Condenso_Series_EN - 第19页
19 Loading Concept The possibilities of CondensoX -Line 3-chamber system for flux-free process contr ol – which is a rst in the world of vapour phase soldering systems! Controlled, rapid assembly cooling can be achieved…
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Condenso series
CondensoX-Line
Reliable and repeatable
The CondensoX-Line enables vacuum condensation solde-
ring processes to be easily integrated into standard SMD
lines. This allows void-free solder joints to be manufactured
in a completely inert process environment (<100ppm O2),
whether they are standard modules with BGA devices or DCB
substrates for power electronics.
By building a 3-chamber system, low cycle times can be
achieved for inert soldering processes. The nal gas-tight
cooling chamber provides for controlled and rapid cooling
of the assemblies by means of adjustable convection with
less than 100 ppm residual oxygen in the atmosphere. The
CondensoX-Line meets the highest demands of mass pro-
duction in the power electronics.
Ideal for the processing of massive assemblies (IGBT, Heatsinks)
Reliable condensation soldering process for SMD manufacturing in a continuous process
Horizontal transport of the modules of the entire process
Inert process atmosphere during the entire soldering process
Cooling section can be used with <100ppm residual oxygen
Void-free soldering with the use of vacuum for best results
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Loading Concept
The possibilities of CondensoX-Line
3-chamber system
for flux-free process control – which is a rst in the world of
vapour phase soldering systems! Controlled, rapid assembly
cooling can be achieved with less than 100 ppm residual
oxygen in the atmosphere using controllable convection in
the nal, gas-tight cooling chamber. In this way, void-reduced
soldered joints can be made in a completely inert process
environment, irrespective of whether this is with standard
assemblies with BGA components or a DCB substrate for
power electronics.
The CondensoX-Line is set up as a 3-chamber system to
achieve low cycle times with inline soldering processes. The
rst chamber provides a protective nitrogen atmosphere for
the products (pre-inerting) before it is transported to the ac-
tual soldering process. The second process chamber that is
suitable for vacuum can be flooded with nitrogen or forming
gases and provides an inert or activating and void-reducing
process atmosphere throughout the whole soldering pro-
cess. In addition, formic acid can be used as an option here
Construction of the 3-chamber system of the CondensoX-Line
1. Loading
2. Pre-chamber/Pre-inerting
3. Soldering/Vacuum
4. Cooling
5. Unloading
1.
2.
3.
5.
4.
Cooling chamber
Pre chamber
Process chamber
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Innovative software
Big data and process management
Integrating highly specialised software in modern manufacture will become more and
more common in future. Systems and processes are managed, monitored, analysed and
optimised. The order, product data, eciency and status data, specied settings, archived
proles and current values are incorporated into the machine control system product
documentation and analysis.
With ViCON Condenso, Rehm offers a clear software package for the Condenso series that
is intuitive to use with its touchscreen interface. All messages, commands and parameters
are visible at a glance on the main screen with its machine view. Simple proling with clearly
structured process stages is therefore possible – with or without the vacuum option.
With numerous other features, such as a favourites bar that can be set up as required, struc-
tured grouping of parameters and individual process monitoring and documentation, ViCON
offers you optimal support for your manufacturing processes.