Condenso_Series_EN - 第18页
18 Condenso series CondensoX -Line Reliable and repeatable The CondensoX-Line enables v acuum condensation solde- ring processes to be easily integrated int o standard SMD lines. This allows void-free solder joints to be…
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Loading Concept
The possibilities of Condenso smartline
Automatic Loading
Internal carrier return transport
The Condenso smartline works with a pusher for loading
the product carriers already in the system. The assemblies
are pushed from a feed conveyor onto the product carrier.
The product carrier can be equipped with a centre support
for each track. A maximum of 6 tracks are possible on each
product carrier. The max. assembly size is 650 x 650 mm.
Unloading of the product carriers is also carried out with
the pusher, which moves them onto the downstream con-
veyor belt.
The product carriers in the Condenso smartline are moved
internally from the unloading area back to the loading area.
As a result, no additional magazine modules or external
product carrier systems are required in the area around the
system. This saves space and also reduces the amount of
contamination of the product carriers thanks to the closed
loop system, thereby ensuring that little servicing work is
required and downtimes are reduced.
1. Loading
2. Inlet area
3. Soldering/Vacuum
4. Cooling
5. Unloading
1.
5.
2.
3.
4.
18
Condenso series
CondensoX-Line
Reliable and repeatable
The CondensoX-Line enables vacuum condensation solde-
ring processes to be easily integrated into standard SMD
lines. This allows void-free solder joints to be manufactured
in a completely inert process environment (<100ppm O2),
whether they are standard modules with BGA devices or DCB
substrates for power electronics.
By building a 3-chamber system, low cycle times can be
achieved for inert soldering processes. The nal gas-tight
cooling chamber provides for controlled and rapid cooling
of the assemblies by means of adjustable convection with
less than 100 ppm residual oxygen in the atmosphere. The
CondensoX-Line meets the highest demands of mass pro-
duction in the power electronics.
Ideal for the processing of massive assemblies (IGBT, Heatsinks)
Reliable condensation soldering process for SMD manufacturing in a continuous process
Horizontal transport of the modules of the entire process
Inert process atmosphere during the entire soldering process
Cooling section can be used with <100ppm residual oxygen
Void-free soldering with the use of vacuum for best results
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Loading Concept
The possibilities of CondensoX-Line
3-chamber system
for flux-free process control – which is a rst in the world of
vapour phase soldering systems! Controlled, rapid assembly
cooling can be achieved with less than 100 ppm residual
oxygen in the atmosphere using controllable convection in
the nal, gas-tight cooling chamber. In this way, void-reduced
soldered joints can be made in a completely inert process
environment, irrespective of whether this is with standard
assemblies with BGA components or a DCB substrate for
power electronics.
The CondensoX-Line is set up as a 3-chamber system to
achieve low cycle times with inline soldering processes. The
rst chamber provides a protective nitrogen atmosphere for
the products (pre-inerting) before it is transported to the ac-
tual soldering process. The second process chamber that is
suitable for vacuum can be flooded with nitrogen or forming
gases and provides an inert or activating and void-reducing
process atmosphere throughout the whole soldering pro-
cess. In addition, formic acid can be used as an option here
Construction of the 3-chamber system of the CondensoX-Line
1. Loading
2. Pre-chamber/Pre-inerting
3. Soldering/Vacuum
4. Cooling
5. Unloading
1.
2.
3.
5.
4.
Cooling chamber
Pre chamber
Process chamber