Momentum_II_Elite_HiE - 第4页
Momentum ® II HiE & Elite Momentum ® II HiE & Elite Features and Enhanced Technology that Deliver Measurable Value. NEW Paste Height Monitor The Paste Height Monitor is designed to prevent defects caused by inade…
Proven & Robust
Innovative Standard and Optional Features
Camalot Inside
Only ITW EAE, with industry-leading
core competencies in printer AND
dispenser technologies, can bring
both together to the customer’s
advantage. Camalot Inside consists of
two dispense pumps integrated into
one printing machine. Camalot Inside
provides ultimate flexibility, allowing
the dispensing of two different
materials, or the same material
(doubling dispense throughput
speed) with two needle sizes to easily
administer multiple dot sizes.
EnclosedFlow™
The MPM EnclosedFlow Print Head
delivers uniform aperture filling
and superb printing performance
especially for fine pitch devices,
with tremendous savings on solder
paste over squeegee blade printing
– in excess of 50% over blades for
dramatically fast ROI. Printing fine
features such as 01005s and 0.3mm
pitch CSPs with up to 50% greater
volume and 25% lower deviation than
metal blades.
RapidClean™
RapidClean is a high speed stencil
solvent cleaning innovation that
slashes cycle time and improves
stencil cleaning performance,
especially for fine-pitch. RapidClean
reduces 3 wipe strokes to 2 and cuts
cycle time by 5 – 6 seconds per print
cycle over the standard wiper; and
because fewer cleaning cycles are
required, RapidClean can save up to
$10K USD per annum in paper savings
per printer.
Triple Track Rail System
(Elite only)
A highly efficient triple track rail system
featuring an input buffer, a central
processing section, and an output
buffer. A new board can be indexed
into the machine and positioned
next to the centernest, readying to
print, while the two others are being
loaded and off loaded. Cycle time is
shortened because boards don’t have
to move single file through the printer.
Instead of one board at a time linear
processing, cycle time can be shaved
by buffering PCBs inside the machine.
Momentum
®
II HiE & Elite
Momentum
®
II HiE & Elite
Momentum
®
II HiE & Elite
Features and Enhanced Technology that Deliver Measurable Value.
NEW Paste Height Monitor
The Paste Height
Monitor is designed to
prevent defects caused
by inadequate volumes
of paste on the stencil.
It combines advanced
software and sensor technology to accurately monitor the
paste bead for volume consistency. Upper and lower limit
roll-height monitoring eliminates insufficient or excess paste
volumes. It is a non-contact solution that can automatically
add more paste to the stencil as it is needed.
NEW Paste Temperature Monitor
Temperature monitoring
ensures proper paste
viscosity to avoid
bridging and voiding.
MPM patent-pending
paste temperature
monitor allows paste
to be measured in the
cartridge or on the
stencil.
NEW Automatic Paste Dispensing System
Dispense for standard
cartridges or choose the
new patent-pending
jar dispenser. Paste
is released in precise,
measured amounts
across the stencil in a
clean, uniform bead. Deposition volumes, frequency and
placement are user programmable.
NEW Quick Release Squeegee
New quick release
squeegee blades makes
changing blades quick
and easy with no tools
required. It takes less
than 30 seconds to
change the blade.
Updated Benchmark™ User Interface
Easy to learn and use for the average operator, MPM’s
Benchmark software is powerful yet intuitive, and facilitates
rapid setup, assists with operational tasks, and makes
changeover quick and easy. The software has been
upgraded to Windows
10 and new production
tools and new Quickstart
programming to make it
even easier to use.
NEW EdgeLoc™ Board Clamping
The EdgeLoc system
uses a side snugging
technique that removes
the need for top clamps
which interfere with the
PCB to stencil contact.
The result is optimal gasketing and more volumetrically
consistent edge-to-edge prints. With EdgeLoc II, robust
flippers engage to secure the board across the top edge
ensuring board flatness then move out of the way once
the board is firmly gripped from the side. EdgeLoc+ board
clamping can change between edge and top clamping
simply through software.
NEW Adjustable Stencil Shelf
Provides the exibility to handle all stencil sizes with
a simple adjustment of the shelf. The robust design
provides better stability on all stencil sizes.
Real value can be measured in terms of yields. More good and reliable product with fewer defects.
Momentum delivers high yields, and higher profitability through a very low cost of ownership and
operational efficiency.
Auto Tooling Pin Placement
Automatic Pin Placement
is MPM’s patented
tooling solution that
uses the vision gantry
to precisely place and
remove tooling pins.
The carousel holds 48
pins to match and support the largest board size. A standard
grid for single sided boards or an exact pin placement for
double sided boards can be developed.
SPI Print Optimizer
SPI Print Optimizer brings your
Solder Paste Inspection (SPI)
machine into communication
with your MPM printer
through a specially-developed
common interface. When
the SPI machine ‘sees’ X, Y
and theta offset problems
on a just-printed PCB, it analyzes the data virtually instantly
and gives the printer instructions to correct those offsets,
automatically, and ‘on the fly’.
Momentum
®
II HiE & Elite
:
New Support Pin Placement Verication
Pin location can now be veried with bottom side image
whether placing pins automatically or manually.
MPM Vision System & Inspection
MPM’s patented printer-
based Vision and Inspection
system is a cost-effective
way to verify print and
paste deposit results. It is
flexible enough to handle
the complete range of today’s most challenging components.
This system measures the amount of paste covering the
target pad and compares it with the required coverage. 2D
inspection is integrated directly into the stencil printer to
provide an immediate source of data.
BridgeVision® and StencilVision™
BridgeVision is a patented method of analyzing bridge
defects on circuit boards in the post-print inspection process.
This innovative system
utilizes texture-based image
acquisition algorithms and a
digital camera system with
telecentric lenses to support
the accurate identification of
paste deposit defects.
StencilVision utilizes texture-
based technology to check the underside of a stencil for
solder paste contamination. Wiper operation can be driven
by the results obtained.
OpenApps™
MPM’s OpenApps is an open architecture source code which
provides the capability of developing custom interfaces in
support of Industry 4.0 initiatives and communication with
Manufacturing Execution Systems (MES). ITW EAE is the rst
SMT company to oer open software architecture.
PrinTrack™
PrinTrack™ adds traceability, data harvesting and reporting to
your printing process. It can seamlessly integrate with other
equipment and elements in the manufacturing cycle, such as
MES and ERP, and can be expanded factory-wide.
AccuCheck Print Capability Verication
Accucheck Print Capability Verication
allows the printer to measure its own
print capability. Users can verify the
machine’s capability at any time or
continuously on their own products.
AccuCheck measures the actual print
deposit position versus the target pad
to determine a measured print oset. It is an inexpensive,
reliable method of obtaining machine quality and process
capability information to ensure repeatable results and
optimum printing performance.