SIPLACE DX1DX2-Spec-设备性能参数-EN-DMS - 第13页

13 SIPLACE Placement Heads Overview Collect & Place principle The SIPLACE SpeedStar and the SIPLACE 12 seg- ment C&P operat e according to the Collect & Plac e princi- ple i.e. one cycle includes pickup or &q…

Machine Performance

Placement head types SIPLACE SpeedStar (C&P20)

SIPLACE 12 segment Collect&Place (C&P12)

SIPLACE TwinStar (TH)

Placement performance

The placement performance is influenced by the different head combinations and head positions, plus the con-

veyor configurations. Individual options and customized applications also influence the placement performance.

On request, SIPLACE can calculate the actual performance of your product on your machine configuration.

IPC value [comp./h]

In line with the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting

Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the condi-

tions specified in the SIPLACE scope of service and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most favorable conditions for each machine type

and setting, and corresponds to the theoretical conditions normally used in the industry.

Placement machine

SIPLACE DX2

Placement area IPC value Benchmark value Theoretical value

C&P20 / C&P20 48,000 60,000 67,750

C&P20/C&P12 31,000 43,000 53,000

C&P12/C&P12 25,500 31,000 41,000

TH/C&P12 16,500 18,500 25,000

Placement machine

SIPLACE DX1

Placement area IPC value Benchmark value Theoretical value

C&P20 24,000 30,000 33,875

C&P12 14,000 16,000 21,000

TH 5,100 5,500 6,500

SIPLACE Placement Heads

Overview

Collect&Place principle

The SIPLACE SpeedStar

and the SIPLACE 12 seg-

ment C&P operate according

to the Collect&Place princi-

ple i.e. one cycle includes

pickup or "collection" of 20 or

12 components, their optical

centering on the board and

their rotation into the

required placement angle

and position. They are then

placed gently and accurately

onto the PCB. This principle

is particularly suitable for

high-speed placement of

standard components.

Pick&Place principle

The high precision SIPLACE

TwinStar, which consists of

two Pick& Place modules of

identical design, coupled to

one another, functions

according to the Pick&Place

principle. Two components

are picked up by the place-

ment head, optically cen-

tered on the way to the

placement position and

rotated into the necessary

placement angle.

This principle is ideally suit-

able for fast and precise

placement of special compo-

nents in the fine pitch or

super fine pitch field, plus

complex and heavy compo-

nents which may need grip-

pers.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force measurement

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

SIPLACE Placement Heads

Standard Functions / Options

SIPLACE SpeedStar (C&P20) SIPLACE 12 segment Collect&Place head

(C&P12)

Standard-

functions

High-resolution camera, vacuum

sensor, force measurement,

component sensor, integrated

turning station per segment,

PCB warpage check, individual

image of each component

Standard-

functions

High-resolution camera,

vacuum sensor, force

measurement, compo-

nent sensor, integrated

turning station per seg-

ment, PCB warpage

check, individual image

of each component

Options Nozzle changer, special nozzles Options Nozzle changer, special

nozzles, high-resolution

head camera for 01005

components

SIPLACE TwinStar (TH)

Standard-

functions

Stationary fine pitch camera,

vacuum sensor, force measure-

ment, nozzle changer, PCB war-

page check, individual image of

each component

Options Stationary flip chip camera, spe-

cial nozzles, grippers