Spec of AX-3 AX-5 June 2005 LR - 第4页
3.4 Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.4.1 Board traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.4.2 Batch traceability . . . . . . . .…
1.0 Introducing the AX Platform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.0 General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 AX-3 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 AX-5 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 AX Base . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Placement robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5 Placement head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6 Board alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.7 Component alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.7.1 Component laser . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.7.2 Vision alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8 Toolbits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.9 Toolbit exchange unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.10 User interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.11 Component feeding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.11.1 Tape feeding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.11.2 Bulk feeding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.11.3 Feeder trolleys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2.11.4 Feeder options. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.0 Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.1 Setup Verification System . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.2 Board Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.3 Barcode Triggered Changeover . . . . . . . . . . . . . . . . . . . . . . . . 23
Contents
Contents
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3.4 Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.4.1 Board traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.4.2 Batch traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.5 AX Data interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.6 Remote diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.7 CAD Conversion / Machine Program Creation (PPS-Pro) . . . . . . 25
4.0 Technical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
4.1 Configurable placement output . . . . . . . . . . . . . . . . . . . . . . . . 27
4.2 Placement specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4.3 Components and packaging . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.4 PCB specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.5 Installation requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.0 AX-3 / AX-5 System Tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Contents
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Contents
Assembléon's component pick-and-place platform definitely sets the standard for
the way electronics manufacturers in the medium to high volume throughput range
will be acquiring SMT production capacity over the next decade.
The new AX Platform anticipates the requirements of SMT manufacturers with a
unique True-modularity™ concept which delivers low-cost entry, product
changeovers in minutes, output reconfiguration right from 30k cph (IPC 9850), and
the lowest cost per placement in the market.
With CCD component alignment technology added to proven 'on the fly' laser
alignment for optimal chip placement, the AX platform can place a full range of
components. Its configuration is optimized for each new production batch without
the need for changing the machine.
The AX handles chips from 01005 up to IC packages, such as QFP, BGA and CSP,
with dimensions up to 45 x 45mm. Only for the most challenging components, just
add the AQ-2 in-line to place fragile flip-chip or snap-in connectors requiring high
placement force.
Built on 24 years of pick-and-place experience in modular manufacturing, the
A-series platform solution comprises three main placement systems - the AX-3,
AX-5 and the AQ-2 - for full application and component handling flexibility.
Compared to the traditional way of meeting production demand using high-capacity
machines, with the possibility of over- or under-capacity, the A-series concept uses
simple, self-contained placement robots that allow small output increments. This
unique and easy modularity, matching your investment to required capacity, is a
major breakthrough in the field of electronics assembly.
1 Introducing
the AX
Platform
Introducing the AX Platform
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