Specification-SIPLACE-S25HM-eng - 第31页

29 Description Various factors contribute to the placement accur acy of the SIPLACE S-25 HM machine, e.g., the stationar y PCB during the placement process. As no accel- erations are acti ng on the placed components, the…

Description

Standard Component Vision

Standard Component VisionStandard Component Vision

Standard Component Vision

Module for 12- and 6-Nozzle

Module for 12- and 6-NozzleModule for 12- and 6-Nozzle

Module for 12- and 6-Nozzle

CoCo

Col

llect & Place Head

lect & Place Headlect & Place Head

lect & Place Head

The standard component vision

module is directly integrated into

the Collect & Place Head. While

the component is cycling into the

next station of the Collect & Place

Head, the recorded image is

evaluated by the central vision sys-

tem. The component rotation is

then corrected by the appropriate

angle based on the position off-

sets determined with vision in-

spection.

DCA Vision Module for 12- and

DCA Vision Module for 12- andDCA Vision Module for 12- and

DCA Vision Module for 12- and

6-Nozzle Collect & Place Head

6-Nozzle Collect & Place Head6-Nozzle Collect & Place Head

6-Nozzle Collect & Place Head

The DCA vision module was de-

veloped specifically for secure,

fast and reliable recognition of Flip

Chips and Bare Dies. But also

standard SMDs can be handled

with this vision module including

0201 capacitors and resistors.

The DCA vision module option of-

fers the possibility to process with

one machine SMDs, Flip Chips and

Bare Dies without problems, thus

achieving a maximum of flexibility.

The DCA-Vision Module option re-

places the Standard Component

Vision Module.

Vision Sensor Technology:

Standard Component Vision Modules for 12- and 6-Nozzle

Collect & Place Head

DCA-Vision Module for 12- and 6-Nozzle Collect & Place Head (Option)

Standard Component Vision Module for the 12-Nozzle C & P Head

Maximum component size 18.7 x 18.7 mm

Component Range See table on page 6

Camera’s field of view 24 x 24 mm

Illumination Front lighting

(3 freely programmable planes)

Standard Component Vision Module for the 6-Nozzle C & P Head

Maximum component size 32 x 32 mm

Component Range See table on page 6

Camera’s field of view 39 x 39 mm

Illumination Front light

(2 freely programmable planes)

DCA-Vision Module for 12- and 6-Nozzle C & P Head

Component size: minimum 0.6 x 0.3 mm

(0201) /

maximum 13 x 13 mm

Component Range Flip Chips, Bare Dies, Standard SMDs

Camera’s field of view 15.6 x 15.6 mm

Illumination Front light

(4 freely programmable planes)

Description

Various factors contribute to the

placement accuracy of the

SIPLACE S-25 HM machine, e.g.,

the stationary PCB during the

placement process. As no accel-

erations are acting on the placed

components, their position contin-

ues unchanged. The PCB moves in

and out at a coordinated speed

which is automatically reduced just

before the nominal position is

reached.

A further guarantee for long-term

high placement accuracy is the

position recognition of the axes of

the gantry and placement head by

means of optical scanning by in-

cremental encoders. Revolving

star and segments of the Collect

& Place Head are positioned by

means of high-resolution glass in-

cremental panels. The X- and Y-

axes are positioned with the help

of the metal scales on each gantry

axis.

To determine the placement accu-

racy on SIPLACE machines, highly

precision glass components with

mounted structures are placed on

a dimensionally accurate glass

mapping plate. The results are sta-

tistically evaluated and presented

as a Gaussian standard distribu-

tion. In the case of the 6-Nozzle

Collect & Place Head at the

SIPLACE S-25 HM the placement

accuracy is ± 70 µm at a statistical

reliability of 4 sigma. If the accu-

racy value ± 70 µm is divided by

the sigma value 4, the result is the

standard deviation S of 1 sigma =

± 17.5 µm (as defined in “Scope

of Service and Delivery SIPLACE”).

A machine capability analysis is

conducted for each machine ac-

ceptance test.

Machine Criteria:

Placement Accuracy

Technical Data Gantry

Drive Brushless AC Temperature

Controlled Motor

Position measuring system

(X/Y)

Linear scales

Resolution of X-/Y-axis 2.5 µm

Speed of X-axis max. 2.5 m/s

Speed of Y-axis max. 2.5 m/s

Placement Accuracy see table on page 6

Standard Deviation - dpm

-4

-3

-2

2700 dpm

60 dpm

P Point o

lection

Description

In addition to correct positioning,

placement reliability is important.

On the SIPLACE S-25 HM this is

ensured through a number of con-

trol functions, such as vacuum

checks and component vision

testing during the placement se-

quence.

Out of tolerance components are

rejected, placed on the repair list

and automatically processed dur-

ing a repair cycle. An offset in the

position of the PCB relative to the

conveyor system (PCB vision) and

an offset of the X-axis, Y-axis or ro-

tation of the component relative to

the midpoint of the nozzle (com-

ponent vision) trigger an immedi-

ate correction to ensure placement

accuracy.

Since the PCB is fixed, the com-

ponents remain in the exact posi-

tion they are placed. The stationary

component table ensures a pre-

cise pick up. Options, such as the

component bar code scanner, can

be added to further enhance reli-

ability.

Placement errors

Placement errorsPlacement errors

Placement errors

Errors that occur after the compo-

nent has been placed on the PCB.

They include:

§ Component is missed on PCB

§ Too many components on PCB

§ Components not placed prop-

erly on PCB

§ Components placed while

standing on edge

Machine Criteria:

Placement Reliability

Placement Principle of SIPLACE S-25

➀ 6-Nozzle or 12-Nozzle

Collect & Place Head

➁ X-/Y-Gantry System

➂ Fixed Component Supply

➃ Fixed PCB