Utah-94-721002-System-Manual.pdf - 第66页
mä~ëã~ä~Ä = póëíÉã=NMM= lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó= System Manual NOTES: Installation and Commissioning Issue 4: March 05 Page 4-8 of 8 Printed: 16 March 2006 11:59
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If your Plasmalab system is supplied with a dry pump, e.g. Alcatel ADP122P or ADS602P, that
includes its own purge gas monitor, with an output suitable for inclusion in a hardware
interlock chain, it is permissible to use this instead of the OIPT purge kit.
If your Plasmalab system is supplied with an oil filled rotary pump, e.g. Alcatel A2063C2, the
purge kit supplied is configured for the process gases specified. Note that information about
the Rotameters used is given in Appendix R.
For purge requirements not covered by the standard OIPT purge kits or dry pump purge gas
monitor an additional purge supplement is included at the end of this section.
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Tools that are pumping only atmospheric gases need no purge, other than any minimum
purge the specific pump requires.
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Tools that use gases containing halogens (fluorine, chlorine, and bromine – including
compounds which contain these elements, e.g. CHF
3
), are supplied with purge into the pump,
via a rotameter of full scale at least 4 standard litres per minute (slpm).
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Certain processes use the flammable gases hydrogen (H
2
) and methane (CH
4
), often in
combination with chlorine (Cl
2
) to etch compound semiconductors. The primary pump for
these is purged with sufficient gas to bring the exhaust to one third of the lower flammability
limit.
A rotameter is used to set and read the flow. A flow switch monitors the purge. The process
gases are turned off by means of a hardware interlock if the flow switch reports low flow
below 7.5slpm.
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Tools that use silane to deposit thin films containing silicon shall be purged with sufficient gas
to bring the exhaust to one third of the lower explosion limit.
A rotameter is used to set and read the flow. A flow switch monitors the purge. For low rate
processes (<25sccm SiH
4
) the process gases are turned off by means of a hardware interlock if
the flow switch reports low flow below 5.2slpm. For high rate processes (<50sccm Si H
4
) the
process gases are turned off by means of a hardware interlock if the flow switch reports low
flow below 10.5slpm.
Installation and Commissioning
Printed: 16 March 2006 11:59 Page 4-7 of 8 Issue 4: March 05
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NOTES:
Installation and Commissioning
Issue 4: March 05 Page 4-8 of 8 Printed: 16 March 2006 11:59
System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ÄpóëíÉãNMM
RK= léÉê~íáåÖ=áåëíêìÅíáçåë==
5.
Operating instructions ............................................................................................5-1
5.1 Failure of quartz and alumina components under vacuum.........................................5-3
5.2 System power-up.............................................................................................................5-4
5.3 System shut down and restart........................................................................................5-5
5.3.1 Emergency shut down.............................................................................................5-5
5.3.2 Routine shut down..................................................................................................5-5
5.3.3 Mains Power failure ................................................................................................5-5
5.3.4 Software abort.........................................................................................................5-5
5.3.5 System shut-down procedure.................................................................................5-6
5.3.6 System restart following an emergency stop, power failure, or software abort5-6
5.3.7 System response to loss of services.........................................................................5-8
5.4 Operator control ...........................................................................................................5-10
5.4.1 Turning screen savers and power saver options off............................................5-10
5.4.2 Logging on.............................................................................................................5-11
5.4.2.1 Editing users details ....................................................................................5-11
5.4.3 System alerts ..........................................................................................................5-14
5.4.4 Pumping down.......................................................................................................5-15
5.4.5 Automatic process run ..........................................................................................5-16
5.4.6 Single button automatic process run...................................................................5-17
5.4.7 Production mode...................................................................................................5-18
5.4.8 Manual process run ...............................................................................................5-19
5.4.9 Venting the system................................................................................................5-20
5.5 Creating and editing recipes ........................................................................................5-21
5.5.1 Working with recipe steps....................................................................................5-21
5.5.2 Working with recipes ............................................................................................5-22
5.6 Process Datalog .............................................................................................................5-24
5.6.1 Select Log page......................................................................................................5-24
5.6.1.1 Saving a log file as text for use in Microsoft Excel™................................5-25
5.6.2 Run log page..........................................................................................................5-28
5.6.3 Leak detection and MFC calibration log page ....................................................5-29
5.7 Operator adjustments...................................................................................................5-30
5.7.1 Manual adjustment of the RF matching unit......................................................5-30
5.7.2 Adjusting the nitrogen regulator outlet pressure ..............................................5-31
5.7.3 Rotary/dry pump N
2
purge flow rate adjustment ...............................................5-32
5.8 PC 2000 screens..............................................................................................................5-33
5.8.1 Pump control page................................................................................................5-33
5.8.2 Robot control page ...............................................................................................5-36
5.8.3 Recipe page............................................................................................................5-37
5.8.4 Production mode page..........................................................................................5-39
5.8.5 Chamber 1 process control page..........................................................................5-40
5.8.6 Leak detection page..............................................................................................5-45
5.8.7 Mass flow calibration page...................................................................................5-47
5.8.8 Service mode..........................................................................................................5-48
5.8.8.1 Transferring wafers in service mode..........................................................5-49
5.8.8.2 Exiting from service mode..........................................................................5-50
5.8.9 System log page.....................................................................................................5-51
5.9 Log files..........................................................................................................................5-52
Fig 5.1: Menu bar.....................................................................................................................5-10
Fig 5.2: Typical system alert ....................................................................................................5-14
Fig 5.3: Recipe screen ..............................................................................................................5-21
Fig 5.4: Step Commands pop-up menu..................................................................................5-22
Fig 5.5: Select Log page...........................................................................................................5-24
Operating Instructions
Printed: 22-Mar-06, 10:42 Page 5-1 of 52 UC Davis 94-721001 Issue 1: March 06