges ....................................................................................................6
3.2.2 ICP operating parameter ranges ....................................................................................................7
3.2.3 Low-pressure strike facility .............................................................................................................8
3.2.4 DC bias..............................................................................................................................................8
3.2.4.1 Electronegative gas mixtures ......................................................................................................8
3.2.4.2 ICP sources ....................................................................................................................................9
3.2.4.3 DC bias polarity ............................................................................................................................9
3.2.4.4 DC bias control .............................................................................................................................9
3.2.4.5 DC bias reproducibility.................................................................................................................9
3.2.5 Arcing / pitting...............................................................................................................................10
3.2.6 Etch process chamber cleaning recipes........................................................................................10
3.2.7 Sample cooling / gluing.................................................................................................................11
3.2.8 Use of helium backing for effective process temperature control............................................12
3.2.8.1 Scope...........................................................................................................................................12
3.2.8.2 Purpose........................................................................................................................................12
3.2.8.3 Simple Method to check Helium backing.................................................................................12
3.2.9 Gases with low vapour pressure...................................................................................................14
3.2.10 Endpoint detection techniques ....................................................................................................14
3.2.10.1 Optical emission spectroscopy................................................................................................14
3.2.10.2 Laser interferometry...............................................................................................................15
3.2.10.3 Comparison of OES and laser endpoint techniques.............................................................15
3.2.10.4 Typical OES endpoint wavelengths........................................................................................16
3.2.10.5 Endpoint algorithm examples................................................................................................16
3.2.11 Gas calibration factors...................................................................................................................17
3.2.12 Exhaust emissions ..........................................................................................................................17
3.3 PECVD processes......................................................................................................................................18
3.3.1 PECVD operating parameter ranges ............................................................................................18
3.3.2 Low frequency matching ..............................................................................................................18
3.3.3 Premature flaking of chamber wall / showerhead material ......................................................19
3.3.4 PECVD particles..............................................................................................................................20
3.3.5 Enlarging of showerhead holes....................................................................................................21
3.3.6 Optical emission endpoint detector for chamber clean process................................................21
3.4 Process troubleshooting..........................................................................................................................23
3.4.1 Partial process failure....................................................................................................................23
3.4.1.1 Example problems......................................................................................................................23
3.4.1.2 Typical causes..............................................................................................................................23
3.4.2 Total process failure ......................................................................................................................23
3.4.2.1 Example problems......................................................................................................................23
3.4.2.2 Typical causes..............................................................................................................................23
4 Glossary of terms...........................................................................................................................25
5 OIPT locations worldwide..............................................................................................................30
Process Information (Information contained in this document is confidential)
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This guide gives information about plasma processes based on Oxford Instruments Plasma Technology’s
(OIPT) long experience in the semiconductor industry.
The scope of the guide is to provide a general introduction to process strategies and common process
problems, and has not been prepared for a particular version of hardware. The information is presented
to help users obtain optimum results from their specific process applications using Plasmalab systems.
To ensure that the information is as comprehensive and up-to-date as possible, it has been collated from
the following sources within OIPT:
In-house Applications Laboratory
1
(Process Lab reports, manager’s notes, customer feedback etc.).
Service Department (customer feedback, on-site experience etc.)
Technology Department (external information sources, design reviews, customer liaison, etc.)
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For health and safety information, see Section 1 (Health and Safety) of your Plasmalab system manual.
The customer is always responsible for:
(A) Delivery of process gases to the tool.
(B) Removal of exhaust gases from the tool.
(C) Maintaining a safe system of work in using and maintaining the tool.
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Material presented within this guide is aimed at users who have knowledge of plasma processes and the
terms used. However, if you come across an unfamiliar term, please refer to Section 4 (Glossary of Terms).
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The text in this document is logically divided into general information and specific information relevant
to the main process types (RIE and PECVD) and is generally applicable to all Plasmalab systems. Where
information is only applicable to a specific system, e.g. the Plasmalab 80 Plus RIE, this is stated.
1
The Application Laboratory is a purpose-built clean room facility housing examples of all of our
Plasmalab systems for research and development purposes. Each of these systems is installed in
accordance with our standard installation data documents supplied to customers for each system type.
Process Information (Information contained in this document is confidential)
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It is recommended that the OIPT process tool(s) are installed in a ‘clean room’ that meets the following
requirements:
• HEPA filtered air conditioning system, ideally laminar flow.
• Clean room walls/ceiling/flooring constructed from low particulate materials.
• Work areas shall remain free from waste materials.
• Covered waste containers shall be provided and emptied regularly.
• Gangways shall remain clear at all times.
• Access to H&S / COSHH data sheets shall be maintained at all times.
• Access to fire protection equipment shall be maintained at all times..
• Appropriate warning labels shall be provided where required.
• Samples shall be covered where practicable, particularly at the end of a working shift.
• No eating /drinking or smoking shall be permitted in the clan room/laboratory.
• Restricted access shall be maintained and a list of authorised persons shall be displayed outside
the processing areas. All other persons entering the area shall be escorted at all times.
• Items entering the processing area shall be inspected for cleanliness prior to entry.
• Non-essential items shall be precluded from the processing areas.
• Non-essential equipment or documentation shall not be stored on the floor area.
• Prior to entering the processing rooms, protective clothing shall be worn and shall constitute at
least over-shoes, coat and hat. These shall be made available within the laboratory access room
and will be replaced at a controlled frequency. A bench shall be provided to aid dressing with
protective clothing. The bench area immediately adjacent to the entry door to the laboratory shall
contain a tack mat to further prevent contamination ingress. Over shoes must not come into
contact with the area that has been used for day shoes.
• Cleaning of the processing areas shall be performed with suitably filtered vacuum equipment.
• A cleaning programme shall be established and evidence of compliance maintained for audit
purposes.
• All samples in current use or in temporary storage within the area shall be identified.
• Non-conforming samples shall be identified and physically segregated from acceptable work.
• Gloves shall be worn when handling unprotected samples.
• Unused tooling / equipment shall be stored in a manner to prevent damage and deterioration.
• It shall remain the responsibility of the users to ensure that tooling / equipment remains suitable
for its intended purpose.
For Health & Safety guidelines, refer to Section 1 (Health & Safety) of your Plasmalab system manual.
For services required, refer to OIPT Services Specifications and the relevant Installation Data document for
your Plasmalab system.
Process Information (Information contained in this document is confidential)
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