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1 Machine Safety Room for Your Sketches and Notes 14 Technical Training SIPLACE TX-Series 10/2016

1 Machine Safety
Room for Your Sketches and Notes
Technical Training SIPLACE TX-Series 10/2016 13
Room for Your Sketches and Notes

1 Machine Safety
Room for Your Sketches and Notes
14 Technical Training SIPLACE TX-Series 10/2016

2 Machine Basic Overview
2.1 Introduction
Technical Training SIPLACE TX-Series 10/2016 15
2 Machine Basic Overview
2.1 Introduction
SIPLACE TX Series placement machine offers all the innovations and features to ensure efficient
electronics production and provides previously unavailable ways to increase flexibility, efficiency
and productivity.
SIPLACE TX placement machines are available in following variants:
●
SIPLACE TX1
●
SIPLACE TX2
●
SIPLACE TX2i
●
SIPLACE TX2 micron
●
SIPLACE TX2i micron
●
SIPLACE TX2i micron 15µm
●
The numbers in the type name indicate the number of gantries used. Each gantry has one
placement head.
●
SIPLACE TX Series covers the entire range of common components with only three
placement heads. The machines have one placement area with standard dual conveyor
configuration.
●
Because of differences in the hardware it is not possible to upgrade a TX machine to a TX
micron.
TX Standard Machine Specifications *
Specification details* Value
Benchmark** IPC value 67,000 comp./h
Benchmark value 78,000 comp./h
Theoretical value 103,800 comp./h
Component range 0201 (metric) - 55 mm x 45 mm or 75 mm x 10
mm
Component height 25 mm max.
Placement accuracy
●
C&P20 P ± 30μm (3σ),
●
CPP ± 40μm (3σ), ± 34 μm (3σ) with camera
type 33
●
Twin Head ± 28 μm (3σ), ± 22 μm (3σ)
camera type 25
PCB weight / thickness 2 kg / 0.3to4.5mm
Flexible dual conveyor 50 mm x 45mm to 375mm x 20mm
Flexible dual conveyor in single conveyor
mode
45 mm x 45mm to 375mm x 460mm
Electrical connections 3 x 360 V~ to 3 x 415 V~ ± 10 %; 50/60 Hz
3 x 200 V~ to 3 x 240 V~ ± 10 %; 50/60 Hz
Pneumatic connection values min. 0.5 MPa = 5.0 bar - max.1.0 MPa = 10 bar
*For detailed specification refer to the TX-series user manual or the machine specification
document.
**Placement performance (depends on head machine configuration)