Utah-94-721002-System-Manual.pdf - 第268页

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RF Automatic Matching Unit

Issue 6: February 2005 Page 1 of 20

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Contents

Health and Safety........................................................................................................3

2. Description...................................................................................................................3

2.1 Introduction........................................................................................................................3

2.2 Major components .............................................................................................................4

2.2.1 Automatch control panel...........................................................................................4

2.3 Matching component layouts............................................................................................5

2.4 Sense and control PCB........................................................................................................7

3. Test and setting up......................................................................................................8

3.1 Overview.............................................................................................................................8

3.2 Procedure............................................................................................................................9

4. Operator adjustment ................................................................................................13

4.1 DC bias / Peak-to-peak switch setting.............................................................................13

5. Operation...................................................................................................................13

6. Troubleshooting........................................................................................................15

6.1 Fault diagnosis chart ........................................................................................................15

6.1.1 Amplifier gain adjustment.......................................................................................16

6.1.2 Drive motor shaft to capacitor spindle alignment.................................................17

6.2 Link Settings......................................................................................................................18

6.3 Changing the RF components .........................................................................................19

6.4 Adjustment of capacitor park positions..........................................................................20

7. OIPT locations worldwide.........................................................................................20

Fig 1: The Oxford Instruments Plasma Technology automatch unit.........................................3

Fig 2: Typical AMU control panel ................................................................................................4

Fig 3: Matching component layouts............................................................................................6

Fig 4: Sense and control PCB layout............................................................................................7

Fig 5: Capacitor shafts rotation direction .................................................................................10

Fig 6: Component locations .......................................................................................................11

Fig 7: LK102 and LK2 settings....................................................................................................16

OIPT Automatch Unit

Issue 6: February 05 Page 2 of 20 Printed: 5-Jan-06, 8:03

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For Health and Safety aspects of operating and maintaining the Oxford Instruments Plasma

Technology Automatch Unit, refer to Section 1 - Health and Safety of your mä~ëã~ä~Ä or

fçåÑ~Ä system manual.

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The purpose of the Oxford Instruments Plasma Technology Automatch Unit (AMU) is to match

the impedance of mä~ëã~ä~Ä process chambers and fçåÑ~Ä RF ion sources to RF generators

with an output impedance of 50 ohms, operating at 13.56 MHz.

DC bias / Peak-

to-peak switch

Fig 1: The Oxford Instruments Plasma Technology automatch unit

Different versions of internal components exist, but all AMUs in this series share common

electronic controls and setting up instructions. The main versions are:

Low power: The two matching capacitors are air-cooled vane types.

High power: The two matching capacitors are water-cooled vacuum types.

The low power version is used for single wafer electrodes matching up to 500W. (The air vane

AMU is rated for 300W operation in all OIPT tools, and for use up to 500W in specific builds.)

The high power version is used in most other applications, including batch electrode

matching, 3kW ICP source, and 3cm and 15cm RF ion sources.

Note that OIPT also manufactures a 5kW AMU for use with the ICP 380 source and the 35cm

RF ion source. This AMU has an associated dedicated manual.

OIPT Automatch Unit

Printed: 5-Jan-06, 8:03 Page 3 of 20 Issue 6: February 05