Specification SIPLACE CA-Series2014版

SIPLACE CA-Series Specification from SC 708.0, 12/2014 Edition High volume SMD, Flip Chip and Die Bonding

SIPLACE CA-Series

Specification from SC 708.0, 12/2014 Edition

High volume SMD, Flip Chip and Die Bonding

SIPLACE CA-Series

Content

Overview of Technical Data 5

Maximum Values 5

Machine Description 6

Overview 6

SIPLACE Wafer System 7

Machine Description 8

Placement Head Configuration 8

Technical Data - SWS 10

Line Concept 11

Placement Heads 12

Overview 12

Standard Functions / Options 13

SIPLACE SpeedStar (C&P20 M) 14

SIPLACE MultiStar (CPP) 15

SIPLACE TwinStar (TH) 17

Nozzle Changers 18

Technical Data 19

PCB Conveyor 20

Single Conveyor 20

Technical Data for the Single Conveyor 21

Flexible Dual Conveyor 22

Technical Data for the Dual Conveyor 23

PCB Warpage 24

Sample Configuration 26

Component Feeding 27

SIPLACE X-Series Component Trolley 27

SIPLACE Wafer System 28

Technical Data 29

X Tape Feeder Modules 31

Alternative SIPLACE Feeder Modules 32

Dummy Feeder Modules 33

Vision Sensor Technology 34

PCB Position Recognition 34

Bad Board Recognition 35

03015/01005 Placement 36

SIPLACE Software Suite 37

General 37

Overview 38