Utah-94-721002-System-Manual.pdf - 第85页
System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉ ÅÜåçäçÖó== mä~ëã~ä~Ä póëíÉãNMM RKQKU= j~åì~ä=éêçÅÉëë=êìå= 1) Insert the wafer into the Automatic load lock. (If necessary, ven t the Automatic load lock by selecting the STOP bu…

mä~ëã~ä~ÄpóëíÉãNMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual
NOTES:
a) You can pause the process at any time by selecting the PAUSE button. This will
cause the Step Time and the plasma power to stop with the current step time
indicated. Re-starting the process will cause the process to continue from the
time it was paused. If, during the pause period, you change any of the process
parameters, e.g. gas demand, pressure etc., you must press the START button
for the changes made to come into effect, this will cause the step timer to
continue from the time it was paused.
b) You can stop the process at any time; the message ‘Process Complete’ will be
displayed, if required, you can then run the same or another process.
RKQKT= mêçÇìÅíáçå=ãçÇÉ=
The production mode facility is provided to make operation of the system as simple as
possible. In this mode, the user is provided with a ‘special’ Recipe page, which allows the user
to load and run a recipe and then vent the automatic load lock.
To carry out production mode processing, use the following steps:
1) Log on as a Manager.
2) Start the external rotary vane pump/dry pumps for the process chamber and
automatic load lock.
3) Evacuate the process chamber. Do not evacuate the automatic load lock at this
stage.
4) Select the system menu, and then select the Passwords option.
5) Log on using the appropriate user name and password for the production mode. The
Production mode page is displayed. See sub-section 5.8.4, page 5-39.
6) Open the automatic load lock’s lid and place the wafer to be processed on the
transfer arm. Close the lid.
7) Select the Load button, then select the required recipe from the displayed list and
select the OK button.
8) Enter a batch identity.
9) Select the Run button. The automatic load lock will automatically pump down and
the recipe will run. Note that this button only becomes active when a recipe has
been loaded and a batch identity has been entered, and the associated indicators
are coloured green.
10) When the ‘Process Complete’ message is displayed, select the System menu and
then the Pumping option to vent the automatic load lock.
11) When the automatic load lock has finished venting, open its lid and then remove the
processed wafer.
12) You can now carry out a further process by repeating steps 6) to 11). If running the
same recipe Step 7) can be skipped, otherwise load another recipe.
13) On completion of production mode processing, log on as a Manager.
Operating Instructions
UC Davis 94-721001 Issue 1: March 06 Page 5-18 of 52 Printed: 22-Mar-06, 10:42

System Manual lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== mä~ëã~ä~ÄpóëíÉãNMM
RKQKU= j~åì~ä=éêçÅÉëë=êìå=
1) Insert the wafer into the Automatic load lock. (If necessary, vent the Automatic load
lock by selecting the STOP button then the VENT button).
2) Close the Automatic load lock lid.
3) Select the Automatic load lock’s EVACUATE button. A dialogue box will be
displayed allowing entry of a Wafer Name, if any.
4) Check that the system has pumped down to base pressure. (The process chamber
message panel should display ‘Base Pressure reached’).
5) Select the Process menu, then the Chamber 1 option. Set the parameters as required,
e.g. Step Time, RF generator power, chiller temperature, chamber pressure, and gas
demands.
6) Ensure that the Automatic load lock is at the required pressure. (Check the relevant
panels on the Pump Control page). Green ‘ready for transfer’ indicators (WX) are
displayed on each chamber mimic when it is available for vacuum transfer.
7) On the Pump Control page, click on the Automatic load lock wafer mimic. The Robot
Control page is displayed (see Fig 5.13, page 5-36).
8) Click on the Process Chamber wafer mimic. The wafer is transferred from the
Automatic load lock into the Process Chamber.
9) On the Chamber 1 process page, check that the set parameters are correct for your
required process.
10) Click the START button. (Note that if this button is not active, the chamber has not
reached base pressure.) The process will commence.
NOTES:
a) You can pause the process at any time by selecting the PAUSE button. This
will cause the Step Time and the plasma power to stop with the current step
time indicated. Re-starting the process will cause the process to continue from
the time it was paused. If, during the pause period, you change any of the
process parameters, e.g. gas demand, pressure etc., you must press the START
button for the changes made to come into effect, this will cause the step timer
to continue from the time it was paused.
b) You can stop the process at any time; the message ‘Process Complete’ will be
displayed, if required, you can then run the same or another process.
WARNING
CONTACT WITH TOXIC GASES CAN CAUSE DEATH OR SERIOUS INJURY.
WHERE ANY PROCESS GAS IS TOXIC, DO NOT TRANSFER A WAFER FROM THE
PROCESS CHAMBER TO THE LOAD LOCK UNTIL ALL PROCESS GAS HAS BEEN
PUMPED OUT.
ENSURE THAT THE AUTOMATIC VENT SEQUENCE IS ALLOWED TO COMPLETE.
IF THESE PRECAUTIONS ARE NOT CARRIED OUT, THERE COULD BE A HAZARD IN THE
LOAD LOCK.
Operating Instructions
Printed: 22-Mar-06, 10:42 Page 5-19 of 52 UC Davis 94-721001 Issue 1: March 06

mä~ëã~ä~ÄpóëíÉãNMM lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó== System Manual
11) When the ‘Process Complete’ message is displayed, select the Pump Control page
and move the wafer from the process chamber to the Automatic load lock using the
same method as the transfer in.
12) Open the Automatic load lock’s lid and remove the wafer.
13) If required, the system can now be vented, see sub-section 5.4.9 page 5-20.
RKQKV= sÉåíáåÖ=íÜÉ=ëóëíÉã=
WARNING
CONTACT WITH TOXIC GASES CAN CAUSE DEATH OR SERIOUS INJURY.
BEFORE VENTING THE PROCESS CHAMBER, ALWAYS ENSURE THAT THE SYSTEM IS
ADEQUATELY PURGED AND PUMPED.
Do not vent a system which has used toxic gases unless the system has been adequately
pumped first.
For example: Gases having Threshold Limit Values (TLVs) of 1ppm or below, e.g.
Chlorine, require at least 20 minutes pumping before venting.
After venting, there may still be residual gases in the process chamber. Consider wearing
suitable personal protection, e.g. a respirator.
To vent the system, use the following steps.
1) From the System menu, select the Pumping option.
2) On the Pump Control page, select the STOP button then the VENT button for each
chamber. Note that the vent sequence is controlled by a timer to allow time for the
turbo pumps to ‘spin’ down.
3) When all of the ‘Vent Time Left’ timers have decremented to zero, all of the pumps
have been switched off automatically, and the complete system has been vented.
Do not attempt to open the process chamber lid until the vacuum switch has changed status,
i.e. to its high-pressure status (In this condition, on the Pump Control page the vacuum status
field will display ‘FAULT’).
Operating Instructions
UC Davis 94-721001 Issue 1: March 06 Page 5-20 of 52 Printed: 22-Mar-06, 10:42