PyramaxVacuum-DataSheet-Revision-03-06-Web - 第2页
LEARN MORE Scan to download the complete presentation on the operation of the Pyramax Vacuum reflow oven including voiding data generated at the Advanced Process Lab. To contact BTU please go to www.btu.com/support-contac…
Pyramax Technology to Eliminate Solder Voids
The Pyramax Vacuum reflow oven has been designed for inline processing of PCB assem-
blies or products that require low solder voiding for critical performance applications. Heat
dissipation applications such as thermal pads on SMT components can benefit from vacuum
processing resulting in reduced solder voids, improved thermal transfer and increased yield.
The system has been designed with the requirements of large EMS, OEMs and high-volume
automotive segments in mind. Processing temperatures of up to 350°C can be achieved
with vacuum levels as low as 1 Torr. Integrated controls and fully automatic vacuum opera-
tion is achieved via BTU’s proprietary WINCON™, Windows™-based control system. The
system has a maximum processing width of up to 457 x 457 mm (18 x 18 inches).
Specifications*
Model Pyramax125N
Temperature Ratings:
Process Chamber 350°C
Vacuum Chamber 300°C
Convection Heated Zones 10 top and bottom
Vacuum Chamber Internal 1 top radiant panel heater
Vacuum Chamber Heat Assist 2 heated convection zones
Conveyor System edge rail support
Vacuum Chamber Zones 1 zone
Vacuum Chamber Size up to 457 x 457mm (18 x 18 inches) PCB
Vacuum Specifications:
Vacuum Level 20 Torr (1 Torr optional)
Pump Down Time 15-20 seconds (typical)
Hold Time 10-60 seconds
Refill Time 15 seconds (typical)
Atmosphere nitrogen / air
* All specifications are subject to change without notice
Key Benefits
• Solder voiding to <5%
• Thermal uniformity +/- 2°C
• Superior profile control
• Full MES integration
• Lowest liquidus time
Key Features
• Recipe controlled
vacuum parameters
• Bell Jar vacuum
chamber design
• Vacuum chamber
process heating
• Easy maintenance access
• Pass-thru mode
• Profile Guardian ready
LEARN MORE
Scan to download the complete presentation on the
operation of the Pyramax Vacuum reflow oven including
voiding data generated at the Advanced Process Lab.
To contact BTU please go to www.btu.com/support-contact-sales.htm
• Fully accessible design for
maintenance and serviceability
• Bell jar type chamber mechanism
for reliable vacuum sealing and
trouble-free operation
• High precision optical sensors
used for product tracking and
automatic sensing operations
• Stand-alone, oil-free vacuum
pump system
Traditional Reflow Vacuum Reflow
What is solder voiding?
Voiding occurs when flux or solder paste oxidation is
entrapped in the solder joint. There may be several
contributing factors to solder voiding. The solder paste
formulation, flux type, pad design, size of the pad, thermal
profile and stencil design are examples of contributing
factors. A common voiding area is in thermal pads. Shown at
right is an MFL processed with and without vacuum reflow.
BTU’s vacuum reflow solution is designed to reduce voiding
to <5% (process dependent).
Vacuum Chamber
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Revision 03, 2019