88226624-01-07 - Flex Neo LPiX Tech Spec - 第10页

10 DEK FLEX NeoHorizon LP iX Machine P r oduct ivit y Pack age (included ) Process Specification Paste Contr ol Paste Disp enser (APD II or Jar D ispenser) Paste Roll He ight Mo nitor (PR HM 2) Temperatur e/Humidit y Sen…

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DEK FLEX NeoHorizon LPiX
Machine Standard Configuration
Services
Specification
Voltage
100 Volts to 240 Volts ±10%. Single phase 50/60 Hz
Maximum Current at 115V
15 Amps with vacuum pump
6 Amps without vacuum pump
Maximum Current at 230V
8 Amps with vacuum pump
3 Amps without vacuum pump
Over Current Protection
An external circuit breaker ≤20 Amps is required to be
fitted in line with the machine supply
Air Supply
To ISO 8573.1 Standard Quality Class 2.3.3
Pressure 5 bar to 8 bar
General usage 5 litres/minute at 5 bar to 8 bar
Maximum usage 226 litres/minute at 6 bar
Shipping Information
Specification
Approximate Weight
850kg boxed (dependent upon configured options
selected with machine)
690kg unboxed (dependent upon configured options
selected with machine)
Approximate Dimensions
2080mm x 1500mm x 1590mm High
(81.9” x 59” x 62.6”) Boxed
Certification
Specification
CE
98/37/EC
89/336/EEC
73/23/EEC
Subsequent amendments
Acoustic Noise Level
Less than 70dB 2003/1/EC
DEK FLEX NeoHorizon LPiX
Machine Productivity Package (included)
Process
Specification
Paste Control
Paste Dispenser (APDII or Jar Dispenser)
Paste Roll Height Monitor (PRHM 2)
Temperature/Humidity Sensor
Monitoring of the process environment
Data Capture
Specification
Product Data Capture
Verification & Traceability (Software only)
ProDEK closed loop (Software only)
Software & Communications
Specification
Software & Communications
Network files
Statistical Process Control
On board, reported via operator interface (QC-CALC)
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DEK FLEX NeoHorizon LPiX
Machine Productivity Options
Process
Specification
Print Method
ProFlow® ATx
Stinger
Printing Environment Control
Contact PM
Recommended Stencil Frame
VectorGuard
Adjustable Width Stencil Mount (AWSM)
Frame variants Fully adjustable to accommodate
frame sizes in the range of 381mm to 736mm
(15” to 29”) by 38mm height.
Image position: Centre/Front/Custom
Under Stencil Cleaning
Typhoon Under Stencil Cleaner, fully programmable
with wet/dry/vacuum wipe with external solvent tank
Specify length (300mm, 400mm, 460mm, 515mm)*
Vacuum Assist for Under Stencil
Cleaning
On board vacuum unit 35 litres/second airflow
Stencil Positioning
Automatic loading incorporating squeegee drip tray
* If configured with an AWSM, the cleaner chamber size should be matched with the minimum AWSM
width and stencil frame width being used
Handling & Cleaner Options
Specification
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y) Long Board Option
Under Stencil Cleaning
Typhoon Under Stencil Cleaner (620mm, poly blade
insert only)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Software & Communications
GEM on TCP/IP