Momentum_II_BTB - 第4页
Momentum ® II BTB Innovative Standard and Optional Features NEW Paste Heigh t Monitor The Paste Height Monitor is designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced sof…
Precision and Performance in a
Compact and Flexible Configuration
Space-saving Configuration without Compromise
The MPM Momentum® II BTB is a space-saving 200 mm shorter than the standard Momentum.
Configured for Back-to-Back (BTB) processing, it enables dual lane processing with two machines,
conserving floor space and creating a shorter manufacturing line length, but without sacrificing
volume or yields. Momentum® II BTB is also designed with all-front access to the entire electrical
system, solvent reservoirs, etc. so that no extra space is required for accessibility between the
machines in BTB setup. MPM Momentum® II BTB printers feature the same ±11 micron alignment
repeatability, with wet print accuracy of ±17 microns @ 6 sigma, Cpk ≥2.0, designed in and
independently verified. MPM Momentum printers are fast, precise, and highly reliable, with
performance unmatched by any other printer in their class.
Optimizing Productivity through Flexibility
Momentum® II BTB optimizes operator utilization rates for dual lane lines, and utilization of
factory floor space. What’s more, individual units can be easily redeployed as needs change.
Available with optional shuttle conveyors.
Momentum® II BTB New Features
¡ Newly designed cover set with larger
window and wider access inside the printer.
¡ Quick release squeegee for faster changeover.
¡ Adjustable stencil shelf
for exibility handling board varieties.
¡ EdgeLoc II and EdgeLoc+
for precise board clamping.
¡ New jar paste dispenser
for increased productivity.
¡ Solder paste roll height monitoring and
paste temperature monitoring
for yield improvement and traceability.
¡ Upgraded Benchmark GUI with
customizable production page and
Quickstart program.
¡ Windows 10 operating system.
Momentum® II BTB
Innovative Standard and Optional Features
NEW Paste Height Monitor
The Paste Height
Monitor is designed to
prevent defects caused
by inadequate volumes
of paste on the stencil.
It combines advanced
software and sensor technology to accurately monitor the
paste bead for volume consistency. Upper and lower limit
roll-height monitoring eliminates insufficient or excess paste
volumes. It is a non-contact solution that can automatically
add more paste to the stencil as it is needed.
NEW Paste Temperature Monitor
Temperature monitoring
ensures proper paste
viscosity to avoid
bridging and voiding.
MPM patent-pending
paste temperature
monitor allows paste
to be measured in the
cartridge or on the
stencil.
NEW Automatic Paste Dispensing System
Dispense for standard
cartridges or choose the
new patent-pending
jar dispenser. Paste
is released in precise,
measured amounts
across the stencil in a
clean, uniform bead. Deposition volumes, frequency and
placement are user programmable.
NEW Quick Release Squeegee
New quick release
squeegee blades makes
changing blades quick
and easy with no tools
required. It takes less
than 30 seconds to
change the blade.
Updated Benchmark™ User Interface
Easy to learn and use for the average operator, MPM’s
Benchmark software is powerful yet intuitive, and facilitates
rapid setup, assists with operational tasks, and makes
changeover quick and
easy. The software
has been upgraded
to Windows 10 and
new production tools
and new Quickstart
programming to make it
even easier to use.
NEW EdgeLoc™ Board Clamping
The EdgeLoc system
uses a side snugging
technique that removes
the need for top clamps
which interfere with the
PCB to stencil contact.
The result is optimal gasketing and more volumetrically
consistent edge-to-edge prints. With EdgeLoc II, robust
flippers engage to secure the board across the top edge
ensuring board flatness then move out of the way once
the board is firmly gripped from the side. EdgeLoc+ board
clamping can change between edge and top clamping
simply through software.
NEW Adjustable Stencil Shelf
Provides the exibility to handle all stencil sizes with
a simple adjustment of the shelf. The robust design
provides better stability on all stencil sizes.
OpenApps™
MPM’s OpenApps is an open architecture source code which
provides the capability of developing custom interfaces in
support of Industry 4.0 initiatives and communication with
Manufacturing Execution Systems (MES). ITW EAE is the rst
SMT company to oer open software architecture.
Momentum® II BTB
RapidClean
RapidClean is a high-speed stencil solvent cleaning innova-
tion that slashes cycle time and improves stencil cleaning
performance, especially for ne-pitch. RapidClean reduces
3 wipe strokes to 2 and cuts cycle time by 5 – 6 seconds per
print cycle over the standard wiper. And because fewer
cleaning cycles are
required, RapidClean
can save up to $10K
USD per annum in
paper savings per
printer.
EnclosedFlow™
The MPM EnclosedFlow Print Head delivers uniform
aperture lling and superb printing performance especially
for ne pitch devices, with tremendous savings on solder
paste over squeegee blade printing – in excess of 50% over
blades for dramatically fast ROI. Printing ne features such
as 01005s and 0.3mm
pitch CSPs with up to
50% greater vol-
ume and 25% lower
deviation than metal
blades.
Add Capability and Value to your Process
SPI Print Optimizer
SPI Print Optimizer brings your Solder Paste Inspection
(SPI) machine into communication with your MPM printer
through a specially-developed common interface. When
the SPI machine ‘sees’ X, Y and theta oset problems on
a just-printed PCB, it analyzes the data virtually instantly
and gives the printer instructions to correct those osets,
automatically, and ‘on the y’.
MPM Vision System & Inspection
MPM’s patented printer-
based Vision and Inspection
system is a cost-eective
way to verify print and
paste deposit results. It is
exible enough to handle
the complete range of today’s most challenging components.
This system measures the amount of paste covering the
target pad and compares it with the required coverage. 2D
inspection is integrated directly into the stencil printer to
provide an immediate source of data.
BridgeVision® and StencilVision™
BridgeVision is a patented method of analyzing bridge
defects on circuit boards in the post-print inspection process.
This innovative system
utilizes texture-based image
acquisition algorithms and a
digital camera system with
telecentric lenses to support
the accurate identication
of paste deposit defects.
StencilVision utilizes texture-
based technology to check the underside of a stencil for
solder paste contamination. Wiper operation can be driven
by the results obtained.
PrinTrack™
PrinTrack™ adds traceability, data harvesting and reporting
to your printing process. It can seamlessly integrate with
other equipment and elements in the manufacturing cycle,
such as MES and ERP, and can be expanded factory-wide.
AccuCheck Print Capability Verication
Accucheck Print Capability Verication
allows the printer to measure its own
print capability. Users can verify the
machine’s capability at any time or
continuously on their own products.
AccuCheck measures the actual print
deposit position versus the target pad
to determine a measured print oset. It is an inexpensive,
reliable method of obtaining machine quality and process
capability information to ensure repeatable results and
optimum printing performance.