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Momentum II Printers A prov en, highly-productive printer platf orm with a new set of enhanced technologies . Flexibility to meet growing demands Momentum II is designed and built to be a no-nonsense production machine. …

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Electronic Assembly Printers
Edison Printer
The most accurate printer in the market,
with advanced technology needed
for ne pitch applications.
Unmatched Accuracy and Speed
The Edison is the most accurate printer in the market.
Edison has built-in ±8 microns alignment, and ±15 microns
wet print repeatability (≥2 Cpk @ 6 sigma) proven through
CeTaq Print Capability Analysis (PCA) testing.
The Edison has a total throughput that is much faster than
current leading printers due in part to the highly-efficient
parallel processing of the stencil shuttle system, stencil
wiping, and vision alignment system.
This incredibly fast cycle time leaves room for extra steps
that improve the quality of critical electronics. Slower stencil
separation for optimal print definition, more frequent wiping
and a double print stroke after wiping all lead to improved
quality and yield.
Ultra-fine pitch and aperture printing
Component miniaturization, particularly in the smart device
market imposes technical challenges for printing equipment.
The MPM Edison meets these challenges with a 25% improve-
ment in wet print accuracy over current best-in-class printers.
Edison is optimized for ultra-fine pitch (0201M) printing with
a transfer efficiency up to 75% for small apertures. Single axis
closed-loop pressure control for the dual squeegee elimi-
nates front-to-back variation and maintains the set pressure
across the entire board surface.
Back To Back (BTB) Configurable
Ultra-fast, High Efficiency Wiping
A super-size 65m paper roll with patented constant
tension control, makes 10,000 prints possible before
a roll change is needed, reducing downtime and
operator interface. Wiping zone is isolated from
printing zone to avoid cross contamination.
Best Performance Closed-loop Squeegee
A single high precision load cell with closed-loop
pressure control and motor drive system enable
precise and consistent squeegee force control across
print stroke in both directions, which helps improve
yields especially for challenging thin substrate
printing in the semiconductor industry.
NEW Board Staging
The ability to have three boards in the machine
simultaneously. Pre-loading the board during the
print process results in reduced transfer times and
improved cycle time.
Fine pitch printing
Most Accurate
Fastest
Momentum II Printers
A proven, highly-productive printer
platform with a new set of enhanced
technologies.
Flexibility to meet growing demands
Momentum II is designed and built to be a no-nonsense
production machine. Cost-efficient and featuring a modest
footprint, it grows with the user; innovative patented fea-
tures can be added on or retrofitted as needed as the user’s
throughput demands grow.
Momentum’s alignment repeatability is ±11 microns
@ 6 sigma, Cpk ≥2. Wet print accuracy is ±17 microns
@ 6 sigma, Cpk ≥2. Tighter performance tolerances mean
higher repeatability with fewer defects.
The Momentum II series is designed with production needs
and the needs of the operator in mind. They’re champion
performers, meeting the demands of high throughput and
accuracy, yet at the same time are easy to learn, easy to use,
and offer user-friendly features including built-in wizards in
the Benchmark software program that provide direction for
all machine functions, utilities, and error recovery.
High Performance
Momentum® II New Features
Newly designed cover set with larger window
and wider access inside the printer
Solder paste roll height monitor for both upper
and lower limits and out of range alert
Solder paste temperature monitor measures on
stencil and cartridge and has out of range alert
Quick release squeegee for faster changeover
Upgraded Benchmark GUI with new production
tools and easy to use Quickstart program
Support pin placement and verification
with bottom-side image alignment
New jar paste dispenser for increased productivity
Adjustable stencil shelf
EdgeLoc+ edge and top board clamping
NEW
Automated Support-Pin Placement
The Elite and HiE offers MPM’s patented tooling solu-
tion automatically places support pins in a software
programmable pattern simplifying both initial set-
up and product changeover. The newly developed
feature allows pin location to be easily identified and
verified with a bottom side image whether placing
pins automatically or manually.
Momentum® II Elite's Triple-Track
Processing Speed and Efficiency
The Momentum II Elite is the only MPM printer with
triple-track. All other MPM printers feature a single rail.
With triple track, cycle time is shortened because boards
don’t have to move single-file through the printer. A
new board can be indexed into the machine and posi-
tioned next to the center nest, readying to print, while
the two others are being loaded and offloaded. Instead
of one-board-at-a-time linear processing, cycle time can
be shaved by buffering PCBs inside the machine.
Features and Enhanced Technology
NEW Quick Release Squeegee
New quick release squeegee blades make changing
blades quick and easy
with no tools required.
It takes less than 30
seconds to change
the blade.
EnclosedFlow Printhead
EnclosedFlow ensures optimal aperture filling for fine
pitch devices and through-hole applications with crisp
uniform printing and less waste. Solder paste is held
within an enclosed chamber and is directly mechanically
pressurized during the print stroke.
RapidClean
RapidClean is a high-speed stencil solvent cleaning
innovation that slashes cycle time and improves stencil
cleaning performance, especially for fine-pitch. Rapid-
Clean reduces 3 wipe strokes to 2 and cuts cycle time by
5 – 6 seconds per print cycle over the standard wiper.
And because fewer
cleaning cycles are
required, RapidClean
can save up to $10K
USD per annum in
paper savings per
printer.
NEW
Automatic Paste Dispensing System
Dispense for standard cartridges or choose the new
jar dispenser. Paste is released in precise, measured
amounts across the
stencil in a clean, uni-
form bead. Deposition
volumes, frequency,
and placement are
user-programmable.
NEW Paste Height Monitor
The Paste Height Monitoring system is designed to
prevent defects caused by inadequate volumes of
paste on the stencil. It combines advanced software
and sensor technology to accurately monitor the paste
bead for volume consistency. Upper and lower limit
roll-height monitoring eliminates insufficient or excess
paste volumes. It’s a
non-contact solution
that can automatically
add more paste to the
stencil as it is needed.
NEW Paste Temperature Monitor
Patent-pending temperature monitoring ensures
proper paste viscosity to avoid bridging and voiding.
MPM paste temperature monitor allows paste to be
measured in the cartridge and/or on the stencil.
NEW Adjustable Stencil Shelf
Provides the flexibility to handle all stencil sizes with
a simple adjustment of the shelf. The robust design
provides better stability on all stencil sizes.
NEW EdgeLoc Board Clamping
The EdgeLoc system uses a side snugging technique that
removes the need for top clamps which interfere with the
PCB to stencil contact. The result is optimal gasketing and
more volumetrically consistent edge-to-edge prints. With
EdgeLoc II, robust flippers engage to secure the board
across the top edge ensuring board flatness then move out
of the way once the board is firmly gripped from the side.
EdgeLoc+ board
clamping is able to
change between
edge and top clamp-
ing simply through
software.
Camalot Inside™
Improve your production line’s flexibility and productiv-
ity with Camalot patented dispensing technology inside
the Momentum II
Elite and HiE. Includes
dual dispensing heads
mounted to the wiper
gantry.