Utah-94-721002-System-Manual.pdf - 第146页
mä~ëã~ä~Ä = lñÑç êÇ=fåë íêìãÉåí ë=m ä~ë ã~=qÉÅÜåçäçÖó= System Manual O= qÜÉ=ÅäÉ~å=êççã= It is recommended that the OIPT process tool(s ) are installed in a ‘clean room’ that meets the following requirements: • HEPA filte…
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This guide gives information about plasma processes based on Oxford Instruments Plasma Technology’s
(OIPT) long experience in the semiconductor industry.
The scope of the guide is to provide a general introduction to process strategies and common process
problems, and has not been prepared for a particular version of hardware. The information is presented
to help users obtain optimum results from their specific process applications using Plasmalab systems.
To ensure that the information is as comprehensive and up-to-date as possible, it has been collated from
the following sources within OIPT:
In-house Applications Laboratory
1
(Process Lab reports, manager’s notes, customer feedback etc.).
Service Department (customer feedback, on-site experience etc.)
Technology Department (external information sources, design reviews, customer liaison, etc.)
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For health and safety information, see Section 1 (Health and Safety) of your Plasmalab system manual.
The customer is always responsible for:
(A) Delivery of process gases to the tool.
(B) Removal of exhaust gases from the tool.
(C) Maintaining a safe system of work in using and maintaining the tool.
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Material presented within this guide is aimed at users who have knowledge of plasma processes and the
terms used. However, if you come across an unfamiliar term, please refer to Section 4 (Glossary of Terms).
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The text in this document is logically divided into general information and specific information relevant
to the main process types (RIE and PECVD) and is generally applicable to all Plasmalab systems. Where
information is only applicable to a specific system, e.g. the Plasmalab 80 Plus RIE, this is stated.
1
The Application Laboratory is a purpose-built clean room facility housing examples of all of our
Plasmalab systems for research and development purposes. Each of these systems is installed in
accordance with our standard installation data documents supplied to customers for each system type.
Process Information (Information contained in this document is confidential)
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It is recommended that the OIPT process tool(s) are installed in a ‘clean room’ that meets the following
requirements:
• HEPA filtered air conditioning system, ideally laminar flow.
• Clean room walls/ceiling/flooring constructed from low particulate materials.
• Work areas shall remain free from waste materials.
• Covered waste containers shall be provided and emptied regularly.
• Gangways shall remain clear at all times.
• Access to H&S / COSHH data sheets shall be maintained at all times.
• Access to fire protection equipment shall be maintained at all times..
• Appropriate warning labels shall be provided where required.
• Samples shall be covered where practicable, particularly at the end of a working shift.
• No eating /drinking or smoking shall be permitted in the clan room/laboratory.
• Restricted access shall be maintained and a list of authorised persons shall be displayed outside
the processing areas. All other persons entering the area shall be escorted at all times.
• Items entering the processing area shall be inspected for cleanliness prior to entry.
• Non-essential items shall be precluded from the processing areas.
• Non-essential equipment or documentation shall not be stored on the floor area.
• Prior to entering the processing rooms, protective clothing shall be worn and shall constitute at
least over-shoes, coat and hat. These shall be made available within the laboratory access room
and will be replaced at a controlled frequency. A bench shall be provided to aid dressing with
protective clothing. The bench area immediately adjacent to the entry door to the laboratory shall
contain a tack mat to further prevent contamination ingress. Over shoes must not come into
contact with the area that has been used for day shoes.
• Cleaning of the processing areas shall be performed with suitably filtered vacuum equipment.
• A cleaning programme shall be established and evidence of compliance maintained for audit
purposes.
• All samples in current use or in temporary storage within the area shall be identified.
• Non-conforming samples shall be identified and physically segregated from acceptable work.
• Gloves shall be worn when handling unprotected samples.
• Unused tooling / equipment shall be stored in a manner to prevent damage and deterioration.
• It shall remain the responsibility of the users to ensure that tooling / equipment remains suitable
for its intended purpose.
For Health & Safety guidelines, refer to Section 1 (Health & Safety) of your Plasmalab system manual.
For services required, refer to OIPT Services Specifications and the relevant Installation Data document for
your Plasmalab system.
Process Information (Information contained in this document is confidential)
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Recommendations for all systems, i.e. etch & deposition.
Day-to-day operation
• It is strongly recommended that the tools are left switched on and pumping continuously (i.e. do
not switch off system or pumps). This ensures the maximum lifetime for system and pumps and
optimum process repeatability.
• Datalogging of each run is strongly recommended to allow the system to maintain full records of
all process runs. Items to monitor regularly via datalogs are as follows:
APC valve angle during process - if this is different from original/earlier data it indicates MFC
and/or pumping problems.
RF reflected power during process - indicates matching or striking problems.
DC bias readings without a wafer in chamber (for etch tools only). This may identify faulty
generator, loss of power in matching unit or shorting of electrode.
RF Automatch capacitor positions (if available) – for checking reliability of RF matching.
Weekly checks
• Leak-up rate - APC closed, measure rate of pressure rise: should be <1mTorr/minute.
• Partial pressure checks - APC fully open, measure pressure versus flow for all MFCs individually:
see relevant calibration graph. This will identify problems with MFCs or pumping.
• Fill rates (if possible), i.e. measure rate of pressure rise with APC closed (can be performed using
leak check software, if present), for each gas at a range of flow rates, and in particular at the
flow rates of the processes in use. This may not be possible for very high flow rates (i.e.
deposition processes) and is not recommended for flammable or pyrophoric gases. This will
identify problems with MFCs or APC/gate valve seals.
• Pumpdown times from vent to moderate pressure e.g. 50mTorr. For example, this would be
typically 18 to 20 seconds for a roots/ rotary system (e.g. standard deposition tool). This will
identify problems with pumping performance. For load locked chambers, this check would be
performed less frequently, e.g. only when the chamber is vented for maintenance.
Process Information (Information contained in this document is confidential)
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