SiplaceX4_en - 第53页

1 - 29 S tudent Guide SIPLACE X Edition 09/2005 2 Overview 29 2.2.9.3 Component Camera for 6-Segment C&P Head 2 Fig. 2.2 - 17 Component camera as standard on the 6-segment collect&place head 1. Component camera o…

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Student Guide SIPLACE X
2 Overview Edition 09/2005
28
2.2.9.2 Digital Component Camera for 12-Segment C&P Head
2
Fig. 2.2 - 16 Component camera as standard on the 12-segment collect&place head
2
1. Component camera optics and illumination
2. Camera amplifier
3. Illumination control
Technical data 2
2
Option: Digital camera from 6 segment DLM 2 head (camera type 29.sst) for 0201 placement. 2
Component size 0.5 mm x 0.5 mm to 18.7 mm x 18.7 mm
Component shape 0402 to PLCC44 incl. BGA, µBGA, Flip-Chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Minimum lead pitch 0.5 mm
Minimum ball pitch 0.45 mm
Minimum ball diameter 0.25 mm
Field of view (FOV) 24.5 mm x 24.5 mm
Illumination type from above (4 levels programmable)
Resolution 50µm/pixels
Camera type .sst 28.sst
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Student Guide SIPLACE X
Edition 09/2005 2 Overview
29
2.2.9.3 Component Camera for 6-Segment C&P Head
2
Fig. 2.2 - 17 Component camera as standard on the 6-segment collect&place head
1. Component camera optics and illumination
2. Camera amplifier
3. Illumination control
Technical data 2
Component size 0.3 mm x 0.3 mm to 27 mm x 27 mm
Components 0201 to 27 mm x 27mm
PLCC, SO, QFP, TSDP, SOT, MELF, CHIP, IC BGA
Minimum lead pitch 0.3 mm
Minimum ball pitch
0.25 mm for BE < 18 x 18 mm
0.35 mm for BE ≥ 18 x 18 mm
Minimum ball diameter
0.14 mm for BE < 18 x 18 mm
0.2 mm for BE ≥ 18 x 18 mm
Field of view (FOV) 32 mm x 32 mm
Illumination type
from above (4 levels programmable)
Resolution 26µm/pixels
Camera type .sst 29.sst
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Student Guide SIPLACE X
2 Overview Edition 09/2005
30
2.2.9.4 Component Camera for 20-Segment C&P Head
2
Fig. 2.2 - 18 Component camera as standard on the 20-segment collect&place head
(1) Component camera optics and illumination
(2) Camera amplifier
(3) Illumination control
Technical data 2
2
2
Component size 0.2 mm x 0.2 mm to 6 mm x 6 mm
Components 01005 to 2220 (Flip CHIP, Bare Dies)
Minimum pitch leads 0.5 mm
Minimum ball pitch
0.45 mm
Minimum ball diameter
0.25 mm
Field of view (FOV) 8 mm x 8 mm
Illumination type from above (5 levels programmable)
Resolution 14.1 µm/pixels
Camera type .sst 23.sst