Specification-SIPLACE-S25HM-eng - 第10页

8 12-Nozzle Colle ct & Place He ad for High Speed Plac ement Component Pick-Up/ Placement Segment Removal Point Turning to the Placement Position Component Vision Description The 12-Nozzle placeme nt head operates on…

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Placement Heads: S-25 HM (Type 2)
Placement Accuracy
Component Range
Placement Accuracy
a
Placement Head
Placement Accuracy
12-Nozzle
Collect & Place Head
12-Nozzle
Collect & Place Head
with DCA (Option)
6-Nozzle
Collect & Place Head
6-Nozzle
Collect & Place Head
with DCA (Option)
X/Y Accuracy ± 67.5 µm ± 67.5 µm ± 52.5 µm ± 52.5 µm
3
Sigma
Rot.-Accuracy ± 0.525° ± 0.525° ± 0.225° ± 0.225°
X/Y Accuracy ± 90.0 µm ± 90.0 µm ± 70.0 µm
b
± 70.0 µm
b
4
Sigma
Rot.-Accuracy ± 0.700° ± 0.700° ± 0.400° ± 0.400°
X/Y Accuracy ± 135.0 µm ± 135.0 µm ± 105.0 µm ± 105.0 µm
6
Sigma
Rot.-Accuracy ± 1.050° ± 1.050° ± 0.450° ± 0.450°
a) As defined in “Scope of Service and Delivery SIPLACE”.
b) When SIPLACE S-25 HM is equipped with two 6-Nozzle Collect & Place Heads only one can reach 70.0 µm, the second reaches 80.0 µm.
Component Range
12-Nozzle
Collect & Place Head
12-Nozzle
Collect & Place Head
with DCA
6-Nozzle
Collect & Place Head
at gantry 2
6-Nozzle
Collect & Place Head
with DCA at gantry 1
Component size
0.6 x 0.3 mm
2
c
to
18.7 x 18.7 mm
2
0.6 x 0.3 mm
2
c
to
13 x 13 mm
2
1.6 x 0.8 mm
2
to
32 x 32 mm
2
1.6 x 0.8 mm
2
to
13 x 13 mm
2
Max. component height 6 mm 6 mm 8.5 mm 8.5 mm
Max. component weight 2 gr 2 gr 5 gr 5 gr
Placement force 2.4 - 5.0 N 2.4 - 5.0 N 2.4 - 5.0 N 2.4 - 5.0 N
Performance See table on page 3 See table on page 3 See table on page 3 See table on page 3
Min. pitch lead / bump
d
500 / 350 µm 400 / 200 µm 500 / 560 µm 400 / 200 µm
Min. ball / bump diam.
d
200 µm 110 µm 320 µm 110 µm
c) 0201 (recommended to order the special 0201-kit).
d) Depends also on specification of components (quality, vision...)
8
12-Nozzle Collect & Place Head for High Speed Placement
Component Pick-Up/
Placement
Segment
Removal
Point
Turning to
the Placement
Position
Component
Vision
Description
The 12-Nozzle placement head
operates on the Collect & Place
principle. In contrast to classic chip
shooters, the 12 vacuum nozzles
of the SIPLACE Collect & Place
head rotate around a horizontal
axis. This does not only save
space:
Due to the small diameter com-
pared to chip shooters, the cen-
trifugal forces are significantly
lower. The results are high-speed,
reliable placement and the same
cycle time for all components.
Components are picked up and
placed reliably with the aid of vac-
uum followed by a gentle air kiss.
A number of vacuum tests moni-
tors if the component has been
picked up and placed accurately.
Various control and self-learning
functions further enhance the de-
pendability of the system:
§ The optical recognition of feeder
positions records the exact posi-
tion of the feeder table.
§ A camera on the placement head
(component vision module) de-
termines the exact position of
each component on the nozzle.
§ For every feeder the pick-up
offsets are averaged over the
last ten pick-ups. This enables
the head to dial-in on the pre-
cise pick point for each compo-
nent.
§ In addition, the package form is
also checked. If the actual geo-
metric dimensions of the com-
ponent do not correspond to
those programmed, the compo-
nent is rejected.
§ Components rejected by the vi-
sion system are dumped into a
bin, reject feeder or matrix tray.
Any rejected component gets
automatically placed during a
repair run.
§ Warpage of the PCB is accom-
modated by sensor stop acti-
vated z-axis placement. The sys-
tem also keeps the last ten
positions of the z-axis at com-
ponent placement and uses the
average of these values to im-
prove the drive down and place
speed of the cycle.
§ Component sensor.
Placement Heads:
12-Nozzle Collect & Place Head for High Speed
Component Placement
Technical Data
Stroke of Z-axis max. 16 mm
Programmable placement force 2.4 to 5.0 N
9
Description
The 6-Nozzle placement head
operates on the Collect & Place
principle.
The cycle time of the 6-Nozzle
Collect & Place Head – and thus
the real achievable performance
– depends on the dimensions and
the number of leads / bumps of
the component.
Mechanically and electrically, the
6-Nozzle Collect & Place Head is
structurally very similar to the 12-
Nozzle Collect & Place Head.
Placement Heads:
6-Nozzle Collect & Place Head for High-Speed
Large Component Placement
6-Nozzle Collect & Place Head for High Speed Placement of
large components
Optical
Centering
Component
Turning
Component
Rejection
Segment
Removal Point
Technical Data
Stroke of Z-axis max. 16 mm
Programmable placement force 2.4 to 5.0 N