00197454-01_AI_Portal_40mm_TwinVHF_SX12_de_en - 第80页

Introduction Abbreviations 1.3.5 SIPLACE on the World Wide Web (WWW) 80 Reconfiguration Kit Twin VHF with Gantry Reconfiguration Kit Twin VHF mit Por - 1.3.5 1 . 3 . 5 S I P L A C E o n t h e W o r ld W id e W e b ( W W …

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Introduction
1.3.4 Release History Other Instructions
Reconfiguration Kit Twin VHF with Gantry Reconfiguration Kit Twin VHF mit Portal 79
1.3.3.3
1.3.3.3 Handling ESD Modules
Handling ESD Modules
Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other work.
If it is necessary, make sure that you do not touch the pins or printed conductors when you pick up flat
modules.
Do not touch components unless
You are constantly earthed by an ESD wrist strap or
You are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.
Always discharge yourself before you touch an electronic module. To do this, simply touch a conductive
and earthed object immediately before you touch the module (such as unpainted parts of a switch cab
-
inet, a water pipe, etc.).
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g. plastic
films, insulating table surfaces or items of clothing made from synthetic fibers.
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD foam,
ESD bag or container).
Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm away
from the screen.
1.3.3.4
1.3.3.4 Measurements and Modifications to ESD Modules
Measurements and Modifications to ESD Modules
Measurements of the assemblies may only be taken if
The measuring device has been grounded (e.g. via protective conductor) or
The measuring head of the potential-free measuring device has been briefly discharged before
measurement (e.g. touching blank metal control unit housing).
Always use an earthed soldering iron if you carry out any soldering work.
1.3.3.5
1.3.3.5 Dispatching ESD Modules
Dispatching ESD Modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags or met
-
al sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before packaging.
Use conductive foam rubber, ESD bags, domestic aluminum foil or paper, for example. NEVER use
plastic bags or film.
If the module has integral batteries, ensure that the conductive packaging does not touch or short-
circuit the battery terminals and, if necessary, first cover the terminals with insulating tape or mate
-
rial.
1.3.4
1.3.4 Release History
Release History
Document
SIPLACE SX1/SX2 V2
Reconfiguration Kit Twin VHF with gantry
Assembly instructions
Release Changes
11/2013 First edition
Introduction
Abbreviations 1.3.5 SIPLACE on the World Wide Web (WWW)
80 Reconfiguration Kit Twin VHF with Gantry Reconfiguration Kit Twin VHF mit Por
-
1.3.5
1.3.5 SIPLACE on the World Wide Web (WWW)
SIPLACE on the World Wide Web (WWW)
Log into our SIPLACE
®
homepage at http://www.siplace.com.
You can choose between the German and English versions.
The different sections contain information about our products, services and contact persons.
In addition, registered customers can also access the
SIPLACE User Group
. Here you can call up spe
-
cial information about our placement systems e.g.
Technical documentation,
Technical information,
Spare parts lists etc.
Registration for the user group is very simple:
Click on the Register link.
Fill in the registration form and send it off to us.
Soon afterwards, you will receive your access authorization with USER ID and password.
1.4
1.4 Abbreviations
Abbreviations
Abbreviations Description
PA Placement area
CO Component
COT Changeover table
COT-i Changeover table insert
C&P Collect&Place
C&P12, CP12 Collect&Place head with 12 segments
C&P20, CP20 Collect&Place head with 20 segments
C&P6, CP6 Collect&Place head with 6 segments
CoD Capacity on Demand
CPP Collect&Pick&Place head
CPx Collective term for CPP, CP20, CP12 and/or CP6
ESD Electrostatic sensitive device
EMC Electromagnetic compatibility
FHE Fast Head Exchange
LBO Long Board Option
PCB Board
P&P Pick&Place
TH TwinHead
Brief Description
Reconfiguration Kit Twin VHF with Gantry Reconfiguration Kit Twin VHF mit Portal 81
2
2 Brief Description
Brief Description
The Twin VHF option enables you to process 40 mm high components with a maximum placement force
of 70 Nm.
Machine frame
The 40 mm option requires an upgraded machine frame with higher input and output areas.
The option can also be fitted in V2 machines with an old machine frame. However, in this case, the max
-
imum component height is limited to 35 mm.
Gantry
This option requires a new gantry. This is higher than the standard gantries, has a new head plate, a
new PCB camera and a different position for the X-axis incremental encoder. The machine recognizes
the gantry automatically via the head ID of the Twin VHF fitted.
These gantries can only be used with the Twin VHF head. Other heads can not be used with this gantry.
WPC
For feeding in 40 mm components, you need a "WPC5/6 45 mm" (40 mm component height and 5 mm
tray height).
Cover.
For the "WPC5/6 – 45 mm", you need to fit a new cover with a space cut for the WPC.
Serial number Feature Twin VHF
Kxxx Conveyor with mechanical standard stoppers
No Twin VHF possible!
Not possible
Lxxx Conveyor with laser light barrier
No higher input and output area
Max. component height
35 mm
Mxxx Conveyor with laser light barrier
Higher input and output area for components with a
height of 40 mm.
Max. component height
40 mm
NOTICE
Gantry modularity
For more information about gantry modularity, read the assembly instructions "Gantry Modular
-
ity SX1/SX2" [00196626-xx].