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10 Condenso series CondensoX C Optimal results with the smallest footprint The CondensoXC is a space-saving, powerful system for laboratory applications, small series production and prot o - typing. Exact pr oling by me…
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Condenso vacuum technology is used in a wide range of processes. Oxidation is reduced
for drying and adhesive processes, and soldered joint reliability is increased during
reow soldering by reducing voids.
Condenso vacuum technology
for void-free results
›
Pre-vacuum:
- Prevention of oxidation, drying (solder paste, adhesives)
- Homogeneous Galden-gas-distribution (3-dimensional soldering)
- Micro wave plasma (pre-cleaning)
›
Vacuum during reow soldering: Improved wetting
›
Vacuum after reow soldering: Avoiding voids
Surface contacts
up to 99 %
Improved lling of
micro vias and
THD-solder joints
Minimum of voids
(particularly important on
power electronics)
Improved
wetting
With VacuumWithout Vacuum
Condenso series | Vacuum
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Condenso series
CondensoXC
Optimal results with the smallest footprint
The CondensoXC is a space-saving, powerful system for
laboratory applications, small series production and proto-
typing. Exact proling by means of the injection principle and
the option of soldering under an inert atmosphere provides
the optimal soldering results. Void-free soldering can also be
carried out easily with the vacuum option, which increases
the reliability of assemblies signicantly.
With a footprint of just 2.3 m², this system is specially de-
signed for small series and is also ideal for prototype produc-
tion. As a batch system, it can be used flexibly, irrespective of
the production environment.
Stable process for reliable results
Process chamber for a maximum assembly size of 500 x 540 mm (W x L)
Camera for process observation (optional)
Patentierted injektion prinziple
Vacuum process (optional)
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Loading Concept
The possibilities of CondensoXC
Handling
Gentle cooling
Front loading with pre-assembled product carriers
The CondensoXC is manually loaded with pre-as-
sembled product carriers from the front on the
operator’s side. In this way, the assemblies can
be easily placed on and removed from the inter-
changeable product carriers. The product carrier
is on a rail system to ensure full access to the
working area. Assemblies up to 500 x 540 mm
(W x L) can be placed on the product carriers.
Gentle cooling processes by convection
After the soldering process, the assembly is
cooled by convection to the required temperature.
After cooling the bulkhead opens automatically
and the product carrier can be completely pulled
out on a rail for easy unloading. In addition, a
water-cooled cooling zone is optionally available
to enhance the cooling capacity.
3.
1. 4.
2.
1. Loading
2. Soldering/Vacuum
3. Cooling
4. Unloading
cooling
gentle