Specification SIPLACE CA-Series2014版 - 第61页
61 Option List SWS Available options SWS Notes SIPLACE wafer transfer system (table: 1,3) X SIPLACE wafer transfer system (table: 2,4) X Adapter FF070 & FF 090 on standard frame FF 108 X Adapter hoop ring 4" on …
60
Option List
Placement Machine
Available options CA4 Notes
PCB alignment, single conveyor X
PCB alignment, dual conveyor X
Long board X
1D PCB barcode scanner X
2D PCB barcode scanner X
PCB barcode scanner assembly kit X
SIPLACE SpeedStar C&P 20 M X
SIPLACE MultiStar CPP X
SIPLACE TwinStar X
Magnetic pin support X
03015/01005 components X
Component camera, type 30 X Only MultiStar CPP
Component camera, type 41 X Only SpeedStar C&P20 M
Stationary component camera, type 33 (fine
pitch)
X Only MultiStar CPP and TwinStar
With restrictions (see Configuration Over-
view on page 62.
Stationary component camera, type 25 (flip
chip)
X Only TwinStar
With restrictions (see Configuration Over-
view on page 62
Component camera, type 34 X
High Force Head X
Vision teach place X
Nozzle Changers X
Sensor for the component reject bin X
SIPLACE X-Series Component Trolley X
Splice point recognition for X feeder mod-
ules
X
Tray holder for SIPLACE X X Only SpeedStar C&P20 M
Support for an additional tape reel
SIPLACE X-series
X
X-Series feeder module adapter X
Linear Dipping Unit (LDU-X) X
Feeder module cover flap X
110/208 V conversion kit X
Vacuum pump X
Vacuum pump connection kit X
Embedded Wafer Level Ballgrid Array
(eWLB)
X On request
Wafer Level Fan Out (WLFO) - on request Incl. Chuck and Chiller on request
MTC Without stationary camera at location 2 and
location 4 on request
61
Option List
SWS
Available options SWS Notes
SIPLACE wafer transfer system (table: 1,3)
X
SIPLACE wafer transfer system (table: 2,4)
X
Adapter FF070 & FF 090 on standard frame FF 108
X
Adapter hoop ring 4" on FF 108
X
Adapter hoop ring 6" on FF 108
X
Adapter hoop ring 8" on FF 108
X
SIPLACE wafer expansion unit for 8" and 12" wafers
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 8" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 1,3)
X
Wafer holder 12" for standard frame in combination with hoop
ring (table.: 2,4)
X
Wafer holder 8" for standard frame (table: 1,3)
X
Wafer holder 8" for standard frame (table: 2,4)
X
Wafer holder 12" for standard frame (table: 1,3)
X
Wafer holder 12" for standard frame (table: 2,4)
X
Multi needle eject system 3.5 x 3.5 mm min. needle pitch
X
Multi needle eject system 2.0 x 2.0 mm min. needle pitch
X
Small Die Eject System On request
Component handling standard, field of view: 12 mm x 12 mm
X
Component handling small die, field of view: 5 x 5mm,
eject tool small die
On request
SIPLACE Linear Dipping Unit (LDU-X)
X
Integrated into the SWS:
Only one LDU per location.
Standard flux pot for LDU-X
X
SIPLACE CA LDU cavity plates, 20 - 400µm in 10µm steps
X
SIPLACE WS die attach unit
X
Nozzle changer C&P 20
X
One bank in row 2
Row 1 on request
62
Configuration Overview
Head configurations
Placement head
types
SIPLACE SpeedStar (C&P20 M)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
a
a) Not with SWS
Placement area 1 Placement area 2
C&P20 M C&P20 M C&P20 M C&P20 M
C&P20 M C&P20 M CPP CPP
CPP CPP CPP CPP
C&P20 M C&P20 M CPP TH
CPP CPP CPP TH
Configurations/options C&P20 M CPP
a
a) MultiStar CPP only in high assembly position
TwinStar
SWS Flip-Chip X X
b
b) Collect&Place mode only
--
SWS Die Attach X X
b
--
LDU on X table X X X
LDU on SWS X X
Nozzle Changers X
c
c) 6 magazines with 72 nozzle garages
XX
d
d) Max. 12 magazines for max. 24 nozzle garages, each with 2 nozzle holders at location 1 and 3
Max. 10 magazines for max. 20 nozzle garages, each with 2 nozzle holders at location 2 and 4
Stationary camera, type 25 (flip chip) -- -- X
e
e) Only at locations 1 and 3 and not with SWS
Component camera, type 30 -- X --
Component camera, type 41 X -- --
Stationary camera, type 33 (fine pitch) -- X
e
X
e
Component camera, type 34 X X X