SM310 Introduction(Chi, Ver4).pdf - 第34页
Samsung Component Placer SM310 Intr oduction 1-4 1.2.3. 1-3. Specification (mm) Chip 0402 Chip 0603 Chip 1005 Melf TR AL Capacitor …
1-3
1.2.
1.2.1.
1-1.
X-Y X-Y
Sp
1
Sp
2
Sp
3
Sp
4
Sp
5
Sp
6
Sp
7
Sp
8
Sp
9
Sp
10
Sp
11
Sp
12
7mm
X
X
X
X
X
X
7mm
X
X
X
X
X
X
SM310 24 mm LSC 7 mm
7 mm (1-2, 3-4, 5-6, 7-8, 9-1
0, 11-12 )
1.2.2.
1.2.2.1. Line Scan Vision
1-2.
(Vision
)
SM310
FOV 35mm Lens
Chips
0402 ~ 24.0mm(0402 Factory Option)
IC, Connector
~□ 24.0mm , Lead Pitch: 0.65mm
BGA,CSP
~□ 24.0mm, Ball Pitch: 1.0mm
Samsung Component Placer SM310 Introduction
1-4
1.2.3.
1-3.
Specification (mm)
Chip 0402
Chip 0603
Chip 1005
Melf
TR
AL Capacitor
SOP 14Pin 0.65 P (0.65 P )
QFP 100 0.65 P (0.65 P )
BGA256 1.0 P (1.0 P )
XY : ±0.05 θ : ±5.0
XY : ±0.05 θ : ±5.0
XY : ±0.075 θ : ±5.0
XY : ±0.14 θ : ±5.0
XY : ±0.14 θ : ±5.0
XY : ±0.14 θ : ±5.0
XY : ±0.08 (± 0.1) θ : ±0.5
XY : ±0.08 (± 0.1) θ : ±0.5
XY : ±0.08 (± 0.1) θ : ±0.5
1.2.4.
PCB
1.2.4.1.
: 1608 chip
Chip
( PCB )
1-5
1.2.4.2.
1-4.
SM320
30,000 CPH (1608)
29,500 CPH (1005)
IPC(Pick Up)
Chip
18,000 CPH (0603)
20,000 CPH (SOP16)
IC
5500 CPH (QFP100)
IPC(Pick Up)
(1 msec ).
PCB
C/S Center( - STS)