88226624-01-07 - Flex Neo LPiX Tech Spec - 第11页

11 DEK FLEX NeoHorizon LP iX Machine P roductivit y Options Process Specification Print Metho d ProFlow® ATx Stinger Printing En vironment Control Contact PM Recommended Stencil Frame VectorGuar d Adjustabl e Width Sten …

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DEK FLEX NeoHorizon LPiX
Machine Productivity Package (included)
Process
Specification
Paste Control
Paste Dispenser (APDII or Jar Dispenser)
Paste Roll Height Monitor (PRHM 2)
Temperature/Humidity Sensor
Monitoring of the process environment
Data Capture
Specification
Product Data Capture
Verification & Traceability (Software only)
ProDEK closed loop (Software only)
Software & Communications
Specification
Software & Communications
Network files
Statistical Process Control
On board, reported via operator interface (QC-CALC)
11
DEK FLEX NeoHorizon LPiX
Machine Productivity Options
Process
Specification
Print Method
ProFlow® ATx
Stinger
Printing Environment Control
Contact PM
Recommended Stencil Frame
VectorGuard
Adjustable Width Stencil Mount (AWSM)
Frame variants Fully adjustable to accommodate
frame sizes in the range of 381mm to 736mm
(15” to 29”) by 38mm height.
Image position: Centre/Front/Custom
Under Stencil Cleaning
Typhoon Under Stencil Cleaner, fully programmable
with wet/dry/vacuum wipe with external solvent tank
Specify length (300mm, 400mm, 460mm, 515mm)*
Vacuum Assist for Under Stencil
Cleaning
On board vacuum unit 35 litres/second airflow
Stencil Positioning
Automatic loading incorporating squeegee drip tray
* If configured with an AWSM, the cleaner chamber size should be matched with the minimum AWSM
width and stencil frame width being used
Handling & Cleaner Options
Specification
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y) Long Board Option
Under Stencil Cleaning
Typhoon Under Stencil Cleaner (620mm, poly blade
insert only)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Software & Communications
GEM on TCP/IP
DEK FLEX NeoHorizon LPiX
Machine Productivity Options
Transport
Specification
Substrate Support
Vacuum tooling capability
Vacuum tooling sensor
Vacuum cups
Grid-Lok® tooling
Substrate Transport
Single piece conveyor with flat belts (heavy boards)
Remote board stop (for use with heavy board option)
Substrate Fixture
All Purpose Clamping (APC) system*
Snuggers (edge clamping)
Foil-less clamps
* Can only be used with Modular single stage rail system for availability contact product manager
Vision & Verfication
Specification
HawkEye® 750 Paste on Pad Verification
Enabled
HawkEye® 1700 Paste on Pad
Verification
Enabled (camera included)
HawkEye® Bridging
HawkEye® Bridging (requires HawkEye® 1700
camera)
Data Capture
Specification
Product Data Capture
Verification - handheld barcode reader
Traceability - remote barcode reader