OM-1076-001.pdf - 第153页
3.2.3 Abbreviated Name of Component Makers The pre-determined abbreviated maker names are used for clear iden- tification. Refer to "3.1.3 Abbreviated Name of Component Makers" for details. 3.2.4 T aping Specif…

3.2 ICs
0111-002 3-13 Tg0502-PM-CL
: # of
electrodes
Fig. C17
List of Abbreviated Component Names
Basic Form for Component ID (front 7 figures)
............ Shows the Number of Leads.
Table C4
Component Type Abbr. Part Name ID (First 7 Digits) Remarks
IC SOP SOP Type IC SOP -
VSOP SOP whose lead pitch is VSOP
1.0 mm or less
HSOP SOP with Heat Sink HSOP
VHSOP (P) VSOP with Heat Sink VHSO
SOJ SOJ-Type IC SOJ -
QFP QFP-Type IC QFP -
VQFP QFP whose lead pitch is VQFP
less than 0.65 mm
HQFP QFP with Heat Sink HQFP
VHQF VQFP with Heat Sink VHQF
PLCC PLCC-Type IC PLCC
LCC LCC-Type IC LCC -
BGA BGA-Type IC BGA -
(2) Number of Leads, etc.
(2.1) Number of Leads
The number of leads is specified in the cells ( n n n n )
after the abbreviated name of a component.
Example: SOP
S O P 0 0 8 -
3.2.2 Serial No.
The 8th, 9th, and 10th cells represent a serial No.
When the same characters are entered in the 1st through 7th and 11th
through 13th cells but each parameter differs, this serial No. is used to
identify the component.
8th Cell : Fill the cell with a character "A to Z".
9th and 10th Cells : Fill the cells with a number "0 to 9".
Number of Leads

3.2.3 Abbreviated Name of Component Makers
The pre-determined abbreviated maker names are used for clear iden-
tification.
Refer to "3.1.3 Abbreviated Name of Component Makers" for details.
3.2.4 Taping Specifications
(1) Applicable Packaging Types and Components
• Applicable Packaging Types
Paper, Embossed, Adhesive, Tray and Stick
• Applicable Components
See the table below.
Component Type Abbreviations Part Name
IC SOP Small Outline Package IC
VSOP SOP whose lead pitch is
1 mm or less
VHSOP VSOP with Heat Sink
QFP Quad Flat Package IC
VQFP QFP whose lead pitch is less
than 0.65 mm
PLCC Plastic Leaded Chip Carrier IC
BGA Ball Grid Array-Type IC
3.2 ICs
0111-002 3-14 Tg0502-PM-CL
Table C5

3.2 ICs
0111-002 3-15 Tg0502-PM-CL
(2) Taping Specifications
14th, 15th, and 16th cells are added in the component ID, repre-
senting the taping specifications. Each character in the cells rep-
resents the following.
Component ID: 14 15 16
14th Cell : The specified character represents the width of a tape.
2: 8 mm B: 44 mm
3: 12 mm E: 56 mm
4: 16 mm J: 72 mm
6: 24 mm -: None
8: 32 mm
15th Cell : The specified character represents a component feed
pitch.
2: 8 mm 8: 32 mm
3: 12 mm 9: 36 mm
4: 16 mm A: 40 mm
5: 20 mm B: 44 mm
6: 24 mm -: None
7: 28 mm
16th Cell : The specified character represents a carrier type of
components.
P: Paper
E: Embossed
A: Adhesive
T: Tr a y
S: Stick
Example:(a)
SOP008-B01TOS 6 3 E
Tape Width: 24 mm, Component Feed Pitch: 12
mm, and Embossed Tape
(b)
SOP008-B01TOS 8 3 A
Tape Width: 32 mm, Component Feed Pitch: 12
mm, and Adhesive Tape