Utah-94-721002-System-Manual.pdf - 第165页

System Manual = lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~= qÉÅÜåçäçÖó= mä~ëã~ä~Ä PKQ= mêçÅÉëë=íêç ìÄäÉë ÜççíáåÖ= PKQKN= m~êíá~ä=éêçÅÉëë=Ñ~áäìêÉ= PKQKNKN= bñ~ãéäÉ=éêçÄäÉãë= • Etch rate has dropped • Selectivity reduced • Profile no longe…

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mä~ëã~ä~Ä= lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó= System Manual
END POINT SIGNAL : SiO2 CLEANING
(100 microns deposition)
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TIME (MIN)
SIGNAL
Process Information (Information contained in this document is confidential)
Issue 1: December 03 Page 22 of 30 Printed: 08 January 2006 09:37
System Manual= lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó= mä~ëã~ä~Ä
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• Etch rate has dropped
• Selectivity reduced
• Profile no longer anisotropic
• Non-uniform etching (or deposition)
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• Hardware has changed – new gas cylinder, new cover plate, RF connection / grounding is faulty.
• Chamber leak – Check leak-up rate
• Faulty MFC – check partial pressures
• APC cannot control pressure – check MFCs / Pumps
• RF generator/matching – adjust matching unit set-up, check generator range switch, watch HF
matching time in mixed frequency pulsed process
• Incorrect gases used
• Temperature – poor clamping / cooling, e.g. particles on electrode/wafer, lift pin not fully down,
wafer piece not glued to carrier, incorrect set-up of Eurotherm, high power, or poor resist
preparation
• Chamber is dirty – needs more frequent cleaning
• Incorrect process regime (knife-edge process)
• Wrong hardware for given process - wrong cover plate, wafer not being cooled / heated
sufficiently, wrong electrode gap
• Wrong process for given hardware - no pumpdown time, no preheat step, no pre-clean step
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• Process not etching / depositing – does plasma ignite?
• Plasma does not ignite/light up
• Plasma is unstable/pulsing
• Plasma is flickering
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Check that readbacks are within tolerance – MFCs, pressure control, RF matching, temperature.
Check that base pressure has been reached (this can always be changed if you are in a hurry!)
Read error / warning / information messages
Process Information (Information contained in this document is confidential)
Printed: 08 January 2006 09:37 Page 23 of 30 Issue 1: December 03
mä~ëã~ä~Ä= lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó= System Manual
Check that plasma is striking – try high pressure strike (>50mT RIE, >8mT ICP), or increased RF power
input, or addition of more DC bias
Try selecting ‘ignore tolerance’ checkbox
Sudden pressure rise – check for dissociation, - try Ar instead, strike at reduced ICP power
Sudden pressure rise at plasma strike – check for cross talk between RF power and CM gauge
Sudden temperature rise at plasma strike – check for cross talk between RF power and temperature gauge
Sudden gas flow change at plasma strike – check for RF cross talk
Process Information (Information contained in this document is confidential)
Issue 1: December 03 Page 24 of 30 Printed: 08 January 2006 09:37