Momentum_II_Elite_HiE - 第5页

Real value can be measured in terms of yields. More good and reliable product with fewer defects. Momentum delivers high yields, and higher profitability through a very low cost of ownership and operational efficiency. A…

Momentum

II HiE & Elite

Momentum

II HiE & Elite

Features and Enhanced Technology that Deliver Measurable Value.

NEW Paste Height Monitor

The Paste Height

Monitor is designed to

prevent defects caused

by inadequate volumes

of paste on the stencil.

It combines advanced

software and sensor technology to accurately monitor the

paste bead for volume consistency. Upper and lower limit

roll-height monitoring eliminates insufficient or excess paste

volumes. It is a non-contact solution that can automatically

add more paste to the stencil as it is needed.

NEW Paste Temperature Monitor

Temperature monitoring

ensures proper paste

viscosity to avoid

bridging and voiding.

MPM patent-pending

paste temperature

monitor allows paste

to be measured in the

cartridge or on the

stencil.

NEW Automatic Paste Dispensing System

Dispense for standard

cartridges or choose the

new patent-pending

jar dispenser. Paste

is released in precise,

measured amounts

across the stencil in a

clean, uniform bead. Deposition volumes, frequency and

placement are user programmable.

NEW Quick Release Squeegee

New quick release

squeegee blades makes

changing blades quick

and easy with no tools

required. It takes less

than 30 seconds to

change the blade.

Updated Benchmark™ User Interface

Easy to learn and use for the average operator, MPM’s

Benchmark software is powerful yet intuitive, and facilitates

rapid setup, assists with operational tasks, and makes

changeover quick and easy. The software has been

upgraded to Windows

10 and new production

tools and new Quickstart

programming to make it

even easier to use.

NEW EdgeLoc™ Board Clamping

The EdgeLoc system

uses a side snugging

technique that removes

the need for top clamps

which interfere with the

PCB to stencil contact.

The result is optimal gasketing and more volumetrically

consistent edge-to-edge prints. With EdgeLoc II, robust

flippers engage to secure the board across the top edge

ensuring board flatness then move out of the way once

the board is firmly gripped from the side. EdgeLoc+ board

clamping can change between edge and top clamping

simply through software.

NEW Adjustable Stencil Shelf

Provides the exibility to handle all stencil sizes with

a simple adjustment of the shelf. The robust design

provides better stability on all stencil sizes.

Real value can be measured in terms of yields. More good and reliable product with fewer defects.

Momentum delivers high yields, and higher profitability through a very low cost of ownership and

operational efficiency.

Auto Tooling Pin Placement

Automatic Pin Placement

is MPM’s patented

tooling solution that

uses the vision gantry

to precisely place and

remove tooling pins.

The carousel holds 48

pins to match and support the largest board size. A standard

grid for single sided boards or an exact pin placement for

double sided boards can be developed.

SPI Print Optimizer

SPI Print Optimizer brings your

Solder Paste Inspection (SPI)

machine into communication

with your MPM printer

through a specially-developed

common interface. When

the SPI machine ‘sees’ X, Y

and theta offset problems

on a just-printed PCB, it analyzes the data virtually instantly

and gives the printer instructions to correct those offsets,

automatically, and ‘on the fly’.

Momentum

II HiE & Elite

New Support Pin Placement Verication

Pin location can now be veried with bottom side image

whether placing pins automatically or manually.

MPM Vision System & Inspection

MPM’s patented printer-

based Vision and Inspection

system is a cost-effective

way to verify print and

paste deposit results. It is

flexible enough to handle

the complete range of today’s most challenging components.

This system measures the amount of paste covering the

target pad and compares it with the required coverage. 2D

inspection is integrated directly into the stencil printer to

provide an immediate source of data.

BridgeVision® and StencilVision™

BridgeVision is a patented method of analyzing bridge

defects on circuit boards in the post-print inspection process.

This innovative system

utilizes texture-based image

acquisition algorithms and a

digital camera system with

telecentric lenses to support

the accurate identification of

paste deposit defects.

StencilVision utilizes texture-

based technology to check the underside of a stencil for

solder paste contamination. Wiper operation can be driven

by the results obtained.

OpenApps™

MPM’s OpenApps is an open architecture source code which

provides the capability of developing custom interfaces in

support of Industry 4.0 initiatives and communication with

Manufacturing Execution Systems (MES). ITW EAE is the rst

SMT company to oer open software architecture.

PrinTrack™

PrinTrack™ adds traceability, data harvesting and reporting to

your printing process. It can seamlessly integrate with other

equipment and elements in the manufacturing cycle, such as

MES and ERP, and can be expanded factory-wide.

AccuCheck Print Capability Verication

Accucheck Print Capability Verication

allows the printer to measure its own

print capability. Users can verify the

machine’s capability at any time or

continuously on their own products.

