Utah-94-721002-System-Manual.pdf - 第254页
mä~ëã~ä~Ä= f`m=NUM lñÑ çêÇ=f åëíêìãÉ åíë= m ä~ëã~=qÉÅÜåç äçÖó== Equipment Manual = d) Follow the procedure in Section 7 (Troubleshootin g) for improving the quality of the match. e) Vary the pressure across t he 1 to 5 P…
Equipment Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~Ä=f`m=NUM
Note that Fig 5 shows an AMU control panel with control facilities for two AMUs. The left-hand side
controls are for AMU1 and the right-hand side controls are for AMU2. The LCD displays are switched using
the DISPLAY SELECTOR switch as shown in the following table.
DISPLAY SELECTOR
POSITION
LCD 1 (UPPER) LCD 2 (LOWER)
1 AMU 1 C1 POSITION AMU 1 C2 POSITION
2 RF 1 FORWARD POWER RF 1 REFLECTED POWER
3 RF 1 SETPOINT RF 1 Hi/Lo
4 RF 2 FORWARD POWER RF 2 REFLECTED POWER
5 RF 2 SETPOINT SPARE
6 AMU 2 C1 POSITION AMU 2 C2 POSITION
For full details of the Oxford Instruments Plasma Technology AMU, refer to its Operation and
Maintenance manual in Volume 3 of this manual.
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1) Ensure that the mä~ëã~ä~Ä
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póëíÉã=NMM=(or other host system) has been powered up in
accordance with its Operating Instructions.
2) Evacuate the plasma chamber. Flow process gas and set a pressure in the range 1 to 3 Pa (7 to
22 mTorr). Verify that adequate cooling water is flowing to the ICP180 source.
3) Turn on the RF power at 200W to 500W, then observe the reflected power.
WARNING
MONITOR THE RF RADIATION NEAR THE SOURCE WITH A SUITABLE METER. REFER
TO APPENDIX A IN THE SYSTEM 100 MANUAL FOR DETAILS OF RF MEASUREMENTS.
If the reflected power is high (>50% of forward power):
a) Check the Automatch Unit is powered up and switches set.
b) Change to manual matching and search for a matching point; change both capacitors
back to AUTO together: automatic matching should occur.
If the reflected power is >10% of the forward power, and the automatch is in automatic
mode, skilled adjustment is needed. Refer to Section 6 (Maintenance) for guidance.
4) When the reflected power is low (<10% of forward power), gradually increase the RF power
to 1500W. This is usually sufficient to strike a plasma. If a plasma does not strike apply any of
the following strategies, as most appropriate to the application:
a) Change the gas mix away from electronegative gases (e.g. SF
6
) towards gases which
ionise more easily (e.g. Ar).
b) Turn on the ICP180 RF power at the same time as RF power to another electrode.
c) Check that the cooling flow rate is as specified, then gradually increase the RF power
to a maximum of 3kW.
ICP 180 Source
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mä~ëã~ä~Ä=f`m=NUM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== Equipment Manual=
d) Follow the procedure in Section 7 (Troubleshooting) for improving the quality of the
match.
e) Vary the pressure across the 1 to 5 Pa range.
It is usually possible to start the plasma directly at process conditions of interest. However, it is difficult to
sustain a plasma at low RF power (<300W).
ICP 180 Source
Issue 4: January 06 Page 14 of 26 Printed: 18-Jan-06, 8:44
Equipment Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~Ä=f`m=NUM=
WARNING
BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY.
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The maintenance required to ensure continued safety and reliability is listed in the following
Maintenance Schedule.
The periodicity is indicated by an asterisk (
*) in the appropriate column.
Task
As
Required
Weekly
Three-
Monthly
Notes
Measure RF emissions
*
See Appendix A of the System 100
manual for details. RF should also be
measured after any maintenance
involving the removal of covers and
monitored continuously if the
system is operated with RF power
applied and any covers removed.
Inspect Quartz
components
*
See sub-section 6.2.1. Periodicity may
need to be reduced depending on
process conditions.
Inspect Alumina
components
*
See sub-section 6.2.1. Periodicity may
need to be reduced depending on
process conditions.
ICP dielectric tube
cleaning
*
See sub-section 6.3.1. Periodicity depends
on process condition.
Vacuum check
*
See sub-section 6.3.2.
Water cooling circuit
*
See sub-section 6.3.3.
RF enclosure exhaust
flow
*
See sub-section 6.3.3.
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Downstream microwave, ECR and induction coupled plasma sources contain quartz or alumina tubes or
windows under vacuum, which may be subject to attack by the plasma process. If these components fail
whilst under vacuum, an implosion can occur. This should not present a safety hazard, provided the
equipment is used with all covers and screens in place, but may cause damage to system components.
Failure by implosion becomes more likely as the components age, therefore they should be regarded as
consumable items. A programme of regular inspection and renewal of these components is necessary to
minimise the risk of implosion.
ICP 180 Source
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