Utah-94-721002-System-Manual.pdf - 第287页
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The capacitors drive automatically to the park positions if:
the AMU is set to Auto
the RF is off
the circuit board links enable parking
The park positions can be adjusted when all of these conditions are satisfied, by altering the
corresponding potentiometer with a small flat-bladed screwdriver. The capacitor will move
when the potentiometer is adjusted, and the park position is displayed as the capacitor
position.
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UK
Oxford Instruments Plasma Technolgy
North End, Yatton,
Bristol, BS49 4AP
Tel: +44(0)1934 837000
Fax: +44(0)1934 837001
Email:
plasma.technology@oxinst.co.uk
Web: www.oxford-
instruments.com/plmchp5.htm
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Concord, MA 01742
Tel: +1 978 369 9933
Toll Free +1 800-447-4717
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Fax: +49(0)6122 937175
Email:
plasma@oxford.de
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Fax: +65 6337 6286
Email:
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instruments.com.sg
Taiwan
Oxford Instruments Overseas
Marketing Ltd.
1F, No 23 Jing-Shang 19
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Street,
Hsinchu, Taiwan
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Email:
oipt.sales@oxford-
instruments.com.sg
OIPT Automatch Unit
Issue 6: February 05 Page 20 of 20 Printed: 5-Jan-06, 8:03
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Modular Cluster System – ICP 180=
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Issue 2: November 2002
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Illustrated Parts Catalogue
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Issue 2: November 02
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Contents............................................................................................................................................................ ii
Introduction.....................................................................................................................................................
iii
Location of major components........................................................................................................................
v
Section 0 System common components.......................................................................................................
0-1
Section 1 Intentionally left blank
Section 2 Intentionally left blank
Section 3 Process chambers...........................................................................................................................
3-1
Section 4 Intentionally left blank
Section 5 Lower electrode.............................................................................................................................
5-1
Section 6 RF plasma generation, power supplies........................................................................................
6-1
Section 7 Vacuum measurement...................................................................................................................
7-1
Section 8 Pumping pipework ........................................................................................................................
8-1
Section 9 Process gas handling.....................................................................................................................
9-1
Section 10 Wafer handling options, load locks and robotics ...................................................................
10-1
Section 11 Spares .........................................................................................................................................
11-1
Section 12 Accessories.................................................................................................................................
12-1
Page ii of vi
Printed: 16-Jan-06, 15:55