Specification SIPLACE CA-Series2014版 - 第36页

36 03015/01005 Placement In its standard version, the SIPLACE X-Series is designed for placement of 03015 (0.3 mm x 0.15 mm) and 01005 compone nts (0.4 mm x 0.2 mm). The SIPLACE component library already contai ns the co…

Vision Sensor Technology

PCB Position Recognition

Bad Board Recognition

Ink spot criteria

Methods • Synthetic fiducial recognition method

• Mean grayscale value

• Histogram method

• Template matching

Shapes and sizes of fiducials/structures for

synthetic fiducials

Other methods

For dimensions of synthetic fiducials, see page

Min. 0.3 mm

Max. 5 mm

Masking material Good coverage

Recognition time Depends on the method: 20 ms - 200s

Description

In the cluster technology

each subpanel is assigned

an ink spot. If this is present

during the measurement via

the PCB vision module, the

corresponding subpanel is

populated. This function

helps prevent unnecessary

costs caused by placement

of defective panels.

Technical data board position recognition

PCB fiducials

Local fiducials

Library memory f. recognition of

bad panels

up to 3 (subpanels and multiple panels)

up to 6 for the Long board option (Optional PCB fiducials

are output by the optimization.)

up to 2 per PCB (may be of different type)

up to 255 fiducial types per subpanel

Image analysis Edge detection method (singular feature) based on gray-

scale values

Illumination mode Front lighting

Fiducial recognition time 0.1 s

Field of vision 5.78 mm x 5.78 mm

Virtual ink spot handler (optional from station software 705)

The virtual ink spot handler enables you to import ink spots from an external system. These ink

spots can then be assigned to the relevant board.

03015/01005 Placement

In its standard version, the

SIPLACE X-Series is

designed for placement of

03015 (0.3 mm x 0.15 mm)

and 01005 components (0.4

mm x 0.2 mm).

The SIPLACE component

library already contains the

contours and dimensions of

03015 or 01005 compo-

nents. Specially developed

component nozzles of type

1005 are also available for

the SIPLACE CA-Series.

These are adjusted to the

shape and size of the 03015

or 01005 components and

have - as with all other

SIPLACE nozzles - a highly

wear-proof ceramic tip and

flexible nozzle seat. This

guarantees maximum preci-

sion and process reliability.

Optimized pickup is guaran-

teed by the ideal feeding

conditions in the SIPLACE X

feeder module. The smaller

the elements to be picked up,

the more accurate the pickup

needs to be.

Pickup is performed contact-

free to compensate minor

inaccuracies e.g. from com-

ponent or pocket tolerances

and to prevent mechanical

damage to the components.

The design of the SIPLACE

X feeder modules takes this

problem into account: new

motors and the reduced use

of fine mechanics help. Small

components can be placed

without performance loss

with minimum pitch and irre-

spective of the larger compo-

nents which are next to the

03015 or 01005 component.

This equates to true 03015

or 01005 capability. As a

rule with 03015 or 01005

placement, a finely tuned

overall process is the basic

requirement if you want to

achieve excellent results.

All the process parameters

must be optimized. The

SIPLACE team will be

pleased to advise you on

how to do this.

03015/01005 measurement

results and ambient condi-

tions

As the dpm values and

pickup rates for 03015 or

01005 placement depend

greatly on the respective

measuring conditions, it is

not advisable to specify

these without considering the

corresponding ambient con-

ditions.

The following table shows typical values for 01005 placement,

which can be achieved with a SIPLACE CA 4, provided the rel-

evant underlying conditions are fulfilled:

Machine type SIPLACE CA4

Placement head SpeedStar with component camera

type 41

Nozzle type 1005 (SpeedStar)

Feeder module type 4mm SIPLACE X feeder module

8mm SIPLACE X feeder module

2x8mm SIPLACE X feeder module

Station software From 708.0

SIPLACE Pro From 12.0

Pickup rate ≥ 99.97%

Dpm rate ≤ 5

Pad width ≥ 200 µm

Pitch ≥ 100 µm

Components (L x W x H) 400 µm x 200 µm x 200 µm (±20 µm)

Number of pixels for a

01005 component

275

Solder paste type 5

Template thickness 60 µm

SIPLACE Software Suite

General

SIPLACE provides compre-

hensive solutions based on

modular software tools for

SMT machines, lines and

production management: the

SIPLACE Software Suite.

Product definition, optimi-

zation and line control

Fast, fault-free introduction

of products and optimum uti-

lization of production lines

are essential to maximize

production output. The pro-

grams from the SIPLACE

Software Suite allow you to

easily program products,

fine-tune the programs you

have created and then find

the balance for them within

your SMT production lines.

Production monitoring &

process control

To achieve the production

targets that are set, it is

important to constantly moni-

tor and check the production

facilities. The SIPLACE Soft-

ware Suite contains monitor-

ing products tailored to suit

the user group. These signal

immediately if limits are

exceeded on the machine or

the production line.

Setup verification &

traceability

Setup errors lead to series

errors. The user-friendly

SIPLACE software programs

help you to avoid such

errors, and thus ensure high

quality in your electronics

production.

The benefits of the

SIPLACE Software Suite at

a glance:

• User-friendly

• Simple operation

• Fast programming and

error detection

• Reduces changeover

times and stoppages

• Ensures optimum utiliza-

tion of your production

line's productivity

• Real-time information

from the production area

• Incredibly fast distribution

of information

• Optimum use of resources

• Timely notification when

production materials need

to be re-ordered

• Coordination of mainte-

nance