Condenso_Series_EN - 第4页
4 The Condenso series system versions can be integrated into a wide range of manufacturing environments. Whether it’ s a batch operation, inline connection or continuous soldering – Rehm offers the highest degree of proc…
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Condenso series | Overview
The Condenso series at a glance
Flexible and adjustable
Do you process large and heavy boards for which condensation soldering is out of the question? Or do you
want a system that you can reliably carry out vacuum processes with at any time? Then choose a Condenso-
Series system that can be customised to your manufacturing environment!
CondensoXC
Space-saving and powerful
› Batch system for low throughput
› Used in laboratory applications, small production
lines or prototyping
CondensoXM smart
All-rounder for electronics production
› Inline system for medium throughput
› Autom. side Loeading/unloading with pre-
assembled carriers
› Used for small and medium-sized series
Condenso smartline
Ideal for large series
› Inline connection for medium throughput
›
Automatical loading, internal carrier return
transport
› Used in series production
CondensoXS smart
Great performance with a small footprint
› Inline ready system for medium throughput
› Low space requirements
› Ideal for small-series production
CondensoX-Line
Reliable in the through-feed process
›
Inline system for high throughput
› 3-chamber system and built-in vacuum soldering
› Series manufacture and power electronics
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The Condenso series system versions can be integrated into a wide range of
manufacturing environments. Whether it’s a batch operation, inline connection
or continuous soldering – Rehm offers the highest degree of process reliability
for all areas!
The application options for the Condenso series are as varied as their production.
We would be happy to determine the most efcient system for your manufac-
turing process, taking all relevant processes such as throughput, assembly size,
thermal mass and follow-up processes into account.
›
Patented injection principle – reproducible reow prole
›
Hermetically sealed process chamber
›
Controllable vacuum process – Pre-vacuuming und vacuum feasible after soldering
›
No Galden
®
spreading, active Galden
®
ltering
›
Process monitoring with a wireless WPS system (not with CondensoXC)
Vapour phase soldering
in every manufacturing environment
Condenso series | Patented principle
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With the Condenso series, a far greater amount
of exibility is available for the condensation
soldering process than can be achieved with
the conventional method. Using the injection
principle and temperature and pressure (vacu-
um) control ensure more accurate and versatile
reow proling.
The soldering process takes place in a hermet-
ically sealed process chamber. A lm of fluid
builds up during condensation soldering using
the heat-conducting medium Galden
®
, which
surrounds and vaporises the entire assembly.
The steam condenses on the assembly until a
soldering temperature of 240°C (e.g. when using
HS240) is achieved. Galden
®
is a perfluorpolyether
– fluid polymers that consist of carbon, fluoride
and oxygen. Rehm applies a patented injection
principle to improve control of the condensation
phase. Exactly the right amount of Galden
®
is
incorporated at the right time. Then, during this
process, redundant, latent heat is used when
changing the state of the medium from vaporous
to fluid to evenly and steadily heat the assembly.
The max. temperature of the assembly cannot
exceed the max. boiling/condensation temper-
ature of the medium to ensure the components
don’t overheat.
The temperature/reflow prole of the assembly
can also be accurately adjusted by precise fluid
volume control and intermediate steam extraction.
Therefore, reproducible soldering conditions are
ensured that increase process stability. A vacuum
option is available with all Condenso systems for
optimum results that are virtually void-free.
Condenso – a patented principle
with clear advantages