OM-1076-001.pdf - 第147页
3.1 General Components (ICs excluded) 0107-001 3-8 Tg0502-PM-CL Fig. C7 3.1.4 T aping Specifications (1) Applicable Components Component T ype Abbreviations Part Name DI DI Diode TR HEMT HEMT (Cross-Shaped Components) TR…
3.1.3 Abbreviated Name of Component Makers
The pre-determined abbreviated maker names are used for clear iden-
tification.
List of Abbreviated Maker Names
Table C2
No.
Makers
Abbreviation No.
Makers
Abbreviation
1 Alps Electric Co., Ltd. ALP
2 Intel INT
3 Kyocera Elco ELC
4 Omron OMR
5 Kamaya Electric Co., Ltd. KAM
6 Kyocera KYO
7 Kinseki KIN
8 Kyowarika KWR
9 Goyodensi GOY
10 KOA KOA
11 Sagamimusen SAG
12 SANYO Electric Co., Ltd. SAN
13 Rubikon SIN
(Former Name: Sineitsusin)
14 Citizen Electronics CIT
15 Sharp SHA
16 Stanley STA
17 Shinnihonmusen JRC
18 Sizuki Denki SIZ
19 Susumu Kogyo SSM
20 Seiko Electronics SEI
21 Sosin Denki SOS
22 Sony SON
23 SMK SMK
24 TDK TDK
25 Taiyo Yuden YUD
26 Taiyosha Denki TAI
27 Texas Instruments T.I
28 Toshiba TOS
29 Tokou TOK
30 National Semiconductor NAS
31 Nichicon NIT
32 Nichicon Supulagu NIS
33 Nihon AMP AMP
34 NEC NEC
35 Hitachi Seisakujo HIT
36 Fuji Dengyo FJD
37 F.D.K. Powertronics FDK
(Former Name: Fuji Denki Kagaku)
38 Philips PHI
39 Hokuriku Denki Kogyo HOK
40 Matsushita Electronics MAT
41 Mitsubishi Denki MIT
42 Mitsubishi Material MMC
(Former Name:
Mitsubishi Kogyo Cement)
43 Mitsumi Denki MTM
44 Murata Seisakujo MUR
45 Motorolla MOT
46 Moririka MOR
47 Riken Dengu Seizo RIK
48 Rhom ROM
49 AVX (Former Name: Rhom AVX) AVX
50 XEBEC XEB
51 Citizen Watch CIW
52 Elnar ELN
53 Seiko Epson EPS
54 Exa EXA
55 Fujitsu FJT
56 Hewlett-Packard H.P
57 Hirose Denki HIR
58 Harris HRS
59 ITT ITT
60 Linear Technology LIN
61 Nihon Motorolla MOJ
62 Matsuo Denki MTO
63 Nihon Chemicon NCC
64 Nihon Inter NIN
65 Japan Aeroelectronics JAE
66 Nihon Molex NMO
67 Oki Denki Kogyo OKI
68 Shin Dengen Kogyo SDG
69 Signetechs SIG
70 Sumida Denki SMI
71 Siemens SMS
72 Tama Denki Kogyo TAM
73 Taiyo Denki TDE
74 Towa Electron TOW
75 Yokokawa Hewlett-Packard YHP
0107-001 3-7 Tg0502-PM-CL
3.1 General Components (ICs excluded)
3.1 General Components (ICs excluded)
0107-001 3-8 Tg0502-PM-CL
Fig. C7
3.1.4 Taping Specifications
(1) Applicable Components
Component Type Abbreviations Part Name
DI DI Diode
TR HEMT HEMT (Cross-Shaped Components)
TR Transistor
CPTR Compact Power Transistor
MPTR Mini Power Transistor
PTR Power Transistor
TC TC Trimmer Capacitor
VR VR Semi-Fixed Variable Resistor
(2) How to Determine Packaging Direction
Packaging directions are determined as shown below, following
"JIS C0806 Taping of Electronic Components".
Table C3
3.1 General Components (ICs excluded)
0107-001 3-9 Tg0502-PM-CL
(3) Taping Specifications
15th and 16th cells are added in the component ID, representing
the taping specifications. Each character in the cells represents
the following.
Component ID: 15 16
15th Cell : The specified character represents the location
(direction) of leads.
L : This represents that leads are located on the left side
in the user direction of component feed.
R : This represents that leads are located on the right side
in the user direction of component feed.
F : User Direction of Component Feed
B : Backward Direction
16th Cell : The specified character represents the number or
thickness of leads.
1 : 1 pc.
2 : 2 pcs.
3 : 3 pcs.
B: Thick Lead
Example:(a)
TR1608-3B0SAN- L 1
This represents that there is a lead on the "L" side
in the user direction of component feed.
(b)
TR2915-4B0SAN- R B
This represents that there is a thick lead(s) on the
"R" side in the user direction of component feed.