Specification-SIPLACE-S25HM-eng - 第30页

28 Description Standar d Component Vision Standar d Component Vision Standar d Component Vision Standar d Component Vision Module for 12- an d 6-Noz zle Module for 12- an d 6-Noz zle Module for 12- an d 6-Noz zle Module …

Description

The component vision modules

perform a critical contribution to

placement accuracy and reliability.

It dependably recognizes all pack-

age forms (= geometric dimen-

sions of the component) illumi-

nated at various angles from a

number of planes. To illuminate

each component optimally, the

luminosity of the individual planes

can be adjusted individually in 256

levels.

Aside from the dimension of the

SMD component, the vision sys-

tem determines the lead number

and pitch (lateral IC lead bend) as

well as the rotation angle and X-/Y-

offset. Components which are not

suitable are rejected and automati-

cally corrected in a repair cycle.

Rotational and X-/Y-offsets are cor-

rected at the turning station of the

Collect & Place Head or via the

gantry axes. A relevant X-/Y-pick-

up offset is calculated from the

positions of a number of compo-

nents from one track. This is fac-

tored in accordance with the self-

learning principle during the sub-

sequent pick-up of components.

Prior to placement the required

geometrical dimensions of one

component type are entered into

the package form (GF) editor, cre-

ating a synthetic model of the

SMD module. This task is simpli-

fied by the comprehensive on-line

information and Help system.

Later the central SIPLACE vision

system, to which all other vision

modules are connected, analyzes

the gray-scale picture of the com-

ponent vision module. To this end,

suitable algorithms are used for

the pertinent package type. Due to

the combination of algorithms, the

vision system also functions relia-

bly under the most difficult condi-

tions, e.g., in the case of different

reflection behavior by the leads or

disruptive influences from the out-

side.

The algorithms are used for all

component vision modules.

Vision Sensor Technology:

Algorithms to determine the X-/Y-Position and the

Rotation Angle of Components

Algorithm Component Determined on the basis of

Size Driven Chip the component’s outline

(profile/gradients)

Row Driven IC several component leads

(correlation method)

Corner Driven IC all component leads

(correlation method)

Lead Driven Complex IC each component connection

(High-Accuracy-Lead-Extraction method)

Grid/Ball/Bump BGA, µBGA,

Flip Chip

all defined balls and bumps

(gradients/ball or bump centering)

Description

Standard Component Vision

Standard Component VisionStandard Component Vision

Standard Component Vision

Module for 12- and 6-Nozzle

Module for 12- and 6-NozzleModule for 12- and 6-Nozzle

Module for 12- and 6-Nozzle

CoCo

Col

llect & Place Head

lect & Place Headlect & Place Head

lect & Place Head

The standard component vision

module is directly integrated into

the Collect & Place Head. While

the component is cycling into the

next station of the Collect & Place

Head, the recorded image is

evaluated by the central vision sys-

tem. The component rotation is

then corrected by the appropriate

angle based on the position off-

sets determined with vision in-

spection.

DCA Vision Module for 12- and

DCA Vision Module for 12- andDCA Vision Module for 12- and

DCA Vision Module for 12- and

6-Nozzle Collect & Place Head

6-Nozzle Collect & Place Head6-Nozzle Collect & Place Head

6-Nozzle Collect & Place Head

The DCA vision module was de-

veloped specifically for secure,

fast and reliable recognition of Flip

Chips and Bare Dies. But also

standard SMDs can be handled

with this vision module including

0201 capacitors and resistors.

The DCA vision module option of-

fers the possibility to process with

one machine SMDs, Flip Chips and

Bare Dies without problems, thus

achieving a maximum of flexibility.

The DCA-Vision Module option re-

places the Standard Component

Vision Module.

Vision Sensor Technology:

Standard Component Vision Modules for 12- and 6-Nozzle

Collect & Place Head

DCA-Vision Module for 12- and 6-Nozzle Collect & Place Head (Option)

Standard Component Vision Module for the 12-Nozzle C & P Head

Maximum component size 18.7 x 18.7 mm

Component Range See table on page 6

Camera’s field of view 24 x 24 mm

Illumination Front lighting

(3 freely programmable planes)

Standard Component Vision Module for the 6-Nozzle C & P Head

Maximum component size 32 x 32 mm

Component Range See table on page 6

Camera’s field of view 39 x 39 mm

Illumination Front light

(2 freely programmable planes)

DCA-Vision Module for 12- and 6-Nozzle C & P Head

Component size: minimum 0.6 x 0.3 mm

(0201) /

maximum 13 x 13 mm

Component Range Flip Chips, Bare Dies, Standard SMDs

Camera’s field of view 15.6 x 15.6 mm

Illumination Front light

(4 freely programmable planes)

Description

Various factors contribute to the

placement accuracy of the

SIPLACE S-25 HM machine, e.g.,

the stationary PCB during the

placement process. As no accel-

erations are acting on the placed

components, their position contin-

ues unchanged. The PCB moves in

and out at a coordinated speed

which is automatically reduced just

before the nominal position is

reached.

A further guarantee for long-term

high placement accuracy is the

position recognition of the axes of

the gantry and placement head by

means of optical scanning by in-

cremental encoders. Revolving

star and segments of the Collect

& Place Head are positioned by

means of high-resolution glass in-

cremental panels. The X- and Y-

axes are positioned with the help

of the metal scales on each gantry

axis.

To determine the placement accu-

racy on SIPLACE machines, highly

precision glass components with

mounted structures are placed on

a dimensionally accurate glass

mapping plate. The results are sta-

tistically evaluated and presented

as a Gaussian standard distribu-

tion. In the case of the 6-Nozzle

Collect & Place Head at the

SIPLACE S-25 HM the placement

accuracy is ± 70 µm at a statistical

reliability of 4 sigma. If the accu-

racy value ± 70 µm is divided by

the sigma value 4, the result is the

standard deviation S of 1 sigma =

± 17.5 µm (as defined in “Scope

of Service and Delivery SIPLACE”).

A machine capability analysis is

conducted for each machine ac-

ceptance test.

Machine Criteria:

Placement Accuracy

Technical Data Gantry

Drive Brushless AC Temperature

Controlled Motor

Position measuring system

(X/Y)

Linear scales

Resolution of X-/Y-axis 2.5 µm

Speed of X-axis max. 2.5 m/s

Speed of Y-axis max. 2.5 m/s

Placement Accuracy see table on page 6

Standard Deviation - dpm

-4

-3

-2

2700 dpm

60 dpm

P Point o

lection