AccuCheck measures the actual print

deposit position versus the target pad

to determine a measured print oset. It is an inexpensive,

reliable method of obtaining machine quality and process

capability information to ensure repeatable results and

optimum printing performance.

MPM MOMENTUM

II HiE & ELITE SPECIFICATIONS

BOARD HANDLING

Maximum Board Size (X x Y) 609.6 mm x 508 mm (24” x 20”)

Staging Mode - Momentum II Elite 457 mm x 508 mm (18” x 20”)

A dedicated workholder is required for boards with an X size greater than 20”

Minimum Board Size (X x Y) 50.8 mm x 50.8 mm (2” x 2”)

Board Thickness 0.2mm (0.008”) to 5.0mm (0.20”), up to

6.0 mm (0.24”) without top clamp foils

Maximum Board Weight 4.5 kg (10 lbs)

Board Edge Clearance 3.0 mm (0.118")

Underside Clearance 12.7 mm (0.5") standard Configurable for

25.4 mm (1.0”)

Board Hold-Down EdgeLoc II, centernest vacuum

Optional: Fixed top clamps, EdgeLoc+

Board Support Methods Magnetic pins

Optional: Vacuum side dams, vacuum

pins, support blocks, dedicated fixtures,

patented auto tooling, Quik-Tool

PRINT PARAMETERS

Maximum Print Area (X x Y) 609.6 mm x 508 mm (24” x 20")

Print Gap (Snap-off) 0 mm to 6.35 mm (0" to 0.25")

Print Speed Up to 305 mm/sec (12.0”/sec)

Print Force 0 to 20 kg (0 lb to 44 lbs)

Stencil Frame Size 737 mm x 737 mm (29" x 29")

Adapters available for smaller sizes

VISION

Vision Field-of-View (FOV) 10.6 mm x 8.0 mm (0.417” x 0.315”)

Fiducial Types Standard shape fiducials (see SMEMA

standards), pad/aperture

Camera System Single digital camera

- MPM patented look up/down vision

PERFORMANCE

Total System Alignment ±11 microns (±0.0004”) at 6 sigma,

Accuracy and Repeatability Cpk ≥2.0*

Qualification is performed using production environment process variables; print

speed, table lift and camera movement are included in the capability figure.

Wet Print Deposit ±17 microns (±0.0007”) at 6 sigma,

Accuracy and Repeatability Cpk ≥2.0*

Actual test results performed by CeTaQ.

Cycle Time

Momentum II HiE 7.5 seconds standard

Momentum II Elite 6.0 seconds standard

FACILITIES

Power Requirements 200 to 240 VAC (±10%) single phase @

50/60Hz, 15A

Air Supply Requirements 100 psi at 4 cfm (standard run mode) to 18

cfm (vacuum wipe) (7 bar @ 5 L/s to 12 L/s),

12.7 mm (0.5”) OD x 9.5 mm (3/8”) ID line

Height (excluding light tower) 1526.0 mm (60.0") at 940 mm (37.0”)

transport height

Machine Depth 1592.0 mm (62.7")

Machine Width

Momentum II HiE 1203.0 mm (47.4”)

Momentum II Elite 1675.5 mm (66.0”)

Minimum Front Clearance 508 mm (20.0”)

Minimum Rear Clearance 508 mm (20.0”)

Machine Weight

Momentum II HiE 862 kg (1900 lbs)

Momentum II Elite 899 kg (1982 lbs)

Crated Weight

Momentum II HiE 1155.5 kg (2547 lbs)

Momentum II Elite 1192.5 kg (2629 lbs)

www.itweae.com

ITW EAE is a division of Illinois Tool Works, Inc. It is a consolidation of all of its Electronic Assembly

Equipment and Thermal Processing Technology. The group includes world-class products from MPM,

Camalot, Electrovert, Vitronics Soltec and Despatch.

* The higher the Cpk, the lower the variability with respect to the process specification limits. In a process qualified as a 6 sigma process (i.e., one that allows ±6 standard

deviations within the specification limits), Cpk ≥ 2.0.

Specification is subject to change without notice. Please consult factory for specifics.

ITW EAE maintains an ongoing program of product improvement that may affect design and/or price. We reserve the right to make these changes without prior notice or liability.

MPM Printers – Built on a Solid Foundation.

Strength and stability are prerequisites for accuracy and precision when system parts are in motion and moving

about at high speed. The Momentum® II HiE and Elite’s major assemblies are driven by precision ball screws,

not belts, which eliminate the need for calibrations. The worknest and camera gantry are designed for optimum

motion stability, shorter settling time, and faster board and stencil alignment. Momentum® II HiE and Elite’s rigid

frame is welded for low vibrations. This allows for higher repeatability and great reliability over time. Alignment is

achieved with minimum motion; thus the PCB travels to the stencil more quickly.