Utah-94-721002-System-Manual.pdf - 第37页

System Manual lñÑçêÇ=få ëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ Ä póëíÉã=NMM PK= aÉëÅêáéíáçå= 3. Description ................................................................................................................…

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mä~ëã~ä~Ä=póëíÉã=NMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== = System Manual
Fig 2.2: System 100 pneumatic circuit diagram
Services (ICP 180 and Automatic Load Lock)
Issue 2: February 02 Page 2-6 of 6 Printed 25 May 2005 10:12
System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~Ä póëíÉã=NMM
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3. Description....................................................................................................................................3-1
3.1 Introduction...........................................................................................................................3-2
3.2 PC 2000 Hardware and software with licence.....................................................................3-2
3.2.1 Hardware......................................................................................................................................3-2
3.2.2 PC 2000 software and single-user licence...................................................................................3-2
3.3 94-100-0-RIE RIE base unit.....................................................................................................3-2
3.3.1 Frame ............................................................................................................................................3-3
3.3.2 Power box assembly.....................................................................................................................3-3
3.3.3 System controller..........................................................................................................................3-3
3.3.4 Interlocks.......................................................................................................................................3-5
3.3.5 Services..........................................................................................................................................3-6
3.4 94-100-3-41C ICP 180 chamber kit with gate valve.............................................................3-7
3.4.1 94-100-3-00/21P Process chamber electrical heating kit............................................................3-8
3.4.2 94-100-3-00/05 200mm Pumpdown pipe heater kit ..................................................................3-8
3.5 94-100-5-12A Cryo / heated –150/400C helium-assisted lower electrode..........................3-9
3.6 94-100-6-500/200 500W RF generator / OIPT AMU kit........................................................3-12
3.7 94-100-6-56 ICP 180 Inductively Coupled Plasma Source..................................................3-12
3.8 Vacuum system....................................................................................................................3-12
3.9 Gas handling system...........................................................................................................3-14
3.9.1 94-81-9-51/8 Gas pod (PLC version)...........................................................................................3-14
3.9.2 94-81-9-11 Standard non-toxic gas line....................................................................................3-16
3.9.3 94-81-9-21 Standard toxic gas line............................................................................................3-17
3.9.4 94-81-9-00/4 Gas line interlock kit ............................................................................................3-17
3.10 94-100-10-05C Single wafer automatic load lock ............................................................3-18
3.10.1 Wafer transfer mechanism operating principle.......................................................................3-19
3.10.2 Functional Description...............................................................................................................3-20
3.10.3 Wafer support (end effector)....................................................................................................3-22
Fig 3.1: Typical control system............................................................................................................................3-4
Fig 3.2: 94-100-3-41C process chamber..............................................................................................................3-7
Fig 3.3: 94-100-5-12A Cryo / heated -150 / 400C He lower electrode............................................................3-11
Fig 3.4: UC Davis 94-721001 vacuum system ...................................................................................................3-13
Fig 3.5: 94-81-9-51 Gas pod .............................................................................................................................3-15
Fig 3.6: 94-81-9-11 Standard non-toxic gas lines.............................................................................................3-16
Fig 3.7: 94-81-9-21 Standard toxic gas line......................................................................................................3-17
Fig 3.8: Single wafer automatic load lock.......................................................................................................3-18
Fig 3.9: Simplified wafer transport mechanism operation.............................................................................3-19
Fig 3.10: Automatic load lock, side view .........................................................................................................3-20
Fig 3.11: Automatic load lock wafer transport mechanism ...........................................................................3-21
Table 3.1: Consequences of open circuit interlocks..........................................................................................3-6
Description
Printed: 22-Mar-06, 7:29 Page 3-1 of 22 UC Davis 94-721001 Issue 1: March 06
mä~ëã~ä~Ä póëíÉã=NMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual
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The mä~ëã~ä~Ä
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póëíÉã=NMM=is a modular plasma processing system. It can be configured to
carry out Reactive Ion Etching (RIE), Plasma Enhanced Chemical Vapour Deposition (PECVD),
Inductively Coupled Plasma (ICP) and Electron Cyclotron Resonance (ECR) processes.
The system can be tailored to suit different rates of throughput using transfer and load lock
chambers with manual or automatic loading.
Combinations of processes can be achieved by using a transfer chamber robot to serve up to
four process chambers.
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The system is controlled and monitored by a PC compatible computer with a Microsoft
Windows Operating System. The computer is fitted with a floppy disk drive and a CD-ROM
drive to allow software updates. An Arcnet interface card, for communicating with the
Programmable Logic Controllers (PLCs), is fitted in one of the expansion slots. If required, a
modem can be fitted to use the ‘PC Anywhere’ software.
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The PC 2000 control software runs as a Windows-based application allowing multiple levels of
system control: SYSTEMS MANAGER, SYSTEMS ENGINEER, PROCESS DEVELOPER,
MAINTENANCE ENGINEER, PROCESS EDITOR and OPERATOR, all of which are accessed by
password entry.
The system status is displayed on graphic mimic diagrams with all operational parameters and
status displays accessible through pop-up windows selected using the mouse. All the major
process parameters are accessible from the recipe and process step set-up pages, including
definition of gases on each line and calculation of mass flow settings in sccm's. The software
includes data logging to disk of user-selectable run-time process parameters for off-line
verification and analysis of process conditions.
Processing recipes can be formulated and stored in the computer and the system can be run
in fully automatic mode using the recipes. Alternatively, the system can be run in the manual
mode with each phase of the process controlled and initiated separately. All the parameters
can be monitored in real time using the PC 2000 software.
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The mä~ëã~ä~Ä
póëíÉã=NMM process module base unit houses the process chamber, electronic
sub systems, control units, services and power supplies.
The module is mechanically MESC compatible and is constructed using proven Oxford
Instruments Plasma Technology hardware designs.
The system is fully interlocked to protect the system hardware from service failure and to
protect the operator from electrical shock during maintenance procedures. A lock out valve
and associated padlock, mounted on the frame, can be used to prevent operation of all
pneumatically operated devices during servicing.
Description
UC Davis 94-721001 Issue 1: March 06 Page 3-2 of 22 Printed: 22-Mar-06, 7:29