Specification-SIPLACE-S25HM-eng - 第4页

2 SIPLACE So ftware Archit ecture 32 SIPLACE Pro Technical Data 33 Signal In terfaces Connection s Dimension s and Set-Up Condition s Transporting and Commi ssioning Possible Mac hine Configuration 38 High Speed SMD Plac…

Subject to change

without notice.

Edition 3

1202-S-25-600-e

Order No

E80002-P104-A409-X-7600

This specification is valid both for

SIPLACE S-25 HM (standard) and

SIPLACE S-25 HM (2) (= machine

label). In case of differences tech-

nical data of SIPLACE S-25 HM (2)

are marked with “Type 2”.

Machine Description 3

Line Design 4

Placement Heads 5

Head Modularity

Placement Accuracy

Component Range

12-Nozzle Collect & Place Head for High Speed

Component Placement

6-Nozzle Collect & Place Head for High-Speed Large

Component Placement

Nozzle Changer

PCB Conveyor 11

Single Conveyor

Dual Conveyor

Ceramic Substrate Centering (Option)

PCB Bar Code for Production-Controlled Manufacturing

(Option)

Component Supply 16

Changeover Table

Tape Feeder

Bulk Case Feeder

Stick Magazine Feeder

Guard for Feeder Locations

Matrix Tray Changer (Option)

Surf Tape Feeder for Bare Dies

Component Bar Code Scanner for Set-Up and Refill Check

(Option)

SIPLACE External Set-Up Station (Option)

Vision Sensor Technology 24

PCB Vision Module

PCB Position Recognition

Bad Board Recognition

Position Recognition of Feeder

Algorithms to determine the X-/Y-Position and the Rotation

Angle of Components

Standard Component Vision Modules for 12- and 6-Nozzle

Collect & Place Head

DCA-Vision Module for 12- and 6-Nozzle Collect & Place Head

(Option)

Machine Criteria 29

Placement Accuracy

Placement Reliability

Mapping (Option)

High Speed SMD Placement System

SIPLACE S-25 HM

SIPLACE Software Architecture 32

SIPLACE Pro

Technical Data 33

Signal Interfaces

Connections

Dimensions and Set-Up Conditions

Transporting and Commissioning

Possible Machine Configuration 38

High Speed SMD Placement System

SIPLACE S-25 HM

Description

The high-speed SMD placement

system SIPLACE S-25 HM com-

bines high placement speed with

flexibility and accuracy. In contrast

to classic chipshooters, a Collect

& Place procedure is applied here.

SIPLACE S-25 HM placement ma-

chines are equipped with two X-/Y-

main gantries. Each gantry featu-

res a star-shaped Collect & Place

placement head with either 12

or 6 nozzles.

The placement heads alternately

pick up components from the sta-

tionary component feeder and

place components on the PCB

which is also motionless. This has

distinct advantages:

§ Component tapes of all sizes

can be replenished by splicing a

new reel of components to the

end of a depleting reel. This eli-

minates machine stoppage due

to component replenishment.

§ Stationary, vibration-free feed-

ers ensure a reliable pick-up of

even the smallest components

(e.g., 0201 and 0402 chips).

§ Thanks to the flexible Collect

& Place Heads – whose ideal

nozzle set-up is automatically

specified – the travel can be

minimized and the sequence of

placement optimally adjusted.

§ Populating a stationary PCB

also prevents components from

shifting during placement.

Speed coupled with economic ef-

ficiency and set-up reliability is the

SIPLACE S-25 HM recipe for suc-

cess. The first components are al-

ready being picked up while the

PCB is being moved in. While one

Collect & Place Head is placing

components, the other one is

picking components up.

The product capability is enhanced

by optional add-on features such

as component bar code scanner,

automatic nozzle changer or

changeover tables which can be

set up outside the machine and

exchanged in a matter of minutes.

§ Additional changeover tables

enables the reduction of job set-

up time increasing machine

utilisation.

§ Dual Conveyor eliminates the

non-productive PCB loading

times thus increasing machines

operating efficiency.

§ Automatic nozzle changers for

both changeover and storage of

nozzles.

§ PCB Barcode Reader used for

product controlled production

changeover.

§ Component Bar Code Scanner

used for feeder set-up verifica-

tion.

§ To achive the best placement

quality we recommend to order

an 0201 enhance kit.

§ Ceramic Substrat Centering

§ Matrix Tray Changer (MTC) for

high speed IC-mounting

Machine Description

Technical Data

Type of placement head 12-Nozzle Collect & Place Head and/or

6-Nozzle Collect & Place Head

Number of gantries 2

Benchmark placement rate

12/12 25,000 cph

6/12 18,000 cph

6/6 17,000 cph

Component Range 0.6 x 0.3 mm

(0201) to 32 x 32 mm

Max. placement accuracy

(at 4 sigma)

90 µm (12-Nozzle C & P Head)

70/80 µm (6-Nozzle C & P Head)

PCB dimensions (L x W)

Single conveyor

Dual conveyor

50 x 50 mm

to 508 x 460 mm

2" x 2" to 20" x 18"

(optional up to 610 mm length)

50 x 50 mm

to 460 x 216 mm

2" x 2" to 18" x 8.5"

(optional up to 610 mm length)

Feeding capacity 118 tracks, 8 mm tape

Component table Quick changeover table with integrated wheels,

reel holder and scrap bin, SIPLACE MTC

Types of Feeder modules Tapes, Bulk Cases, Stick Magazines, Surftape

feeders, application-specific OEM feeders

Operating system Microsoft Windows / RMOS

Power 2 kW

Compr. air requirements 5.5 - 10 bar, 400 Nl/min, tube ½"

Vacuum pump (Option) 5.5 - 10 bar, 200 Nl/min, tube ½"

a) As defined in “Scope of Service and Delivery SIPLACE”.