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ONYX MILLING Once soldered SMD components normally can only be removed fr om the printed circuit board or substrate by using de-soldering pr ocesses applying massive heat to the de vice. With the novel ONYX Milling machi…
ONYX MILLING
Repair of SMD circuit boards
The distribution of this document is not permitted without express permission – 02.22
ONYX MILLING
Once soldered SMD components normally can
only be removed from the printed circuit board or
substrate by using de-soldering processes applying
massive heat to the device. With the novel ONYX
Milling machine, SMD components can be milled off
the substrate very precisely. A clean surface results,
perfect for the placement and soldering of new
components.
PRECISE REMOVAL OF COMPONENTS
The developed dust and particles from the milling process are
completely vacuumed in the closed processing chamber. The rest
solder between the printed circuit board and the component can be
removed mechanically and gently up to an exact denable height.
Potential “underll” material can also be removed within the same
process. Trough parallel milling of the existing solder, printed circuit
boards, master cards or substrates can be prepared for the placement
of new components. The substrate is not harmed by the milling
process and provides excellent surface conditions for the solder
process of the new components and neighbor components are not
being inuenced. New components can be placed and soldered
immediately with other products from Zevac, e.g. with the ONYX 29.
For forensic applications, instead of the substrate, the actual
components can be saved by milling out the substrate below the
component.
• High frequency precision spindle
up to 80`000 min
-1
• Entire process without any tool change
• Different tools with e.g. diamond coating
• Automatic tool calibration in X / Y and Z direction
• X and Y linear motors
• Precise process accuracy, precision in μm
• Integrated exhaust device of the processing head
• Down looking image data processing
• Circuit board holder
• ONYX Milling application software
MAIN FEATURES
Swiss Engineering
APPLICATION RANGE
• Components with «underll» can be removed precisely without any impact of heat
• Connectors and metal BGA can be detached easily
• Painted printed circuit boards can be edited
• Component salvage by milling the printed circuit board
• Minor SMD parts are removable fast and precisely
• Printed circuit boards, master cards or substrates can be prepared for the placement of new components
• A clean surface results, perfect for the placement and soldering of new components
• Optionally the ONYX Milling machine can also be expanded to a dispensing machine to apply new solder
ONYX MILLING – PRECISE REMOVAL OF COMPONENTS
Swiss Engineering