Specification SIPLACE CA-Series2014版 - 第12页

12 Placement Heads Overview Head modularity The SIPLACE placement machines are dis tinguished by maximum flexibility in the production pr ocess. This flexibility is in part due to the head modu larity of the plac e- ment…

Line Concept

Description

The SIPLACE concept is dis-

tinguished by its flexibility,

modularity, compact design

and high performance. It al-

lows a production line to be

individually configured from

identical and different mod-

ules. If the production re-

quirements change, the indi-

vidual placement machines

are so compact that they can

be recombined quickly and

easily.

Operated together with the

SIPLACE X series, the SI-

PLACE CA machine allows

you to individually configure

your production line with both

identical and differing mod-

ules. If the production re-

quirements change, the indi-

vidual placement machines

are so compact and can be

combined with such flexibility

that they can be recombined

quickly and easily.

The SIPLACE CA family has

the optimum placement sys-

tem for each individual per-

formance requirement.

System SIPLACE Placement lines

Placement

module

SIPLACE CA4, SIPLACE X-Series,

SIPLACE SX1/SX2, SX4

Peripheral

modules

Input/output stations, screen printer, sol-

dering furnace, inspection places etc.

available from SIPLACE

PCB conveyor Single and dual conveyor with auto-

matic width adjustment unit;

Dual conveyor in single conveyor mode

"Wide board" mode with "long board"

option and a combination of these for

both PCB conveyors. The maximum

PCB width is determined by the module

with the smallest PCB conveyor width.

Space required 6.7 m² per CA4 module

Placement Heads

Overview

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

Collect&Place principle

The SIPLACE SpeedStar

operates according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 compo-

nents, their optical centering

on the way to the board and

their rotation into the

required placement angle.

Lastly, the component is set

down gently and accurately

on the board. This principle is

particularly suitable for high-

speed placement of standard

components.

Pick&Place principle

The high precision SIPLACE

TwinStar, which consists of

two Pick& Place modules of

identical design, coupled to

one another, functions

according to the Pick&Place

principle. Two components

are picked up by the place-

ment head, optically cen-

tered on the way to the

placement position and

rotated into the necessary

placement angle. This princi-

ple is ideally suitable for fast

and precise placement of

special components in the

fine pitch or super fine pitch

field, plus complex and

heavy components which

may need grippers.

Mixed mode

The new SIPLACE MultiStar

uses both the Collect&Place

and the Pick&Place princi-

ple.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force. The sensor stop

procedure enables com-

pensation of height differ-

ences during pickup and

PCB warpage during

placement.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Placement Heads

Standard Functions / Options

SIPLACE SpeedStar (C&P20 M) SIPLACE MultiStar (CPP)

Standard-

functions

High-resolution camera, vacuum

sensor, force measurement,

component sensor, integrated

turning station per segment,

PCB warpage check, individual

image of each component

Standard-

functions

High-resolution camera, vac-

uum sensor, force measure-

ment, component sensor,

integrated turning station per

segment, PCB warpage check,

individual image of each com-

ponent

Options Nozzle changer, special nozzles Options Nozzle changer, special noz-

zles, stationary fine-pitch cam-

era

SIPLACE TwinStar (TH)

Standard-

functions

Stationary fine pitch camera,

vacuum sensor, force measure-

ment, nozzle changer, PCB

warpage check, individual image

of each component

Options Stationary flip chip camera, spe-

cial nozzles, grippers