Utah-94-721002-System-Manual.pdf - 第252页
mä~ëã~ä~Ä= f`m=NUM lñÑ çêÇ=f åëíêìãÉ åíë= m ä~ëã~=qÉÅÜåç äçÖó== Equipment Manual = RK= léÉê~íáåÖ=fåëíêìÅíáçåë= RKN= fåíêçÇìÅíáçå= WARNING BEFORE POWERING UP THE SOURCE, ENSURE THAT ALL COVERS AND SCREENS ARE FITTED CORRE…
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This section applies if the mä~ëã~ä~Ä=f`mNUM=source is supplied as an upgrade, or as an exchangeable
plasma source.
The ICP180 is installed as the entire top lid to a mä~ëã~ä~Ä
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póëíÉã=NMM, with a vacuum O ring on the
underside of the ICP180 chamber lid. The chamber lid is secured by hinges which enable access to the
process chamber interior for maintenance.
WARNING
PINCH POINT – WHEN THE CHAMBER LID IS OPENED OR CLOSED, LIMBS,
FINGERS ETC CAN BECOME TRAPPED BETWEEN THE LID AND THE PROCESS
CHAMBER BASE RESULTING IN SEVERE INJURY.
Ensure that all personnel are kept clear of the chamber lid when it is
opened or closed.
When opening or closing the chamber lid, ensure that both of your hands
are kept clear of the pinch point.
When the process chamber lid is to be kept in its raised position for
prolonged periods, ensure that it is held safely in its open position
without relying entirely on the gas support struts.
After mechanical mounting, connect the services detailed in Section 2 of this manual.
The RF generator services should be connected according to the manufacturer’s manual supplied with the
generator.
ICP 180 Source
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WARNING
BEFORE POWERING UP THE SOURCE, ENSURE THAT ALL COVERS AND SCREENS ARE
FITTED CORRECTLY. DO NOT REMOVE THE COVERS OR SCREENS WHILST THE
SOURCE IS UNDER VACUUM.
The only controls on the mä~ëã~ä~Ä
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f`m=NUM are the Automatch Unit (AMU) control switches, mounted on
the system console.
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NOTE: The following text refers to systems fitted with an Automatch Unit manual adjustment
panel. For systems having software control of the Automatch Unit, refer to Section 5
(Operating Instructions) of your system manual and the Automatch Unit’s Equipment
Manual.
A manual adjustment panel, shown in Fig 5, is located behind a flap in the front of the equipment rack. It
comprises the following controls and indicators:
Auto / Manual switch: Sets the operating mode of the RF matching unit.
C1 MAX / MIN: Manual adjustment of RF matching capacitor C1. (Rotating its shaft clockwise or
counter clockwise.)
C2 MAX / MIN: Manual adjustment of RF matching capacitor C2. (Rotating its shaft clockwise or
counter clockwise.)
C1 PARK: Park position potentiometer for C1.
C2 PARK: Park position potentiometer for C2.
RF Interlock ON/OFF: Disables the RF interlock. RF generators deliver no power if the interlock is off.
Capacitor positions for C1 and C2 are displayed as numbers from 000 (minimum) to 999 (maximum).
AUTO
AUTO
MANUAL
MANUAL
C1 MAX
C1 MAX
C1 MIN
C1 MIN
C2 MAX
C2 MAX
C2 MIN
C2 MIN
C1 PARK
C1 PARK
C2 PARK
C2 PARK
ON
OFF
RF
Interlock
C1
C2
1
2
3
4
5
6
DISPLAY SELECTO
R
Fig 5: Typical AMU control panel
ICP 180 Source
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Equipment Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~Ä=f`m=NUM
Note that Fig 5 shows an AMU control panel with control facilities for two AMUs. The left-hand side
controls are for AMU1 and the right-hand side controls are for AMU2. The LCD displays are switched using
the DISPLAY SELECTOR switch as shown in the following table.
DISPLAY SELECTOR
POSITION
LCD 1 (UPPER) LCD 2 (LOWER)
1 AMU 1 C1 POSITION AMU 1 C2 POSITION
2 RF 1 FORWARD POWER RF 1 REFLECTED POWER
3 RF 1 SETPOINT RF 1 Hi/Lo
4 RF 2 FORWARD POWER RF 2 REFLECTED POWER
5 RF 2 SETPOINT SPARE
6 AMU 2 C1 POSITION AMU 2 C2 POSITION
For full details of the Oxford Instruments Plasma Technology AMU, refer to its Operation and
Maintenance manual in Volume 3 of this manual.
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1) Ensure that the mä~ëã~ä~Ä
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póëíÉã=NMM=(or other host system) has been powered up in
accordance with its Operating Instructions.
2) Evacuate the plasma chamber. Flow process gas and set a pressure in the range 1 to 3 Pa (7 to
22 mTorr). Verify that adequate cooling water is flowing to the ICP180 source.
3) Turn on the RF power at 200W to 500W, then observe the reflected power.
WARNING
MONITOR THE RF RADIATION NEAR THE SOURCE WITH A SUITABLE METER. REFER
TO APPENDIX A IN THE SYSTEM 100 MANUAL FOR DETAILS OF RF MEASUREMENTS.
If the reflected power is high (>50% of forward power):
a) Check the Automatch Unit is powered up and switches set.
b) Change to manual matching and search for a matching point; change both capacitors
back to AUTO together: automatic matching should occur.
If the reflected power is >10% of the forward power, and the automatch is in automatic
mode, skilled adjustment is needed. Refer to Section 6 (Maintenance) for guidance.
4) When the reflected power is low (<10% of forward power), gradually increase the RF power
to 1500W. This is usually sufficient to strike a plasma. If a plasma does not strike apply any of
the following strategies, as most appropriate to the application:
a) Change the gas mix away from electronegative gases (e.g. SF
6
) towards gases which
ionise more easily (e.g. Ar).
b) Turn on the ICP180 RF power at the same time as RF power to another electrode.
c) Check that the cooling flow rate is as specified, then gradually increase the RF power
to a maximum of 3kW.
ICP 180 Source
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