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Question: Can I use single wires for connection between MSP-GANG and target device?
135
SLAU358QSeptember 2011Revised October 2019
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Copyright © 2011–2019, Texas Instruments Incorporated
Frequently Asked Questions
6.2 Question: Can I use single wires for connection between MSP-GANG and target device?
Answer: Single wires are a poor type of connection and provide very bad quality. Single wires work like
inductors connected between the MSP-GANG and target device, generating ripples on the target device
side. If a ribbon cable cannot be used, then a twisted-pairs connection should be used instead. One wire
on each twisted pair should be connected to a signal connection (for example, TDI or TCK), and the
second wire connected to DC (GND or V
CC
) from both sides of the connection (one on the MSP-GANG
side and the other on the target device side). For example, the following arrangement is acceptable:
1 - TDO (Signal wire) - first twisted pair
1 - Vcc / Vcc sense (DC wire)
2 - TDI (Signal wire) - second twisted pair
2 - Vcc sense (DC wire)
3 - TMS (Signal wire) - third twisted pair
3 - RESET (DC wire)
4 - TCK (Signal wire) - fourth twisted pair
4 - GND (DC wire)
If additional protecting components (such as a capacitor or suppressors) are used on the target device
PCB, check the JTAG signal shape on the MSP MCU. The JTAG communication speed should be
decreased (set to medium or slow) if required. Make sure that any ripple on the JTAG lines is smaller than
20% of the peak-to-peak signal level.
If connection cables are longer than 40 cm, then the ripple can be reduced by inserting 33-Ω resistors in
series with TCK, TMS, and TDO in the middle of the connection wires. Do not provide series resistors in
TEST and TDI lines if the device will be secured (blown the security fuse) for MSP families 1xx, 2xx, and
4xx. For blowing the security fuse in these devices, the programmer provides Vpp 6.5 V at 100 mA on the
TEST or TDI lines to MSP MCU. An additional resistor inserted in these lines can reduce the maximum
current provided to the MCU and the security fuse will not be blown.
6.3 Question: How to serialize parts?
Answer: The MSP-GANG GUI does not provide serialization; however, the provided MSP-GANG.dll allows
to program unique data (for example, calibration or serialization) to each target device. An example to
implement serialization using MSP-GANG.dll is available in this directory:
C:\Program Files (x86)\Texas Instruments\MSP-GANG\Examples\CPP_Applications_MSP_DLL
6.4 Question: How to have parts run after programming?
Answer: By default in the MSP-GANG Programmer, the RESET line is forced to low level, which prevents
the target device running after being programmed. But that option can be modified using the pulldown
menu:
Setup > Finish Action
and selecting one of the options:
Hardware reset (RST line) and start the application program
OFF/ON the V
CC
and start the application program
Application Program Run time is programmable from 1 to 120 seconds or infinite time.
6.5 Question: What are possible reasons for the part to fail Verify step?
Answer: If the part was programmed and verified in the GO step, and after the second time the Verify step
failed, then in most cases the firmware is modifying flash contents when running for the first time. Usually
the Info memory is modified in that case. Ask your software team if the firmware downloaded to the MCU
is modifying the flash after the first run. If that is the case, then the firmware should be modified to contain
only unmodified contents in the code file. To compare the code file contents and flash data (if modified),
use this option from the pulldown menu:
View > Compare Code File and Flash Data
Revision History
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136
SLAU358QSeptember 2011Revised October 2019
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Copyright © 2011–2019, Texas Instruments Incorporated
Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from February 23, 2019 to October 8, 2019 ..................................................................................................... Page
Removed CISPR 24: 2010 / EN 55024:2010 and added CISPR 32:2012 / EN55032:2012/AC:2013 and related warning in
the CE section of FCC and CE Compliance........................................................................................... 8
Rev M - section 3.2.1 changed RSS-210 or RSS-247 ............................................................................ 137
Rev O - Added WARNING in section 2.3 ........................................................................................... 137
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
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1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
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or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
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2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
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been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
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User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
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warranty period.
WARNING
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professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.