Utah-94-721002-System-Manual.pdf - 第59页
System Manual = lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó= mä~ëã~ä~Ä = póëíÉã=NMM QK= fåëí~ää~íáçå=~åÇ=ÅçããáëëáçåáåÖ= 4. Installation and commissionin g ........................................................................…
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As Steel Belt 2 travels with respect to the Carriage, it causes the Wafer Support
attached to it to travel along the Carriage.
6) As the Wafer Support reaches the end of its travel, a hole in Steel Belt 1 is detected
by Photo Diode 2 to stop the DC Motor.
7) The wafer is lifted from the wafer support by a wafer lift within the processing
chamber, the wafer support is withdrawn from the chamber, and the wafer is
lowered onto the processing table by the wafer lift.
8) As the Wafer Support reaches its fully retracted position within the load lock, the
hole in Steel Belt 1 is detected by Photo Diode 1 to stop the DC motor.
9) The gate valve is closed and the load lock can be vented if required.
The above sequence of events is repeated to remove the wafer from the processing chamber.
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The automatic load lock end effector (wafer support) can accommodate wafer diameters of
3” to 8”. See Section 6 (Maintenance) for the end effector wafer size adjustment procedure.
Description
UC Davis 94-721001 Issue 1: March 06 Page 3-22 of 22 Printed: 22-Mar-06, 7:29
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4.
Installation and commissioning.............................................................................4-1
4.1 Introduction.....................................................................................................................4-2
4.2 Installing the system........................................................................................................4-2
4.2.1 Unpacking................................................................................................................4-2
4.2.2 Positioning the system components.......................................................................4-3
4.2.3 Connecting the services...........................................................................................4-4
4.3 Commissioning the system .............................................................................................4-6
4.4 System adjustments.........................................................................................................4-6
4.4.1 Heater/Chillers .........................................................................................................4-6
4.4.2 Process pump purge................................................................................................4-6
Fig 4.1: 3-phase supply cable connections at the power box.................................................4-5
Installation and Commissioning
Printed: 16 March 2006 11:59 Page 4-1 of 8 Issue 4: March 05
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The installation and cabling of this system is the responsibility of the customer (unless this has
been specifically altered in the sales contract). On completion of the system installation,
Oxford Instruments Plasma Technology (OIPT) will commission the system.
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The following instructions are a general guide for installing a typical mä~ëã~ä~ÄpóëíÉãNMM=
system, supplied with a remote gas pod and rotary vane pump. Customers should be aware of
any special requirements for their specific system, e.g. rotary pump purging, hazardous
processes, endpoint detectors etc..
For details of the services required, refer to the Installation Data Sheets and the Services
Specifications documents included in this manual as Appendices.
IMPORTANT: BEFORE INSTALLING THE SYSTEM, ENSURE THAT ALL PERSONNEL WHO
WILL BE INVOLVED HAVE READ AND UNDERSTOOD SECTION 1 ‘HEALTH
AND SAFETY’ OF THIS MANUAL.
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Unpack system components and check for damage and missing items against the packing list.
If any items are damaged or missing, report immediately to the carrier and OIPT.
Installation and Commissioning
Issue 4: March 05 Page 4-2 of 8 Printed: 16 March 2006 11:59