SIPLACE DX1DX2-Spec-设备性能参数-EN-DMS - 第14页
14 SIPLACE Placement Heads Standard Functions / Options SIPLACE SpeedStar (C&P20) SIPLACE 12 segment Collect & Place head (C&P12) S tandard- functions High-resolution camera, vacuum sensor , force measurement…
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SIPLACE Placement Heads
Overview
Collect&Place principle
The SIPLACE SpeedStar
and the SIPLACE 12 seg-
ment C&P operate according
to the Collect&Place princi-
ple i.e. one cycle includes
pickup or "collection" of 20 or
12 components, their optical
centering on the board and
their rotation into the
required placement angle
and position. They are then
placed gently and accurately
onto the PCB. This principle
is particularly suitable for
high-speed placement of
standard components.
Pick&Place principle
The high precision SIPLACE
TwinStar, which consists of
two Pick& Place modules of
identical design, coupled to
one another, functions
according to the Pick&Place
principle. Two components
are picked up by the place-
ment head, optically cen-
tered on the way to the
placement position and
rotated into the necessary
placement angle.
This principle is ideally suit-
able for fast and precise
placement of special compo-
nents in the fine pitch or
super fine pitch field, plus
complex and heavy compo-
nents which may need grip-
pers.
Control and self-learning
functions
The reliability of the
SIPLACE placement heads
can be enhanced even fur-
ther with various checking
and self-learning functions.
• Component sensor
Checks the presence of
the components on the
nozzle before the pickup
and placement process
• Digital camera
Checks the position of
each component on the
nozzle. This check is per-
formed in a single step,
with no extra time involved
but with optimum scan-
ning of each individual
component.
• Force measurement
Monitors the prescribed
component set-down
force.
The sensor stop proce-
dure enables compensa-
tion of height differences
during pickup and PCB
warpage during place-
ment.
• Vacuum sensor
Checks whether the com-
ponent was correctly
picked up or placed.
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SIPLACE Placement Heads
Standard Functions / Options
SIPLACE SpeedStar (C&P20) SIPLACE 12 segment Collect&Place head
(C&P12)
Standard-
functions
High-resolution camera, vacuum
sensor, force measurement,
component sensor, integrated
turning station per segment,
PCB warpage check, individual
image of each component
Standard-
functions
High-resolution camera,
vacuum sensor, force
measurement, compo-
nent sensor, integrated
turning station per seg-
ment, PCB warpage
check, individual image
of each component
Options Nozzle changer, special nozzles Options Nozzle changer, special
nozzles, high-resolution
head camera for 01005
components
SIPLACE TwinStar (TH)
Standard-
functions
Stationary fine pitch camera,
vacuum sensor, force measure-
ment, nozzle changer, PCB war-
page check, individual image of
each component
Options Stationary flip chip camera, spe-
cial nozzles, grippers
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SIPLACE Placement Heads
SIPLACE SpeedStar (C&P20)
SIPLACE SpeedStar
component camera type 23
(C&P20)
Component range
a
a) Please note that the placeable component range is also affected by the pad geometry, the customer-
specific standards, the component packaging tolerances and the component tolerances.
01005 to 2220, Melf,
SOT, SOD
Component spec.
max. height
min. lead pitch
min. lead width
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
4 mm
0.25 mm
0.1 mm
0.4 mm
0.2 mm
0.4 mm x 0.2 mm
6 mm x 6 mm
1 g
Programmable set-down
force
1.5 N - 4.5 N
Nozzle types 10xx, 11xx, 12xx
X/Y accuracy
b
b) Accuracy values measured in accordance with vendor-neutral IPC standard.
± 41 µm/3
± 55 µm/4
Angular accuracy ± 0.5° / 3
± 0.7° / 4