Specification SIPLACE CA-Series2014版 - 第9页

9 Machine Description Technical Data - SMT Number of gan- tries CA4: 4 gantries Component feed- ing – SIPLACE CA4: Up to four SWS po ssible in placement area 1 and 2 – Component trol ley (X-Series) (with tape reel mount …

Machine Description

Placement Head Configuration

CPP_H = MultiStar CPP only in high assembly position

Placement head types

SIPLACE SpeedStar (C&P20 M)

SIPLACE MultiStar (CPP)

SIPLACE TwinStar (TH)

Placement performance

The placement performance is affected by the different head combinations and positions, plus the conveyor

configuration. The various different options and customized applications also influence the placement per-

formance. On request, SIPLACE can calculate the actual performance of your machine configuration for

your individual product.

SIPLACE Benchmark value [components/h]

The SIPLACE benchmark value is established during the machine acceptance procedure and corresponds

to the SIPLACE scope of service and supply.

SIPLACE CA4 placement machine

a) Values only valid in conjunction with 4 X tables

See the note above for information about defining placement performance values.

Number of gantries 4

Placement area 1 Placement area 2 Benchmark value Option

C&P20 M / C&P20 M C&P20 M / C&P20 M 80,000

Without High Precision Flag

C&P20 M / C&P20 M C&P20 M / C&P20 M 64,000 With High Precision Flag

C&P20 M / C&P20 M CPP_H / CPP_H 76,000 Without High Precision Flag

C&P20 M / C&P20 M CPP_H / CPP_H 67,000 With High Precision Flag on

C&P20 M

CPP_H / CPP_H CPP_H / CPP_H 72,000 --

C&P20 M / C&P20 M CPP_H / TH 63,000 Without High Precision Flag

C&P20 M / C&P20 M CPP_H / TH 54,000 With High Precision Flag on

C&P20 M

CPP_H / CPP_H CPP_H / TH 59,000 --

Machine Description

Technical Data - SMT

Number of gan-

tries

CA4: 4 gantries

Component feed-

ing

– SIPLACE CA4: Up to four SWS possible in placement area 1 and 2

– Component trolley (X-Series)

(with tape reel mount and integrated waste tape bin,

40 locations à 8 mm X feeder module per component trolley)

– Matrix Tray Changer (on request)

Feeder module

types

– X-Series component trolley: Tapes, waffle pack trays

Supply capacity

(X-Series compo-

nent trolley)

160 tracks Width: 10.8 mm 4 mm X feeder modules

160 tracks Width: 10.8 mm 8 mm X feeder modules

160 tracks Width: 22.9 mm Smart Feeder 2x8 mm X

80 tracks Width: 22.6 mm Smart Feeder 12 mm X

52 tracks Width: 22.6 mm Smart Feeder 16 mm X

52 tracks Width: 34.4 mm 24 mm X feeder modules

40 tracks Width: 46.2 mm 32 mm X feeder modules

32 tracks Width: 58.0 mm 44 mm X feeder modules

24 tracks Width: 69.8 mm 56 mm X feeder modules

20 tracks Width 81.6 mm 72 mm X feeder modules

16 tracks Width: 105.2 mm 88 mm X feeder modules

Machine Description

Technical Data - SWS

Technical Data Flip Chip Die Attach

Minimum die thickness (silicium) - without com-

ponent sensor

50 µm 50 µm

Minimum die thickness (silicium) - with compo-

nent sensor

100 µm 100 µm

Minimum bump size 50 µm n/a

Minimum bump grid 100 µm n/a

SIPLACE Wafer System SWS Horizontal system, automatic wafer change, MCM

SWS wafer size 4" to 12"

4" / 6" with adapter on request

Wafer frame 12“/8“

6" on request

4" with adapter

Hoop /grip ring thickness Max. 3.5 mm

Wafer magazine

a) Depending on the wafer magazine, you may need to mechanically adjust the base plate for the wafer magazines.

Up to 12"

Die Ejection System Programmable ejection speed (synchronous and asynchronous)

Option: Linear Dipping Unit LDU Individually programmable speed

Flux viscosity 3,000 to 100,000 cPs

Accuracy of flux height ± 5 µm