OM-1076-001.pdf - 第152页

3.2 ICs 01 11-002 3-13 Tg0502-PM-CL : # o f electrodes Fig. C17 List of Abbreviated Component Names Basic Form for Component ID (front 7 figures) ............ Shows the Number of Leads. T able C4 Component T ype Abbr . P…

3.2 ICs

3.2.1 Component Name and No. of Leads

The characters from the first to the seventh show the component name

and number of leads.

Be sure to use an English letter (A to Z) in the 1st cell.

(1) Component Names (Abbreviated Ones)

Each component name is expressed using its specified compo-

nent abbreviation.

Example: "SOP008-"

SOP-Type IC with 8 Leads

3.2 ICs

Component ID:

13121110987654321 15 16

3.2.1 Component Name and No

of Leads

3.2.2 Serial No.

3.2.3 Abbreviated Name of

Component Makers

3.2.4 Taping

Specifications

0111-002 3-12 Tg0502-PM-CL

Fig. C16

3.2 ICs

0111-002 3-13 Tg0502-PM-CL

: # of

electrodes

Fig. C17

List of Abbreviated Component Names

Basic Form for Component ID (front 7 figures)

............ Shows the Number of Leads.

Table C4

Component Type Abbr. Part Name ID (First 7 Digits) Remarks

IC SOP SOP Type IC SOP -

VSOP SOP whose lead pitch is VSOP

1.0 mm or less

HSOP SOP with Heat Sink HSOP

VHSOP (P) VSOP with Heat Sink VHSO

SOJ SOJ-Type IC SOJ -

QFP QFP-Type IC QFP -

VQFP QFP whose lead pitch is VQFP

less than 0.65 mm

HQFP QFP with Heat Sink HQFP

VHQF VQFP with Heat Sink VHQF

PLCC PLCC-Type IC PLCC

LCC LCC-Type IC LCC -

BGA BGA-Type IC BGA -

(2) Number of Leads, etc.

(2.1) Number of Leads

The number of leads is specified in the cells ( n n n n )

after the abbreviated name of a component.

Example: SOP

S O P 0 0 8 -

3.2.2 Serial No.

The 8th, 9th, and 10th cells represent a serial No.

When the same characters are entered in the 1st through 7th and 11th

through 13th cells but each parameter differs, this serial No. is used to

identify the component.

8th Cell : Fill the cell with a character "A to Z".

9th and 10th Cells : Fill the cells with a number "0 to 9".

Number of Leads

3.2.3 Abbreviated Name of Component Makers

The pre-determined abbreviated maker names are used for clear iden-

tification.

Refer to "3.1.3 Abbreviated Name of Component Makers" for details.

3.2.4 Taping Specifications

(1) Applicable Packaging Types and Components

• Applicable Packaging Types

Paper, Embossed, Adhesive, Tray and Stick

• Applicable Components

See the table below.

Component Type Abbreviations Part Name

IC SOP Small Outline Package IC

VSOP SOP whose lead pitch is

1 mm or less

VHSOP VSOP with Heat Sink

QFP Quad Flat Package IC

VQFP QFP whose lead pitch is less

than 0.65 mm

PLCC Plastic Leaded Chip Carrier IC

BGA Ball Grid Array-Type IC

3.2 ICs

0111-002 3-14 Tg0502-PM-CL

Table C5