Specification SIPLACE CA-Series2014版 - 第7页

7 Machine Description SIPLACE Wafer System Description The SIPLACE W afer System (SWS) makes the compo- nents available to the place - ment head, directly from the wafer . The SWS therefore extends the component spectrum…

Machine Description

Overview

General

The SIPLACE CA (Chip As-

sembly) platform can place

bare dies directly from the

wafer, using the die attach or

flip chip process. This pro-

vides additional support for

the SMT placement options

available with SIPLACE X

series machines. The

SIPLACE CA can either be

used only for bare die or SMT

placement or in single pass

mode. In this case, both bare

dies and SMT components

can be placed during the

same process. Users benefit

from a combination of great-

er process flexibility and

higher placement speeds

which is unique to the elec-

tronics production industry.

The SIPLACE CA-Series is

available with 4 gantries.

The SIPLACE CA4 can be

configured with up to 4 SWSs

IPLACE Wafer System).

The SWS provides the place-

ment head with components

(dies) directly from the wafer

(max. 12“).

Placement Machine

The placement machine

uses the Collect&Place

method for high-speed

placement of standard com-

ponents.

The moving head picks the

components up from the

waiting SWS and places

them on the waiting printed

circuit board. This proven

SIPLACE principle has many

advantages:

• No downtime due to refill-

ing or splicing

• Reliable pickup of even

the smallest components

• No shifting of the compo-

nents on the circuit board

• Minimized travel range

High flexibility, economic effi-

ciency and reliable setups

are the guarantee for the

high level of productivity in

the SIPLACE CA series

placement systems.

Minimum down times

increase utilization and thus

help to increase productivity.

Even the very small 03015/

01005 components can be

processed with the

SIPLACE CA-Series.

SIPLACE Wafer System

SWS

The integration of the

SIPLACE Wafer Systems

(SWS) in the SIPLACE CA

enables you to place dies

directly from the wafer, using

the standard SMT placement

procedure. This unique

placement platform supports

both the flip chip and the die

attach process.

• Processes supported:

Flip chip, die attach (chip

on board), SMT

• Hoopring handling

• Horizontal wafer system

• Automatic wafer change

• Linear Dipping Unit

• Die attach unit

• Wafer map connection

(e.g. ALPS)

• Multi-die capability

Machine Description

SIPLACE Wafer System

Description

The SIPLACE Wafer System

(SWS) makes the compo-

nents available to the place-

ment head, directly from the

wafer. The SWS therefore

extends the component

spectrum of the established

SIPLACE X machines, by

enabling placement of bare

dies from wafers.

The wafers are supplied fully

automatically out of the wafer

cassette and the dies inside

can be processed in the

established placement pro-

cedures.

Flip chip process - func-

tion

The wafer is fully automati-

cally pulled out of the wafer

cassette and is then trans-

ported to the wafer table. The

wafer table positions the die

above the ejection system

that releases the die from the

wafer foil. After this release

procedure, the flip unit noz-

zle takes the die, rotates it by

180° and makes it available

to the placement head for

pickup.

Options

The process spectrum is

supplemented by the follow-

ing options:

– Die attach unit:

The die attach unit takes

the die from the flip unit

nozzle and turns it, so that

it has the same top-bottom

orientation on the board

as it had on the wafer.

– Linear Dipping Unit

The Linear Dipping Unit

distributes precise layers

of flux for the flip chip pro-

cess. After taking over

from the flip unit, the

placement head dips the

die into the flux layer.

Machine Description

Placement Head Configuration

CPP_H = MultiStar CPP only in high assembly position

Placement head types

SIPLACE SpeedStar (C&P20 M)

SIPLACE MultiStar (CPP)

SIPLACE TwinStar (TH)

Placement performance

The placement performance is affected by the different head combinations and positions, plus the conveyor

configuration. The various different options and customized applications also influence the placement per-

formance. On request, SIPLACE can calculate the actual performance of your machine configuration for

your individual product.

SIPLACE Benchmark value [components/h]

The SIPLACE benchmark value is established during the machine acceptance procedure and corresponds

to the SIPLACE scope of service and supply.

SIPLACE CA4 placement machine

a) Values only valid in conjunction with 4 X tables

See the note above for information about defining placement performance values.

Number of gantries 4

Placement area 1 Placement area 2 Benchmark value Option

C&P20 M / C&P20 M C&P20 M / C&P20 M 80,000

Without High Precision Flag

C&P20 M / C&P20 M C&P20 M / C&P20 M 64,000 With High Precision Flag

C&P20 M / C&P20 M CPP_H / CPP_H 76,000 Without High Precision Flag

C&P20 M / C&P20 M CPP_H / CPP_H 67,000 With High Precision Flag on

C&P20 M

CPP_H / CPP_H CPP_H / CPP_H 72,000 --

C&P20 M / C&P20 M CPP_H / TH 63,000 Without High Precision Flag

C&P20 M / C&P20 M CPP_H / TH 54,000 With High Precision Flag on

C&P20 M

CPP_H / CPP_H CPP_H / TH 59,000 --