SIPLACE S-23 HM - 第47页
User Manual SIPLAC E S-23 HM 1 Introduction, technical dat a Software Vers ion SR.406.xx 02/00 US Edition 1.14 Overview of the modules - vision systems 47 1.14 Overv iew of the modules - vision systems Each pl acement s …
1 Introduction, technical data User Manual SIPLACE S-23 HM
1.13 Overview of the modules - revolver head Software Version SR.406.xx 02/00 US Edition
46
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
1.13.2 Description of the 12-segment revolver head
– The 12-segment revolver head works using the "collect & place" principle, i.e. the components
are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle, are
placed gently and accurately on the PCB with the aid of forced air. The vacuum in the nozzles
is also checked several times to determine whether the components were picked up and set
down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– Defective components are rejected and are picked up again during a repair run.
1.13.3 Technical data - 12-segment revolver head
Range of components 0402 to PLCC44, including BGA, µBGA, flip-chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Maximum height 6 mm
Minimum lead pitch 0.5 mm
Minimum dimensions 0.5 mm x 1.0 mm
Maximum dimensions 18.7 mm x 18.7 mm
Maximum weight 2 g
Maximum travel of the z axis 16 mm
Programmable set-down force 2.4 to 5.0 N
Nozzle types 9xx
Angular accuracy ± 0.525° / 3 σ, ± 0.70° / 4 σ, ± 1.05° / 6 σ
Placement accuracy ± 67.5 µm / 3 σ, ± 90 µm / 4 σ, ± 135 µm / 6 σ
User Manual SIPLACE S-23 HM 1 Introduction, technical data
Software Version SR.406.xx 02/00 US Edition 1.14 Overview of the modules - vision systems
47
1.14 Overview of the modules - vision systems
Each placement system has 1
– two component vision cameras on the placement heads and
– two PCB vision cameras on the underside of the X-axis gantries.
1
The vision analysis unit is located in the control unit for the placement system and the component
vision system is used to determine: 1
– the precise position of the components at the nozzle and
– the geometry of the package form.
1
The PCB vision system uses fiducials on the PCBs to determine: 1
– the position of the PCB,
– its rotation angle
– and the PCB delay.
1
The PCB vision system also uses fiducials on the feeder modules to determine the exact pick-up
position of components, which is particularly important for small components. 1
1.14.1 Technical data - component vision module on the 12-segment revolver head
Maximum component dimensions 0.5 mm x 1.0 mm up to 18.7 mm x 18.7 mm
Range of components 0402 to PLCC44
including BGA, µBGA, flip-chip, TSOP, QFP
PLCC, SO to SO32, DRAM
Lead spacing 0.5 mm
Field of vision 24 mm x 24 mm
Illumination method Front-lighting
(3 levels programmable as required)
1 Introduction, technical data User Manual SIPLACE S-23 HM
1.14 Overview of the modules - vision systems Software Version SR.406.xx 02/00 US Edition
48
1.14.2 Technical data - PCB vision module
Fiducials Up to 3 per placement program
Local fiducials Up to 2 per component (may be of different types)
Library size Up to 255 fiducial types - system fiducials ≥ 249
Image processing Gray scale-based correlation
Illumination method Front-lighting
Recognition time per fiducial/ink spot 0.4 s
Field of vision 5.7 mm x 5.7 mm